Agilex™ 5 FPGAs and SoCs Device Data Sheet

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ID 813918
Date 8/05/2024
Public
Document Table of Contents
Document Table of Contents x
Agilex™ 5 FPGAs and SoCs Device Data Sheet
Agilex™ 5 FPGAs and SoCs Device Data Sheet x
Electrical Characteristics Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Agilex 5 FPGAs and SoCs Device Data Sheet
Electrical Characteristics x
Operating Conditions
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics I/O Standard Specifications
Recommended Operating Conditions x
Recommended Operating Conditions GTS Transceiver Power Supply Operating Conditions HPS Power Supply Operating Conditions
DC Characteristics x
Supply Current and Power Consumption HSIO DC Characteristics HVIO DC Characteristics HPS and SDM I/O DC Characteristics
HSIO DC Characteristics x
HSIO I/O Pin Leakage Current HSIO OCT Calibration Accuracy Specifications HSIO OCT Without Calibration Resistance Tolerance Specifications HSIO Pin Capacitance HSIO Internal Weak Pull-Up Resistor
HVIO DC Characteristics x
HVIO I/O Pin Leakage Current HVIO Pin Capacitance HVIO Internal Weak Pull-Up and Pull-Down Resistor HVIO Hysteresis Specifications for Schmitt Trigger Input
HPS and SDM I/O DC Characteristics x
HPS and SDM I/O Pin Leakage Current HPS and SDM I/O Pin Capacitance HPS and SDM I/O Internal Weak Pull-Up and Weak Pull-Down Resistor HPS and SDM I/O Hysteresis Specifications for Schmitt Trigger Input
I/O Standard Specifications x
HSIO I/O Standard Specifications HVIO I/O Standard Specifications HPS and SDM I/O Standard Specifications
HSIO I/O Standard Specifications x
HSIO Single-Ended I/O Standards Specifications HSIO Single-Ended SSTL, HSTL, HSUL, and POD I/O Reference Voltage Specifications HSIO Single-Ended SSTL, HSTL, HSUL, and POD I/O Standards Signal Specifications HSIO Single-Ended LVSTL I/O Standards Specifications HSIO Differential SSTL, HSTL, and HSUL I/O Standards Specifications HSIO Differential POD I/O Standards Specifications HSIO Differential LVSTL I/O Standards Specifications HSIO Differential I/O Standards Specifications MIPI D-PHY I/O Standards Specifications
HVIO I/O Standard Specifications x
HVIO Single-Ended I/O Standards Specifications
HPS and SDM I/O Standard Specifications x
HPS and SDM Single-Ended I/O Standards Specifications
Switching Characteristics x
Core Performance Specifications Periphery Performance Specifications GTS Transceiver Performance Specifications HPS Performance Specifications
Core Performance Specifications x
Clock Tree Specifications I/O PLL Specifications DSP Block Specifications Memory Block Specifications Local Temperature Sensor Specifications Remote Temperature Diode Specifications Voltage Sensor Specifications
Periphery Performance Specifications x
LVDS SERDES Specifications DPA Lock Time Specifications LVDS SERDES Soft-CDR Sinusoidal Jitter Tolerance Specifications Memory Standards Supported Memory Output Clock Jitter Specifications MIPI D-PHY Performance
GTS Transceiver Performance Specifications x
GTS Transceiver Performance GTS Transceiver Reference Clock Specifications Transmitter Specifications Receiver Specifications Electrical Compliance
HPS Performance Specifications x
HPS Clock Performance HPS Internal Oscillator Frequency HPS PLL Specifications HPS Cold Reset HPS SPI Timing Characteristics HPS SD/eMMC Timing Characteristics HPS USB 2.0 Timing Characteristics HPS USB 3.1 Timing Characteristics HPS Ethernet Media Access Controller (EMAC) Timing Characteristics HPS I2C Timing Characteristics HPS I3C Timing Characteristics HPS NAND Timing Characteristics HPS Trace Timing Characteristics HPS GPIO Interface HPS JTAG Timing Characteristics HPS Programmable I/O Timing Characteristics
Configuration Specifications x
General Configuration Timing Specifications POR Specifications External Configuration Clock Source Requirements JTAG Configuration Timing AS Configuration Timing Avalon® Streaming Configuration Timing Configuration Bit Stream Sizes
Agilex™ 5 FPGAs and SoCs Device Data Sheet

HPS NAND Timing Characteristics

Table 100.  HPS NAND SDR Timing Requirements

Compatible with the ONFI 1.x and 2.x specifications. Compatible with the Toggle 1.x and 2.x specifications. HPS I/O supports SDR, NV-DDR protocols up to 200 MT/s.

For specification status, see the Data Sheet Status table

Symbol Description Min Max Unit
TWP 164 Write enable pulse width 10 — ns
TWH 164 Write enable hold time 7 — ns
TRP 164 Read enable pulse width 10 — ns
TREH 164 Read enable hold time 7 — ns
TCLS 164 Command latch enable to write enable setup time 10 — ns
TCLH 164 Command latch enable to write enable hold time 5 — ns
TCS 164 Chip enable to write enable setup time 15 — ns
TCH 164 Chip enable to write enable hold time 5 — ns
TALS 164 Address latch enable to write enable setup time 10 — ns
TALH 164 Address latch enable to write enable hold time 5 — ns
TDS 164 Data to write enable setup time 7 — ns
TDH 164 Data to write enable hold time 5 — ns
TWB 164 Write enable high to R/B low — 200 ns
TCEA Chip enable to data access time — 100 ns
TREA Read enable to data access time — 40 ns
TRHZ Read enable to data high impedance — 200 ns
TRR Ready to read enable low 20 — ns
Figure 31. NAND SDR Command Latch Timing Diagram
Figure 32. NAND SDR Address Latch Timing Diagram
Figure 33. NAND SDR Data Output Cycle Timing Diagram
Figure 34. NAND SDR Data Input Cycle Timing Diagram
Figure 35. NAND SDR Data Input Timing Diagram for Extended Data Output (EDO) Cycle
Figure 36. NAND SDR Read Status Timing Diagram
Figure 37. NAND SDR Read Status Enhanced Timing Diagram
Table 101.  HPS NAND DDR Timing Requirements

Compatible with the ONFI 1.x and 2.x specifications. Compatible with the Toggle 1.x and 2.x specifications. HPS I/O supports SDR, NV-DDR protocols up to 200 MT/s.

For specification status, see the Data Sheet Status table

Symbol Description 100 MHz (200 MT/s)
Min Max Unit
tAC Access window of DQ[7:0] from CLK 3 25 ns
tADL Address cycle to data loading time 400 — ns
tCADf Command, address, data delay (fast) (command to command, address to address, command to address, address to command, command/address to start of data) 25 — ns
tCADs Command, address, data delay (slow) (command to command, address to address, command to address, address to command, command/address to start of data) 45 — ns
tCAH Command/address DQ hold time 2 — ns
tCALH W/R_n, CLE, and ALE hold time 2 — ns
tCALS W/R_n, CLE, and ALE setup time 2 — ns
tCAS Command/address DQ setup time 2 — ns
tCEH CE_n high hold time 20 — ns
tCH CE_n hold time 2 — ns
tCK(avg) or tCK 165 Average clock cycle time 10 — ns
tCK(abs) Absolute clock period, measured from rising edge to the next consecutive rising edge tCK(avg) + tJIT(per) min tCK(avg) + tJIT(per) max ns
tCKH(abs) 166 Clock cycle high 0.43 0.57 tCK
tCKL(abs) 166 Clock cycle low 0.43 0.57 tCK
tCKWR Data output end to W/R_n high RoundUp{[tDQSCK(max) + tCK] / tCK} — tCK
tCS3 CE_n setup time for data input and data output after CE_n has been high for greater than 1 µs 75 — ns
tCS CE_n setup time 15 — ns
tDH Data hold time 0.9 — ns
tDPZ Data input pause setup time 1.5 — tDSC
tDQSCK Access window of DQS from CLK 3 25 ns
tDQSD W/R_n low to DQS/DQ driven by device 0 18 ns
tDQSH 167 DQS input high pulse width 0.4 0.6 tCK or tDSC4
tDQSHZ 168 W/R_n high to DQS/DQ tri-state by device — 20 ns
tDQSL 167 DQS input low pulse width 0.4 0.6 tCK or tDSC4
tDQSQ DQS-DQ skew, DQS to last DQ valid, per access — 0.85 ns
tDQSS Data input to first DQS latching transition 0.75 1.25 tCK
tDS Data setup time 0.9 — ns
tDSC DQS cycle time 10 — ns
tDSH DQS falling edge to CLK rising – hold time 0.2 — tCK
tDSS DQS falling edge to CLK rising – setup time 0.2 — tCK
tDVW Output data valid window tDVW = tQH – tDQSQ ns
tFEAT Busy time for Set Features and Get Features — 1 µs
tHP Half-clock period tHP = min(tCKL, tCKH) ns
tITC Interface and Timing Mode Change time — 1 µs
tJIT(per) The deviation of a given tCK(abs) from tCK(avg) –0.5 0.5 ns
tQH DQ-DQS hold, DQS to first DQ to go non-valid, per access tQH = tHP – tQHS ns
tQHS Data hold skew factor — 1 ns
tRHW Data output cycle to command, address, or data input cycle 100 — ns
tRR Ready to data output cycle (data only) 20 — ns
tRST (raw NAND) Device reset time, measured from the falling edge of R/B_n to the rising edge of R/B_n — 15/30/500 µs
tRST (EZ NAND)169 Device reset time, measured from the falling edge of R/B_n to the rising edge of R/B_n — 150/150/500 µs
tWB (WE_n high or CLK rising edge) to SR[6] low — 100 ns
tWHR Command, address, or data input cycle to data output cycle 80 — ns
tWPRE DQS write preamble 1.5 — tCK
tWPST DQS write postamble 1.5 — tCK
tWRCK W/R_n low to data output cycle 20 — ns
tWW WP_n transition to command cycle 100 — ns
Figure 38. NAND DDR Command Cycle Timing Diagram
Figure 39. NAND DDR Address Cycle Timing Diagram
Figure 40. NAND DDR Data Input Cycle Timing Diagram
Figure 41. NAND DDR Data Input Cycle Timing Diagram (CLK Stopped)
Figure 42. NAND DDR Data Input Cycle Timing Diagram (CLK Stopped with Data Pause)
Figure 43. NAND DDR Data Output Cycle Timing Diagram
Figure 44. NAND DDR W/R_n Timing Diagram
Figure 45. NAND DDR Read Status Including tWHR and tCAD Timing Diagram
164 This timing is software programmable. Refer to the NAND Flash Controller chapter in the Hard Processor System Technical Reference Manual for more information about software-programmable timing in the NAND flash controller.
165 tCK(avg) is the average clock period over any consecutive 200 cycles window.
166 tCKH(abs) and tCKL(abs) include static offset and duty cycle jitter.
167 tDQSL and tDQSH are relative to tCK when CLK is running. If CLK is stopped during data input, then tDQSL and tDQSH are relative to tDSC.
168 tDQSHZ is not referenced to a specific voltage level, but specifies when the device output is no longer driving.
169 If the reset is invoked using a Reset (FFh) command then the EZ NAND device has 250 ms to complete the reset operation regardless of the timing mode. If the reset is invoked using Synchronous Reset (FCh) or a Reset LUN (FAh) command then the values are as shown.
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