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1. Introduction
2. Product Family Plan
3. Package Information
4. Thermal Design Considerations
5. Pin Connection Guidelines and Pinouts
6. Printed Circuit Board (PCB) Design
7. Signal Integrity Simulations
8. Validation
9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide
2.5.1. Agilex™ 7 F-Series Devices with F-Tiles
2.5.2. Agilex™ 7 F-Series Devices with E-Tile and P-Tiles
2.5.3. Agilex™ 7 I-Series Devices with F-Tiles
2.5.4. Agilex™ 7 I-Series Devices with F-Tiles and R-Tiles
2.5.5. Agilex™ 7 M-Series Devices with HBM2e
2.5.6. Agilex™ 7 M-Series Devices without HBM2e
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4.1. Power Estimation and Analysis Tools
Power consumption is a critical design consideration. When designing a PCB, you must determine the power consumption of the FPGA device to develop an accurate power budget, and to design the power supplies, voltage regulators, heat sink, and cooling system.
Two power estimation and analysis tools are supported for Agilex™ 7 devices:
- Intel® FPGA Power and Thermal Calculator (PTC)—estimates power supply and system thermal requirements before compiling the design, or anytime during the design phase.
- Quartus® Prime Power Analyzer (QPA)—estimates power consumption for a post-fit design.