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1. Introduction
2. Product Family Plan
3. Package Information
4. Thermal Design Considerations
5. Pin Connection Guidelines and Pinouts
6. Printed Circuit Board (PCB) Design
7. Signal Integrity Simulations
8. Validation
9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide
2.5.1. Agilex™ 7 F-Series Devices with F-Tiles
2.5.2. Agilex™ 7 F-Series Devices with E-Tile and P-Tiles
2.5.3. Agilex™ 7 I-Series Devices with F-Tiles
2.5.4. Agilex™ 7 I-Series Devices with F-Tiles and R-Tiles
2.5.5. Agilex™ 7 M-Series Devices with HBM2e
2.5.6. Agilex™ 7 M-Series Devices without HBM2e
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4. Thermal Design Considerations
The Agilex™ 7 FPGA is a multi-chip device, whose thermal engineering requires specific design-related steps to determine power and other thermal design parameters.
Details on the package construction, thermal design parameters, Compact Thermal Models, on-die digital thermal sensors (DTS), Temperature Sensing Diode (TSD), thermal design process are covered in the AN 944: Thermal Modeling for Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator . The Power and Thermal Calculator (PTC) and an alternate method of analyzing thermal design is also covered in the document.