Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide

ID 814028
Date 6/07/2024
Public
Document Table of Contents

4.3. Heat Sink

FPGAs appear in a wide variety of products and layout configurations; it can be difficult to find off-the-shelf heat sinks that meet all physical and performance requirements. Consequently, most applications require custom heat sinks to maximize performance.

Additional information on Attachment Force, Thermal Interface Material (TIM) and a discussion on Computational Fluid Dynamic (Models) is included in AN 944: Thermal Modeling for Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator.

Review the heat sink design for compatibility for all packages that are migration candidates. Height and Top Lid designs may vary and affect the heat sink capability.