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1. Introduction
2. Product Family Plan
3. Package Information
4. Thermal Design Considerations
5. Pin Connection Guidelines and Pinouts
6. Printed Circuit Board (PCB) Design
7. Signal Integrity Simulations
8. Validation
9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide
2.5.1. Agilex™ 7 F-Series Devices with F-Tiles
2.5.2. Agilex™ 7 F-Series Devices with E-Tile and P-Tiles
2.5.3. Agilex™ 7 I-Series Devices with F-Tiles
2.5.4. Agilex™ 7 I-Series Devices with F-Tiles and R-Tiles
2.5.5. Agilex™ 7 M-Series Devices with HBM2e
2.5.6. Agilex™ 7 M-Series Devices without HBM2e
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4.3. Heat Sink
FPGAs appear in a wide variety of products and layout configurations; it can be difficult to find off-the-shelf heat sinks that meet all physical and performance requirements. Consequently, most applications require custom heat sinks to maximize performance.
Additional information on Attachment Force, Thermal Interface Material (TIM) and a discussion on Computational Fluid Dynamic (Models) is included in AN 944: Thermal Modeling for Agilex™ FPGAs with the Intel® FPGA Power and Thermal Calculator.
Review the heat sink design for compatibility for all packages that are migration candidates. Height and Top Lid designs may vary and affect the heat sink capability.