Visible to Intel only — GUID: qzf1708067726514
Ixiasoft
Visible to Intel only — GUID: qzf1708067726514
Ixiasoft
3.1.4. Land Pattern PCB Design Recommendations (MAS)
BGA Package Ball interface recommendations are provided in the Manufacturing Advantage Services (MAS) documents. The MAS provides the PCB recommendations for the Package’s Land Pattern.
These are typically generated per device density and package offering. For example, for the "AGF 012 in 2340A (R24C) package".
The MAS documents have three sections:
- Section 1—provides details on the package attributes, land pattern definitions, and land pattern guidance.
- Section 2—covers manufacturing guidelines including SMT assembly process recommendations, SMT reflow pallet recommendations, post reflow cleaning information, SMT rework process recommendations, thermocouple locations for rework, thermal reflow profile, rework reflow profile recommendations, and SMT stencil information.
- Section 3—provides reference material.
In the land pattern guidance, information is provided on pad pattern, size, and solder resist opening (SRO). Corner pins also have unique recommendations to be aware of. Also—review the Package Mechanical Drawing for additional PCB requirements such as keep out zones.