Visible to Intel only — GUID: qxf1708280020897
Ixiasoft
1. Introduction
2. Product Family Plan
3. Package Information
4. Thermal Design Considerations
5. Pin Connection Guidelines and Pinouts
6. Printed Circuit Board (PCB) Design
7. Signal Integrity Simulations
8. Validation
9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide
2.5.1. Agilex™ 7 F-Series Devices with F-Tiles
2.5.2. Agilex™ 7 F-Series Devices with E-Tile and P-Tiles
2.5.3. Agilex™ 7 I-Series Devices with F-Tiles
2.5.4. Agilex™ 7 I-Series Devices with F-Tiles and R-Tiles
2.5.5. Agilex™ 7 M-Series Devices with HBM2e
2.5.6. Agilex™ 7 M-Series Devices without HBM2e
Visible to Intel only — GUID: qxf1708280020897
Ixiasoft
4.4. Remote Temperature Sensing using Temperature Sensing Diodes (TSDs)
The Intel FPGA temperature monitoring system allows you to use third-party integrated circuits to monitor the junction temperature (TJ). This external temperature monitoring system works even while the Intel FPGA is powered down or not configured. However, there are several things you must consider when you design the interface between the external chip and the Intel FPGA remote temperature sensing diodes (TSDs).