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1. Introduction
2. Product Family Plan
3. Package Information
4. Thermal Design Considerations
5. Pin Connection Guidelines and Pinouts
6. Printed Circuit Board (PCB) Design
7. Signal Integrity Simulations
8. Validation
9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide
2.5.1. Agilex™ 7 F-Series Devices with F-Tiles
2.5.2. Agilex™ 7 F-Series Devices with E-Tile and P-Tiles
2.5.3. Agilex™ 7 I-Series Devices with F-Tiles
2.5.4. Agilex™ 7 I-Series Devices with F-Tiles and R-Tiles
2.5.5. Agilex™ 7 M-Series Devices with HBM2e
2.5.6. Agilex™ 7 M-Series Devices without HBM2e
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2.2. Part Number Decoder
The part number (ordering code) provides information about the:
- Family Signature
- Series
- Fabric Specification
- Density
- Package Code
- Tile Speed Grade
- Operating Temperature
- Core Speed/Power
- Optional suffix
Figure 1. Agilex™ 7 Part Number Decoder
If searching on Intel.com based on a partial part number, Altera recommends that you use a special search query to capture multiple formats of the part number. For example, for the following formats:
- AGF 027
- AGF 027R25A
- AGFA027
- AGFB027
This search query will capture all the variants—note commands, quotes, and asterisk:
@title=agf*027 OR @title="agf 027*"