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6.1. Synthesis Tool
6.2. Device Resource Reports
6.3. Quartus® Prime Message
6.4. Design Assistant Design Rule Checking
6.5. Timing Constraints and Analysis
6.6. Area and Timing Optimization
6.7. Preserving Performance and Reducing Compilation Time
6.8. Designing with Hyperflex®
6.9. Simulation
6.10. Power Analysis
6.11. Design Implementation, Analysis, Optimization and Verification Revision History
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4.1.6.2. Temperature Sensor and Temperature Diode
The Agilex™ 5 local temperature sensors use built-in 11-bit ADCs and provide temperature readouts through the SDM mailbox. The Agilex™ 5 temperature monitoring system allows you to measure the on-chip temperature (TJUNCTION) using local temperature sensors or remote temperature sensing diodes (TSDs).
Figure 2. Temperature Sensing Diode LocationsThis figure shows approximate locations of the temperature sensors and is not to scale. The figure shows the view of the die as shown in the Quartus® Prime Chip Planner. In the Pin Planner, this corresponds to the "Bottom View".
Note: The count and availability of the temperature sensors, TSDs, and GTS transceiver banks vary among Agilex™ 5 devices. The HPS bank is available only in Agilex™ 5 SoC FPGAs.
For more information, refer to Power Management User Guide: Agilex™ 5 FPGAs and SoCs and GTS Transceiver PHY User Guide.
The Agilex™ 5 local temperature sensor supports the catastrophic trip signal. You can set the temperature threshold point for nCATTRIP from 95° C to 120° C, in 1° C increments, through the Device and Pin Options window of the Quartus® Prime software.
Number |
Done? |
Checklist item |
---|---|---|
1 |
Determine if you need to use the temperature sensor. |
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