Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide

ID 814028
Date 6/07/2024
Public
Document Table of Contents

3.1.2. Package Ball Coordinates

Package Ball Coordinates are table listings of the ball locations by pin providing the X and Y coordinates from the center origin in millimeters (mm). Top View (Live Bug) and Bottom View (Dead Bug) lists are provided. The data is used in conjunction with the package mechanical drawing (PMD) and the package printed circuit board (PCB) design guidelines to construct a computer aided design (CAD) tool-specific PCB footprint when needed. If creating a footprint for a specific layout tool, you must use the coordinates from the origin for each pad location. Do not set one position and base the others on the pad pitch as this may introduce a cumulative error based on resolution.

To view all available package ball coordinates, visit the Agilex™ 7 Product Support table.

Typically, the Top View orientation is used to construct the package footprint.

Note: Pin 1 orientation which may be rotated from the orientation shown in the PMD.

Example PCB Footprints for Cadence* Allegro* are also available from Intel for Agilex™ 7 devices.