Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide

ID 814028
Date 6/07/2024
Public
Document Table of Contents

6.10.4. Checks

In addition to standard tool checks along the way, additional post layout-premanufacture checks may include:

  • Revisit power tree analysis now that all circuitry has been added to ensure selected regulators have the needed capacity. Also, check that all supplies have sufficient decoupling.
  • Revisit Power Integrity checks for voltage droop and current density issues (power plane necks or insufficient via count)
  • Review the HSSI (differential pair) traces for optimal layout and noise considerations.
  • Run post-layout Signal Integrity simulations.
  • Connector – review pinout and connector drawings to double check no flip or other connection problem has occurred. This is a common reported problem area.
  • Revisit thermal simulations - with the board layout complete, a 3D model is now fully known for air flow/cooling simulations.