Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series

ID 769310
Date 7/15/2024
Public
Document Table of Contents

Remote Temperature Diode Specifications

Note the following for the remote temperature diode specifications:
  • The temperature diode characteristics in this table target for three-currents temperature sensing chip implementation. The characteristics can also apply to two-currents temperature sensing chip implementation.
  • Absolute accuracy is dependent on third-party external diode ADC and integration specifics.
Table 36.  Remote Temperature Diode Specifications (Core Fabric TSD) For specification status, see the Data Sheet Status table
Description Min Typ Max Unit
Ibias, diode source current 30 170 μA
Vbias, voltage across diode 0.48 0.82 V
Series resistance <10 Ω
Diode ideality factor 1.00666
Table 37.  Remote Temperature Diode Specifications (R-Tile TSD) For specification status, see the Data Sheet Status table
Description Min Typ Max Unit
Ibias, diode source current 30 170 μA
Vbias, voltage across diode 0.48 0.82 V
Series resistance <10 Ω
Diode ideality factor 1.00167
Table 38.  Remote Temperature Diode Specifications (F-Tile TSD) For specification status, see the Data Sheet Status table
Description Min Typ Max Unit
Ibias, diode source current 30 170 μA
Vbias, voltage across diode 0.48 0.83 V
Series resistance <10 Ω
Diode ideality factor 1.00668
66 When using lower injection current (two-currents) implementation, the ideality factor is 1.022.
67 When using lower injection current (two-currents) implementation, the ideality factor is 1.010.
68 When using lower injection current (two-currents) implementation, the ideality factor is 1.018.