Visible to Intel only — GUID: swr1708315272602
Ixiasoft
1. Introduction
2. Product Family Plan
3. Package Information
4. Thermal Design Considerations
5. Pin Connection Guidelines and Pinouts
6. Printed Circuit Board (PCB) Design
7. Signal Integrity Simulations
8. Validation
9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide
2.5.1. Agilex™ 7 F-Series Devices with F-Tiles
2.5.2. Agilex™ 7 F-Series Devices with E-Tile and P-Tiles
2.5.3. Agilex™ 7 I-Series Devices with F-Tiles
2.5.4. Agilex™ 7 I-Series Devices with F-Tiles and R-Tiles
2.5.5. Agilex™ 7 M-Series Devices with HBM2e
2.5.6. Agilex™ 7 M-Series Devices without HBM2e
Visible to Intel only — GUID: swr1708315272602
Ixiasoft
6.8. Development Kit Examples
Several different development kits are currently available featuring Agilex™ 7 devices. Development kits are available in different configurations and features for both FPGA and SoC FPGA devices. PCIe* form factor kits are also provided.
Development kit resources typically include the following and are available for download from the individual development kit web pages.
- Development Kit Schematic(s)
- Bill of Materials
- Board Design Files
For more information about the available development kits, visit:
Development kits provide validated references that, if applicable, may be used as a reference for your application's board design.