Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series

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ID 769310
Date 7/15/2024
Public
Document Table of Contents
Document Table of Contents x
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series x
Electrical Characteristics Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Agilex 7 FPGAs and SoCs Device Data Sheet: M-Series
Electrical Characteristics x
Operating Conditions
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics I/O Standard Specifications
Recommended Operating Conditions x
Recommended Operating Conditions R-Tile Transceiver Power Supply Recommended Operating Conditions F-Tile Transceiver Power Supply Recommended Operating Conditions HPS Power Supply Operating Conditions
DC Characteristics x
Supply Current and Power Consumption GPIO-B DC Characteristics HPS and SDM I/O DC Characteristics
GPIO-B DC Characteristics x
GPIO-B I/O Pin Leakage Current GPIO-B OCT Calibration Accuracy Specifications GPIO-B OCT Without Calibration Resistance Tolerance Specifications GPIO-B Pin Capacitance GPIO-B Internal Weak Pull-Up Resistor
HPS and SDM I/O DC Characteristics x
HPS and SDM I/O Pin Leakage Current HPS and SDM I/O Pin Capacitance HPS and SDM I/O Internal Weak Pull-Up Resistor HPS and SDM I/O Hysteresis Specifications for Schmitt Trigger Input
I/O Standard Specifications x
GPIO-B I/O Standard Specifications HPS and SDM I/O Standard Specifications
GPIO-B I/O Standard Specifications x
GPIO-B Single-Ended I/O Standards Specifications GPIO-B Single-Ended SSTL, HSTL, HSUL, POD and LVSTL I/O Reference Voltage Specifications GPIO-B Single-Ended SSTL, HSTL, HSUL, and POD I/O Standards Signal Specifications GPIO-B Single-Ended LVSTL I/O Standards Specifications GPIO-B Differential SSTL, HSTL, and HSUL I/O Standards Specifications GPIO-B Differential POD I/O Standards Specifications GPIO-B Differential LVSTL I/O Standards Specifications GPIO-B Differential I/O Standards Specifications
HPS and SDM I/O Standard Specifications x
HPS and SDM Single-Ended I/O Standards Specifications
Switching Characteristics x
Core Performance Specifications Periphery Performance Specifications R-Tile Transceiver Performance Specifications F-Tile Transceiver Performance Specifications HPS Performance Specifications
Core Performance Specifications x
Clock Tree Specifications I/O PLL Specifications DSP Block Specifications Memory Block Specifications Local Temperature Sensor Specifications Remote Temperature Diode Specifications Voltage Sensor Specifications
Periphery Performance Specifications x
LVDS SERDES Specifications DPA Lock Time Specifications LVDS SERDES Soft-CDR Sinusoidal Jitter Tolerance Specifications Memory Standards Supported Memory Output Clock Jitter Specifications Performance Specifications of the HBM2E Interface Performance Specifications of Network on Chip (NoC) NOC Reference Clock Requirements
R-Tile Transceiver Performance Specifications x
R-Tile Transceiver Performance R-Tile Transceiver Reference Clock Specifications R-Tile Transmitter Specifications R-Tile Receiver Specifications
F-Tile Transceiver Performance Specifications x
F-Tile Transceiver Performance F-Tile Transceiver Reference Clock Specifications F-Tile Transmitter Specifications F-Tile Receiver Specifications F-Tile Electrical Compliance
HPS Performance Specifications x
HPS Clock Performance HPS Internal Oscillator Frequency HPS PLL Specifications HPS Cold Reset HPS SPI Timing Characteristics HPS SD/MMC Timing Characteristics HPS USB UPLI Timing Characteristics HPS Ethernet Media Access Controller (EMAC) Timing Characteristics HPS I2C Timing Characteristics HPS NAND Timing Characteristics HPS Trace Timing Characteristics HPS GPIO Interface HPS JTAG Timing Characteristics HPS Programmable I/O Timing Characteristics
Configuration Specifications x
General Configuration Timing Specifications POR Specifications External Configuration Clock Source Requirements JTAG Configuration Timing AS Configuration Timing Avalon® Streaming Configuration Timing Configuration Bit Stream Sizes
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series

Glossary

Table 94.  Glossary
Term Definition
Differential I/O Standards Receiver Input Waveforms

Transmitter Output Waveforms

fHSCLK I/O PLL input clock frequency.
fHSDR LVDS SERDES block—maximum/minimum LVDS data transfer rate 
(fHSDR = 1/TUI), non-DPA.
fHSDRDPA LVDS SERDES block—maximum/minimum LVDS data transfer rate 
(fHSDRDPA = 1/TUI), DPA.
J (SERDES factor) LVDS SERDES block—deserialization factor (width of parallel data bus).
JTAG Timing Specifications JTAG Timing Specifications:

RL Receiver differential input discrete resistor (external to the device).
Sampling window (SW) Timing Diagram—the period of time during which the data must be valid in order to capture it correctly. The setup and hold times determine the ideal strobe position in the sampling window, as shown:

Single-ended voltage referenced I/O standard The JEDEC standard for the SSTL and HSTL I/O defines both the AC and DC input signal values. The AC values indicate the voltage levels at which the receiver must meet its timing specifications. The DC values indicate the voltage levels at which the final logic state of the receiver is unambiguously defined. After the receiver input has crossed the AC value, the receiver changes to the new logic state.

The new logic state is then maintained as long as the input stays beyond the DC threshold. This approach is intended to provide predictable receiver timing in the presence of input waveform ringing.

Single-Ended Voltage Referenced I/O Standard

tC High-speed receiver/transmitter input and output clock period.
TCCS (channel-to-channel-skew) The timing difference between the fastest and slowest output edges, including the tCO variation and clock skew, across channels driven by the same PLL. The clock is included in the TCCS measurement (refer to the Timing Diagram figure under SW in this table).
tDUTY LVDS SERDES block—duty cycle on high-speed transmitter output clock.
tFALL Signal high-to-low transition time (80–20%).
tINCCJ Cycle-to-cycle jitter tolerance on the PLL clock input.
tOUTPJ_IO Period jitter on the GPIO driven by a PLL.
tOUTPJ_DC Period jitter on the dedicated clock output driven by a PLL.
tRISE Signal low-to-high transition time (20–80%).
Timing Unit Interval (TUI) The timing budget allowed for skew, propagation delays, and the data sampling window.
(TUI = 1/(Receiver Input Clock Frequency Multiplication Factor) = tC/w).
VCM(DC) DC Common mode input voltage.
VICM Input Common mode voltage—the common mode of the differential signal at the receiver.
VICM(DC) VCM(DC) DC Common mode input voltage.
VID Input differential voltage swing—the difference in voltage between the positive and complementary conductors of a differential transmission at the receiver.
VDIF(AC) AC differential input voltage—minimum AC input differential voltage required for switching.
VDIF(DC) DC differential input voltage—minimum DC input differential voltage required for switching.
VIH Voltage input high—the minimum positive voltage applied to the input which is accepted by the device as a logic high.
VIH(AC) High-level AC input voltage.
VIH(DC) High-level DC input voltage.
VIL Voltage input low—the maximum positive voltage applied to the input which is accepted by the device as a logic low.
VIL(AC) Low-level AC input voltage.
VIL(DC) Low-level DC input voltage.
VOCM Output Common mode voltage—the common mode of the differential signal at the transmitter.
VOD Output differential voltage swing—the difference in voltage between the positive and complementary conductors of a differential transmission line at the transmitter.
VSWING Differential input voltage.
VOX Output differential cross point voltage.
VIX(AC) VIX Input differential cross point voltage.
W LVDS SERDES block—Clock Boost Factor.
Level Two Title