Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide

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ID 814028
Date 6/07/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Product Family Plan 3. Package Information 4. Thermal Design Considerations 5. Pin Connection Guidelines and Pinouts 6. Printed Circuit Board (PCB) Design 7. Signal Integrity Simulations 8. Validation 9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide
1. Introduction x
1.1. Status Definitions 1.2. Notifications 1.3. Secure Asset Access—Developer Zone Premium (DZP)
2. Product Family Plan x
2.1. Product Table Information 2.2. Part Number Decoder 2.3. Series/Package/Tile Comparison Table 2.4. Migration within a Package 2.5. Series Package Options Versus Tiles—Support I/O Counts 2.6. Package Comparison Tables
2.5. Series Package Options Versus Tiles—Support I/O Counts x
2.5.1. Agilex™ 7 F-Series Devices with F-Tiles 2.5.2. Agilex™ 7 F-Series Devices with E-Tile and P-Tiles 2.5.3. Agilex™ 7 I-Series Devices with F-Tiles 2.5.4. Agilex™ 7 I-Series Devices with F-Tiles and R-Tiles 2.5.5. Agilex™ 7 M-Series Devices with HBM2e 2.5.6. Agilex™ 7 M-Series Devices without HBM2e
3. Package Information x
3.1. Ball Grid Array (BGA) Package
3.1. Ball Grid Array (BGA) Package x
3.1.1. Package Mechanical Drawings 3.1.2. Package Ball Coordinates 3.1.3. Package PCB Footprints 3.1.4. Land Pattern PCB Design Recommendations (MAS)
4. Thermal Design Considerations x
4.1. Power Estimation and Analysis Tools 4.2. Compact Thermal Models (CTM) 4.3. Heat Sink 4.4. Remote Temperature Sensing using Temperature Sensing Diodes (TSDs)
4.1. Power Estimation and Analysis Tools x
4.1.1. Intel® FPGA Power and Thermal Calculator (PTC) 4.1.2. Quartus® Prime Power Analyzer (QPA)
4.3. Heat Sink x
4.3.1. Heat Sink Rework
5. Pin Connection Guidelines and Pinouts x
5.1. Pin Connection Guidelines 5.2. Pinout Introduction 5.3. I/O Banks 5.4. Transceivers 5.5. Validating Pins
5.2. Pinout Introduction x
5.2.1. F-Series Pinouts 5.2.2. I-Series Pinouts 5.2.3. M-Series Pinouts 5.2.4. Hard Processor System (HPS) Pin Information 5.2.5. External Memory Interface (EMIF) Pin Information
5.3. I/O Banks x
5.3.1. Types of Banks 5.3.2. Bank Locations 5.3.3. Selecting Bank Usage
5.3.1. Types of Banks x
5.3.1.1. General-purpose I/O (GPIO) 5.3.1.2. Secure Device Manager (SDM) I/O 5.3.1.3. Hard Processor System (HPS) I/O
5.3.3. Selecting Bank Usage x
5.3.3.1. Agilex™ 7 M-Series FPGA I/O Placement
6. Printed Circuit Board (PCB) Design x
6.1. Schematic Symbols 6.2. Power Supply 6.3. External Memory 6.4. Transceivers 6.5. SoC FPGA Hard Processor Systems (HPS) 6.6. JTAG Interface 6.7. FPGA Configuration 6.8. Development Kit Examples 6.9. Schematic Review Worksheet 6.10. Step-by-Step Generic PCB Design Flow
6.4. Transceivers x
6.4.1. High-Speed Serial Interface Signal Integrity Design Guidelines 6.4.2. Tiles
6.4.2. Tiles x
6.4.2.1. F-Tile Transceivers 6.4.2.2. E-Tile Transceivers 6.4.2.3. P-Tile Transceivers 6.4.2.4. R-Tile Transceivers
6.10. Step-by-Step Generic PCB Design Flow x
6.10.1. Getting Ready 6.10.2. Schematic Design 6.10.3. Board Layout 6.10.4. Checks
7. Signal Integrity Simulations x
7.1. Intel Advanced Link Analyzer 7.2. Signal Integrity Analysis with Third-Party Tools 7.3. IBIS Models 7.4. Transceiver IBIS-AMI Models 7.5. Net Length Reports
8. Validation x
8.1. Validation and Debug Tools 8.2. Boundary-Scan Description Language (BSDL) Models
8.1. Validation and Debug Tools x
8.1.1. Transceiver Toolkit 8.1.2. EMIF Toolkit and Debug Tools 8.1.3. System Console 8.1.4. Signal Tap 8.1.5. Programmer’s Configuration Debugger Tool
8.2. Boundary-Scan Description Language (BSDL) Models x
8.2.1. Pre-Configuration BSDL Files 8.2.2. Post-Configuration BSDL Generator
1. Introduction
2. Product Family Plan
3. Package Information
4. Thermal Design Considerations
5. Pin Connection Guidelines and Pinouts
6. Printed Circuit Board (PCB) Design
7. Signal Integrity Simulations
8. Validation
9. Document Revision History for the Agilex™ 7 FPGAs and SoC FPGAs Package, Pinout, and PCB Design User Guide

3.1. Ball Grid Array (BGA) Package

Agilex™ 7 FPGAs and SoC FPGAs are offered in a ball grid array (BGA) packages with a copper integrated heat spreader (IHS). The BGA package can be rectangle or square, and may contain several types of dies, such as core, tile, and HBM2e.

The package code includes a BGA designator, an approximation of the ball count magnitude, and variant. For example, the R24C package code digits stand for:

  • R—Rectangular Flip-Chip Ball Grid Array (FCBGA) package
  • 24—represents ball count in 2-digit format. For example, 24 = 2340.
  • C—variant (which is for a different pinout and or different package)

Section Content
Package Mechanical Drawings
Package Ball Coordinates
Package PCB Footprints
Land Pattern PCB Design Recommendations (MAS)

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