Device Design Guidelines: Agilex™ 5 FPGAs and SoCs

ID 813741
Date 4/01/2024
Public
Document Table of Contents

5.1.2. Thermal Management and Design

Table 34.  Thermal Management and Design

Number

Done?

Checklist item

1

 

For your design, obtain the thermal design power and thermal parameters from the Intel® FPGA Power and Thermal Calculator.

2

 

Perform thermal simulation to determine a proper cooling solution.

The Agilex™ 5 is a monolithic chip that provides higher system integration and lower power with smaller form factor packages. The Intel® FPGA Power and Thermal Calculator takes into consideration of your design input and generates unique thermal parameters for your design in the Thermal Page. You can get power consumption, cooling solution requirement (ψCA), and maximum allowed package case temperature (Tcase). The thermal analysis of the Agilex™ 5 device requires you to use the Compact Thermal Model (contact your local Intel representatives to obtain the model) and perform simulation in a Computational Fluid Dynamics (CFD) tool. The CFD analysis provides the Tcase which needs to be equal or smaller than the value provided by Intel® FPGA Power and Thermal Calculator to maintain the required specified junction temperature. For more information, refer to Intel® FPGA Power and Thermal Calculator User Guide.