Device Design Guidelines: Agilex™ 5 FPGAs and SoCs

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ID 813741
Date 4/01/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 5 Device Design Guidelines 2. System Specification 3. Device Selection 4. Design Entry 5. Board and Software consideration 6. Design Implementation, Analysis, Optimization and Verification 7. Debugging
1. Introduction to Agilex™ 5 Device Design Guidelines x
1.1. Introduction to Agilex™ 5 Device Design Guide Revision History
2. System Specification x
2.1. Design Specification 2.2. Install Quartus® Prime Software 2.3. IP selection 2.4. Simulation 2.5. Preparing for Design Entry 2.6. I/O Summary 2.7. Using SDM in your devices 2.8. System Specification Revision History
2.3. IP selection x
2.3.1. IP cores 2.3.2. HPS IP
2.3.1. IP cores x
2.3.1.1. Interface Protocol IP cores
2.4. Simulation x
2.4.1. RTL Simulation 2.4.2. Simics® Simulator
2.5. Preparing for Design Entry x
2.5.1. Coding Styles and Design Recommendation 2.5.2. Platform Designer
3. Device Selection x
3.1. Device Variant 3.2. Device Selection Revision History
3.1. Device Variant x
3.1.1. Speed Grade and Package 3.1.2. Power option 3.1.3. Device Migration within Agilex™ 5 3.1.4. PLL 3.1.5. Logic element, Embedded memory, and DSP 3.1.6. I/O and LVDS SERDES 3.1.7. MIPI D-DPHY 3.1.8. Transceiver 3.1.9. Hard Processor System
4. Design Entry x
4.1. Design entry for FPGA 4.2. Design entry for Nios® V 4.3. Design entry for HPS 4.4. Design Entry Revision History
4.1. Design entry for FPGA x
4.1.1. Configuration Consideration 4.1.2. I/O and LVDS SERDES 4.1.3. PLL and Clock Planning 4.1.4. EMIF 4.1.5. Transceiver Planning 4.1.6. Sensors 4.1.7. MIPI D-PHY
4.1.1. Configuration Consideration x
4.1.1.1. Partial Reconfiguration 4.1.1.2. SEU
4.1.2. I/O and LVDS SERDES x
4.1.2.1. Making FPGA Pin Assignments Checklist 4.1.2.2. Early Pin Planning and I/O Assignment Analysis for the FPGA Device 4.1.2.3. Agilex™ 5 I/O Features and Pin Connections
4.1.2.3. Agilex™ 5 I/O Features and Pin Connections x
4.1.2.3.1. I/O Signaling Type 4.1.2.3.2. Selectable Standards and Flexible I/O Banks 4.1.2.3.3. Agilex™ 5 Dual-Purpose and Special Pin Connections 4.1.2.3.4. Agilex™ 5 I/O Features
4.1.3. PLL and Clock Planning x
4.1.3.1. Clock and PLL Selection 4.1.3.2. PLL Feature Guidelines 4.1.3.3. Clock Feedback Mode 4.1.3.4. Clock Outputs 4.1.3.5. Clock Control Features
4.1.6. Sensors x
4.1.6.1. Voltage sensor 4.1.6.2. Temperature Sensor and Temperature Diode
4.3. Design entry for HPS x
4.3.1. Simics® Simulator 4.3.2. HPS IP Instantiation in Quartus® Prime
5. Board and Software consideration x
5.1. Early Board Planning 5.2. Boundary Scan for FPGA and HPS 5.3. Pin Connection Considerations for Board Design 5.4. Planning for Device Configuration 5.5. Board and Software Consideration Revision History
5.1. Early Board Planning x
5.1.1. Power - SmartVID or Fix Voltage 5.1.2. Thermal Management and Design
5.1.1. Power - SmartVID or Fix Voltage x
5.1.1.1. Intel® FPGA Power and Thermal Calculator 5.1.1.2. Power-Up and Power-Down Sequencing
5.3. Pin Connection Considerations for Board Design x
5.3.1. Board-Related Quartus® Prime Settings 5.3.2. Signal Integrity Considerations 5.3.3. Board-Level Simulation and Advanced I/O Timing Analysis
5.3.1. Board-Related Quartus® Prime Settings x
5.3.1.1. Unused Pins
5.3.2. Signal Integrity Considerations x
5.3.2.1. High-Speed Board Design 5.3.2.2. Simultaneous Switching Noise 5.3.2.3. I/O Termination
5.4. Planning for Device Configuration x
5.4.1. Device Power Cycling and Reconfiguration 5.4.2. Configuration Scheme Selection 5.4.3. Configuration Features 5.4.4. Quartus® Prime Configuration Settings 5.4.5. Configuration Pin Connections 5.4.6. JTAG Pins 5.4.7. MSEL Configuration Mode Pins 5.4.8. Other Configuration Pins
5.4.2. Configuration Scheme Selection x
5.4.2.1. Serial Configuration Devices 5.4.2.2. Intel® FPGA Download Cable II
5.4.4. Quartus® Prime Configuration Settings x
5.4.4.1. Optional Configuration Pins 5.4.4.2. Dual Purpose Configuration Pins
5.4.5. Configuration Pin Connections x
5.4.5.1. Configuration Pin Voltage Level 5.4.5.2. Clock Trace Signal Integrity
5.4.6. JTAG Pins x
5.4.6.1. JTAG Pin Connections 5.4.6.2. JTAG Signal Buffering 5.4.6.3. Download Cable Operating Voltage
6. Design Implementation, Analysis, Optimization and Verification x
6.1. Synthesis Tool 6.2. Device Resource Reports 6.3. Quartus® Prime Message 6.4. Design Assistant Design Rule Checking 6.5. Timing Constraints and Analysis 6.6. Area and Timing Optimization 6.7. Preserving Performance and Reducing Compilation Time 6.8. Designing with Hyperflex® 6.9. Simulation 6.10. Power Analysis 6.11. Design Implementation, Analysis, Optimization and Verification Revision History
6.5. Timing Constraints and Analysis x
6.5.1. Recommended Timing Optimization and Analysis Assignments 6.5.2. SDC-on-RTL and Post-Synthesis Static Timing Analysis
7. Debugging x
7.1. On-Chip Debug Overview 7.2. On-Chip Debugging Tools 7.3. Debugging Revision History
1. Introduction to Agilex™ 5 Device Design Guidelines
2. System Specification
3. Device Selection
4. Design Entry
5. Board and Software consideration
6. Design Implementation, Analysis, Optimization and Verification
7. Debugging

4.1.2.3.4. Agilex™ 5 I/O Features

Table 20.   Agilex™ 5 I/O Features Checklist

Number

Done?

Checklist Item

1

  
Check available device HSIO features that can help I/O interfaces:
  • slew rate
  • de-emphasis
  • equalizer
  • calibration
  • I/O delays
  • pseudo open-drain
  • programmable pull-up resistors
  • programmable pre-emphasis
  • VOD

2

  

Consider on-chip termination (OCT) features to save board space in HSIO bank.

3

  

Verify that the required termination scheme is supported for all pin locations in HSIO bank.

4

  

Choose the appropriate mode of DPA, non-DPA, or soft-CDR for high-speed LVDS SERDES interfaces in HSIO bank.

5   Check available device HVIO features that can help I/O interfaces:
  • Programmable current strength
  • Programmable weak pull-up and pull-down resistor
  • Programmable open-drain output
  • Programmable delay chain

The Agilex™ 5 bi-directional I/O element (IOE) features support rapid system integration while simultaneously providing the high bandwidth required to maximize internal logic capabilities and system-level performance. Advanced features for device interfaces assist in high-speed data transfer into and out of the device and reduce the complexity and cost of the PCB.

Intel recommends performing an IBIS or SPICE simulations to optimize your design settings.

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