Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide

ID 814028
Date 6/07/2024
Public
Document Table of Contents

4. Thermal Design Considerations

The Agilex™ 7 FPGA is a multi-chip device, whose thermal engineering requires specific design-related steps to determine power and other thermal design parameters.
Details on the package construction, thermal design parameters, Compact Thermal Models, on-die digital thermal sensors (DTS), Temperature Sensing Diode (TSD), thermal design process are covered in the AN 944: Thermal Modeling for Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator . The Power and Thermal Calculator (PTC) and an alternate method of analyzing thermal design is also covered in the document.