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1. Introduction
2. Product Family Plan
3. Package Information
4. Thermal Design Considerations
5. Pin Connection Guidelines and Pinouts
6. Printed Circuit Board (PCB) Design
7. Signal Integrity Simulations
8. Validation
9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide
2.5.1. Agilex™ 7 F-Series Devices with F-Tiles
2.5.2. Agilex™ 7 F-Series Devices with E-Tile and P-Tiles
2.5.3. Agilex™ 7 I-Series Devices with F-Tiles
2.5.4. Agilex™ 7 I-Series Devices with F-Tiles and R-Tiles
2.5.5. Agilex™ 7 M-Series Devices with HBM2e
2.5.6. Agilex™ 7 M-Series Devices without HBM2e
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5.3. I/O Banks
Agilex™ 7 Device I/O and LVDS SERDES Interface information for F-Series, I-Series, and M-Series are covered in the user guides listed in the following tables. Electrical characteristics are listed in the respective device data sheets.
Document Title | Document Number |
---|---|
Agilex™ 7 General-Purpose I/O User Guide: F-Series and I-Series | 683780 |
Agilex™ 7 LVDS SERDES User Guide: F-Series and I-Series | 721819 |
Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series | 683301 |
Agilex™ 7 Device Family High-Speed Serial Interface Signal Integrity Design Guidelines (refer to the PCB Design Guidelines section) |
Document Title | Document Number |
---|---|
Agilex™ 7 General-Purpose I/O User Guide: M-Series | 772138 |
Agilex™ 7 LVDS SERDES User Guide: M-Series | 768615 |
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series | 769310 |
Agilex™ 7 Device Family High-Speed Serial Interface Signal Integrity Design Guidelines (refer to the PCB Design Guidelines section) |