Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide

ID 814028
Date 6/07/2024
Public
Document Table of Contents

4.3.1. Heat Sink Rework

Heat sink rework also depends on the property of the Thermal Interface Material (TIM) and mechanical attachment method that has been chosen and used. Please review those third-party specifications for heat sink rework guidance.