Hard Processor System Technical Reference Manual: Agilex™ 5 SoCs

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ID 814346
Date 7/19/2024
Public
Document Table of Contents
Document Table of Contents x
1. Agilex™ 5 Hard Processor System Technical Reference Manual Revision History 2. Introduction to the Hard Processor System 3. Micro Processor Unit (MPU) 4. Application Processor Subsystem 5. Peripheral Subsystem 6. System Manager 7. Clock Manager 8. Reset Manager 9. Power Management 10. Address Map 11. Bridges 12. Interfaces 13. System Interconnect and Firewalls 14. Error Checking and Correction Controller 15. CoreSight Debug and Trace 16. HPS Register Map A. Appendix
1. Agilex™ 5 Hard Processor System Technical Reference Manual Revision History x
1.1. Introduction to the HPS Revision History 1.2. MPU Revision History 1.3. CCU Revision History 1.4. GIC Revision History 1.5. SMMU Revision History 1.6. On-Chip RAM Revision History 1.7. EMAC Revision History 1.8. DMA Controller Revision History 1.9. NAND Flash Controller Revision History 1.10. SD/eMMC Revision History 1.11. Combo DLL PHY Revision History 1.12. USB 3.1 Gen1 Controller Revision History 1.13. USB 2.0 OTG Controller Revision History 1.14. I3C Controller Revision History 1.15. I2C Controller Revision History 1.16. SPI Controller Revision History 1.17. Timers Revision History 1.18. Watchdog Timers Revision History 1.19. UART Controller Revision History 1.20. GPIO Revision History 1.21. I/O Pin Multiplexing Revision History 1.22. System Manager Revision History 1.23. Clock Manager Revision History 1.24. Reset Manager Revision History 1.25. Power Management Revision History 1.26. Bridges Revision History 1.27. HPS Mailbox Revision History 1.28. MPFE and MPFE-lite Revision History 1.29. EMAC GMII through FPGA Fabric Revision History 1.30. System Interconnect and Firewalls Revision History 1.31. ECC Controller Revision History 1.32. CoreSight* Debug and Trace Revision History 1.33. HPS Register Map Revision History 1.34. Booting and Configuration Revision History 1.35. HPS Use of SDM QSPI Controller Revision History 1.36. Security Revision History 1.37. Operational Status of the HPS to the FPGA Logic Revision History
2. Introduction to the Hard Processor System x
2.1. HPS Differences Among Intel SoC Device Families 2.2. HPS Features 2.3. HPS System Integration 2.4. HPS IP Revisions 2.5. HPS Address Map and Register Definitions
2.3. HPS System Integration x
2.3.1. HPS Block Diagram 2.3.2. MPU Features 2.3.3. Application Processor Subsystem 2.3.4. Peripheral Subsystem 2.3.5. System Manager Features 2.3.6. Clock Manager Features 2.3.7. Reset Manager Features 2.3.8. Bridges Features 2.3.9. System Interconnect and Firewalls Features 2.3.10. ECC Controller Features 2.3.11. CoreSight Debug and Trace Features
2.3.2. MPU Features x
2.3.2.1. Arm Cortex-A76 Core Features 2.3.2.2. Arm* Cortex* -A55 Core Features 2.3.2.3. Arm* DynamIQ Shared Unit Features
2.3.3. Application Processor Subsystem x
2.3.3.1. CCU Features 2.3.3.2. GIC Features 2.3.3.3. SMMU Features 2.3.3.4. On-Chip RAM Features
2.3.4. Peripheral Subsystem x
2.3.4.1. EMAC Features 2.3.4.2. DMA Controller Features 2.3.4.3. NAND Flash Controller Features 2.3.4.4. Combo DLL PHY Features 2.3.4.5. USB 3.1 Gen1 Controller Features 2.3.4.6. USB 2.0 OTG Controller Features 2.3.4.7. I3C Controller Features 2.3.4.8. I2C Controller Features 2.3.4.9. SPI Controller Features 2.3.4.10. Timers Features 2.3.4.11. Watchdog Timers Features 2.3.4.12. UART Controller Features 2.3.4.13. GPIO Features 2.3.4.14. I/O Pin Multiplexing Features
2.3.4.1. EMAC Features x
2.3.4.1.1. XGMAC Core 2.3.4.1.2. Time Sensitive Networking 2.3.4.1.3. MAC Transaction Layer 2.3.4.1.4. DMA 2.3.4.1.5. Management Interface 2.3.4.1.6. Synchronized Multidrop Timestamp Gathering Hub 2.3.4.1.7. External Memory 2.3.4.1.8. PHY Interface
3. Micro Processor Unit (MPU) x
3.1. MPU Differences Among Intel SoC Device Families 3.2. MPU Use Cases 3.3. MPU Features 3.4. MPU System Integration 3.5. MPU Arm* Cortex* -A76 Core 3.6. MPU Arm* Cortex* -A55 Core 3.7. MPU Arm* DynamIQ Shared Unit 3.8. MPU Clock Domains 3.9. MPU Reset Domains 3.10. MPU Power Domains 3.11. MPU Address Map and Register Definitions
3.5. MPU Arm* Cortex* -A76 Core x
3.5.1. Arm Cortex-A76 Core Features 3.5.2. System Integration of the Arm* Cortex* -A76 Core 3.5.3. Functional Description of the Arm Cortex-A76 Core
3.5.3. Functional Description of the Arm Cortex-A76 Core x
3.5.3.1. Cortex* -A76 Core Configuration 3.5.3.2. Exception Levels 3.5.3.3. Virtualization 3.5.3.4. Memory Management Unit 3.5.3.5. Level 1 Memory System 3.5.3.6. Level 2 Memory System 3.5.3.7. Generic Interrupt Controller CPU Interface 3.5.3.8. Advanced Single Instruction Multiple Data and Floating Point Support 3.5.3.9. Cryptographic Extensions 3.5.3.10. Generic Timer 3.5.3.11. Cache Protection 3.5.3.12. Debug
3.5.3.2. Exception Levels x
3.5.3.2.1. Security State 3.5.3.2.2. Security Model
3.5.3.4. Memory Management Unit x
3.5.3.4.1. Translation Lookaside Buffer 3.5.3.4.2. Translation Match Process 3.5.3.4.3. Translation Table Walks
3.5.3.5. Level 1 Memory System x
3.5.3.5.1. Instruction Cache 3.5.3.5.2. Data Cache 3.5.3.5.3. Data Prefetching
3.5.3.11. Cache Protection x
3.5.3.11.1. Uncorrected Errors and Data Poisoning 3.5.3.11.2. Reliability, Availability, and Serviceability Error Types 3.5.3.11.3. Error Recording 3.5.3.11.4. Error Injection
3.5.3.12. Debug x
3.5.3.12.1. Breakpoints and Watchpoints 3.5.3.12.2. Performance Monitoring Unit 3.5.3.12.3. Activity Monitor Unit 3.5.3.12.4. Embedded Trace Macrocell
3.6. MPU Arm* Cortex* -A55 Core x
3.6.1. Arm* Cortex* -A55 Core Features 3.6.2. System Integration of the Arm* Cortex* -A55 Core 3.6.3. Functional Description of the Arm* Cortex* -A55 Core
3.6.3. Functional Description of the Arm* Cortex* -A55 Core x
3.6.3.1. Cortex* -A55 Core Configuration 3.6.3.2. Exception Levels 3.6.3.3. Virtualization 3.6.3.4. Memory Management Unit 3.6.3.5. Level 1 Memory System 3.6.3.6. Level 2 Memory System 3.6.3.7. Generic Interrupt Controller CPU Interface 3.6.3.8. Data Processing Unit 3.6.3.9. Generic Timer 3.6.3.10. Cache Protection 3.6.3.11. Debug
3.6.3.2. Exception Levels x
3.6.3.2.1. Security State 3.6.3.2.2. Security Model
3.6.3.4. Memory Management Unit x
3.6.3.4.1. Translation Lookaside Buffer 3.6.3.4.2. Translation Match Process 3.6.3.4.3. Translation Table Walks
3.6.3.10. Cache Protection x
3.6.3.10.1. Uncorrected Errors and Data Poisoning 3.6.3.10.2. Reliability, Availability and Serviceability Error Types 3.6.3.10.3. Error Reporting 3.6.3.10.4. Error Injection
3.6.3.11. Debug x
3.6.3.11.1. Breakpoints and Watchpoints 3.6.3.11.2. Performance Monitoring Unit 3.6.3.11.3. Embedded Trace Macrocell
3.7. MPU Arm* DynamIQ Shared Unit x
3.7.1. Arm* DynamIQ Shared Unit Features 3.7.2. System Integration of the Arm* DynamIQ Shared Unit 3.7.3. Functional Description of the Arm* DynamIQ Shared Unit
3.7.3. Functional Description of the Arm* DynamIQ Shared Unit x
3.7.3.1. DSU Configuration 3.7.3.2. Level 3 Cache 3.7.3.3. Interfaces 3.7.3.4. Debug
3.7.3.2. Level 3 Cache x
3.7.3.2.1. Cache Allocation Policy 3.7.3.2.2. Cache Partitioning 3.7.3.2.3. Cache Data RAM Latency 3.7.3.2.4. Cache Slices and Portions
3.7.3.4. Debug x
3.7.3.4.1. DebugBlock 3.7.3.4.2. Embedded Cross Trigger 3.7.3.4.3. Performance Monitoring Unit
4. Application Processor Subsystem x
4.1. Cache Coherency Unit (CCU) 4.2. Generic Interrupt Controller (GIC) 4.3. System Memory Management Unit (SMMU) 4.4. On-Chip RAM
4.1. Cache Coherency Unit (CCU) x
4.1.1. CCU Differences Among Intel SoC Device Families 4.1.2. CCU Use Cases 4.1.3. CCU Features 4.1.4. CCU System Integration 4.1.5. CCU Functional Description 4.1.6. CCU Programming Model 4.1.7. CCU Address Map and Register Definitions
4.1.5. CCU Functional Description x
4.1.5.1. Block Diagram 4.1.5.2. Ports 4.1.5.3. Cache Coherency Protocol 4.1.5.4. Addressing and Memory Regions 4.1.5.5. Connectivity 4.1.5.6. Snoop Filters 4.1.5.7. System Memory Cache 4.1.5.8. Credits and Resources 4.1.5.9. Quality of Service 4.1.5.10. Storage Protection 4.1.5.11. Exclusive Monitors 4.1.5.12. Firewall and Security 4.1.5.13. Interrupts 4.1.5.14. Clocks 4.1.5.15. Resets 4.1.5.16. Power Management 4.1.5.17. Shutdown of Interfaces 4.1.5.18. Error Handling 4.1.5.19. CCU Restrictions
4.1.5.1. Block Diagram x
4.1.5.1.1. Coherent Agent Interface Unit (CAIU) 4.1.5.1.2. Non-coherent Agent Interface Unit (NCAIU) 4.1.5.1.3. Distributed Coherence Engine (DCE) 4.1.5.1.4. Distributed Memory Interface (DMI) 4.1.5.1.5. Distributed Virtual Memory Engine (DVE) 4.1.5.1.6. Distributed I/O Interface (DII)
4.1.5.2. Ports x
4.1.5.2.1. DSU CHI-B Initiator Port 4.1.5.2.2. F2H ACE-Lite Initiator Port 4.1.5.2.3. GIC_M ACE-lite Initiator Port 4.1.5.2.4. TCU Ace-lite+DVM Initiator Port 4.1.5.2.5. CCU_IOM ACE-Lite Initiator Port 4.1.5.2.6. CCU_DMI0, CCU_DMI1 1AXI4 Target Ports 4.1.5.2.7. CCU_IOS AXI Target Port 4.1.5.2.8. MPFE CSR AXI Target Port 4.1.5.2.9. GIC AXI Target Port 4.1.5.2.10. OCRAM AXI Target Port
4.1.5.3. Cache Coherency Protocol x
4.1.5.3.1. Coherent Read Request 4.1.5.3.2. Coherent Clean Request 4.1.5.3.3. Coherent Write Request
4.1.5.4. Addressing and Memory Regions x
4.1.5.4.1. Ncore Register Space 4.1.5.4.2. General Purpose Address Space 4.1.5.4.3. Boot Address Space 4.1.5.4.4. Interleaving
4.1.5.4.2. General Purpose Address Space x
4.1.5.4.2.1. Address Map When Using a Single SDRAM Channel 4.1.5.4.2.2. Address Map When Using Multiple SDRAM Channels
4.1.5.12. Firewall and Security x
4.1.5.12.1. OCRAM Firewall 4.1.5.12.2. GIC Firewall 4.1.5.12.3. Service Network Access 4.1.5.12.4. AXI APROT Tunneling
4.1.5.15. Resets x
4.1.5.15.1. Q-Channel
4.1.5.18. Error Handling x
4.1.5.18.1. Correctable Errors 4.1.5.18.2. Uncorrectable Errors
4.1.5.19. CCU Restrictions x
4.1.5.19.1. CHI Support 4.1.5.19.2. AXI and ACE Support 4.1.5.19.3. Ordering Support
4.1.6. CCU Programming Model x
4.1.6.1. CCU Initialization 4.1.6.2. Boot Region CSR Default Settings 4.1.6.3. Error Registers
4.1.6.1. CCU Initialization x
4.1.6.1.1. Address Space Configuration 4.1.6.1.2. SMC Configuration
4.2. Generic Interrupt Controller (GIC) x
4.2.1. GIC Differences Among Intel® SoC Device Families 4.2.2. GIC Features 4.2.3. GIC System Integration 4.2.4. GIC Functional Description 4.2.5. GIC Programming Model 4.2.6. GIC Address Map and Register Definitions 4.2.7. GIC Design Guidelines and Examples
4.2.4. GIC Functional Description x
4.2.4.1. Types of Interrupts 4.2.4.2. Clock Domains 4.2.4.3. Reset Domains
4.2.5. GIC Programming Model x
4.2.5.1. GIC Shared Peripheral Interrupts Map for the SoC HPS
4.2.7. GIC Design Guidelines and Examples x
4.2.7.1. Guidelines for Interrupt request from FPGA2HPS and GPIOs
4.3. System Memory Management Unit (SMMU) x
4.3.1. SMMU Differences Among Intel SoC Device Families 4.3.2. SMMU Use Cases 4.3.3. SMMU Features 4.3.4. SMMU System Integration 4.3.5. SMMU Signal Description 4.3.6. SMMU Functional Description 4.3.7. SMMU Programming Model 4.3.8. SMMU Address Map and Register Definitions 4.3.9. SMMU Design Guidelines and Examples
4.3.3. SMMU Features x
4.3.3.1. DTI Interface for TCU 4.3.3.2. Stage2 Translation 4.3.3.3. TLB 4.3.3.4. Bypass Mode 4.3.3.5. APB4 Programming Interface
4.3.4. SMMU System Integration x
4.3.4.1. TBU Instances 4.3.4.2. DTI Interconnect Topology 4.3.4.3. MMU-600 interfaces 4.3.4.4. IP Configuration
4.3.4.3. MMU-600 interfaces x
4.3.4.3.1. TCU Interfaces 4.3.4.3.2. TBU Interfaces 4.3.4.3.3. DTI Interconnect Interfaces
4.3.4.3.1. TCU Interfaces x
4.3.4.3.1.1. APB4 Programming Interface 4.3.4.3.1.2. ACE-Lite Manager for Table walk and DVM for TCU 4.3.4.3.1.3. LPI Interfaces for TCU 4.3.4.3.1.4. DTI Interface for TCU 4.3.4.3.1.5. SYSCO Interface for TCU 4.3.4.3.1.6. PMU snapshot Interface for TCU
4.3.4.3.2. TBU Interfaces x
4.3.4.3.2.1. ACE-Lite Subordinate Interface 4.3.4.3.2.2. ACE-Lite Manager Interface 4.3.4.3.2.3. DTI interface for TBU 4.3.4.3.2.4. LPI Interfaces for TBU 4.3.4.3.2.5. Interrupt Interfaces for TBU
4.3.4.3.3. DTI Interconnect Interfaces x
4.3.4.3.3.1. DTI Interconnect Switch Interfaces 4.3.4.3.3.2. DTI Interconnect Sizer Interfaces 4.3.4.3.3.3. DTI Interconnect Register Slice Interfaces
4.3.4.4. IP Configuration x
4.3.4.4.1. MMU-600 TCU Hardware Configuration 4.3.4.4.2. MMU-600 TBU Hardware Configurations 4.3.4.4.3. MMU-600 DTI Switch Hardware Configuration 4.3.4.4.4. MMU-600 DTI Async Bridge configuration
4.3.5. SMMU Signal Description x
4.3.5.1. MMU-600 TCU Configuration Signals 4.3.5.2. MMU-600 TBU Configuration Signals 4.3.5.3. TBU with Untranslated Interface
4.3.6. SMMU Functional Description x
4.3.6.1. Block Diagram 4.3.6.2. Functional Blocks 4.3.6.3. Functional Modes 4.3.6.4. Interrupts
4.3.6.3. Functional Modes x
4.3.6.3.1. Address Translation 4.3.6.3.2. Stage1 Translation 4.3.6.3.3. Stage2 Translation 4.3.6.3.4. TLB 4.3.6.3.5. Bypass Mode
4.3.6.4. Interrupts x
4.3.6.4.1. Interrupt Interfaces for TBU
4.3.7. SMMU Programming Model x
4.3.7.1. Initializing the SMMU 4.3.7.2. Assigning Stream IDs 4.3.7.3. Allocating the Command Queue 4.3.7.4. Allocating the Event Queue 4.3.7.5. Configuring the Stream Table 4.3.7.6. Initializing the Command Queue 4.3.7.7. Initializing the Event Queue 4.3.7.8. Invalidate TLBs and Configuration caches 4.3.7.9. Create Context Descriptor 4.3.7.10. Creating Stream Table Entry 4.3.7.11. Enabling the SMMU
4.3.8. SMMU Address Map and Register Definitions x
4.3.8.1. TBU Private Registers
4.3.8.1. TBU Private Registers x
4.3.8.1.1. TBU Stream Control Register[m][n] 4.3.8.1.2. TBU Stream ID Ax Register[m][n]
4.3.9. SMMU Design Guidelines and Examples x
4.3.9.1. F2SDRAM_TBU Special Handling 4.3.9.2. Translation Table Walk Sequence
4.3.9.2. Translation Table Walk Sequence x
4.3.9.2.1. Calculating Page Table Walks
4.4. On-Chip RAM x
4.4.1. On-Chip RAM Differences Among Intel SoC Device Families 4.4.2. On-Chip RAM Use Cases 4.4.3. On-Chip RAM Features 4.4.4. On-Chip RAM Functional Description 4.4.5. On-Chip RAM Address Map and Register Definitions
4.4.4. On-Chip RAM Functional Description x
4.4.4.1. Read and Write Double-Bit Bus Errors 4.4.4.2. On-Chip RAM Controller 4.4.4.3. On-Chip RAM Burst Support 4.4.4.4. Exclusive Access Support 4.4.4.5. Sub-word Accesses 4.4.4.6. On-Chip RAM Clocks 4.4.4.7. On-Chip RAM Resets 4.4.4.8. On-Chip RAM Initialization 4.4.4.9. ECC Protection
4.4.4.5. Sub-word Accesses x
4.4.4.5.1. Pipeline and Timing
5. Peripheral Subsystem x
5.1. Ethernet Media Access Controller 5.2. DMA Controller 5.3. NAND Flash Controller 5.4. SD/eMMC Host Controller 5.5. Combo DLL PHY 5.6. USB 3.1 Gen1 Controller 5.7. USB 2.0 OTG Controller 5.8. I3C Controller 5.9. I2C Controller 5.10. SPI Controller 5.11. Timers 5.12. Watchdog Timers 5.13. UART Controller 5.14. General-Purpose I/O Interface (GPIO) 5.15. Hard Processor System I/O Pin Multiplexing
5.1. Ethernet Media Access Controller x
5.1.1. EMAC Differences Among Intel SoC Device Families 5.1.2. EMAC Use Cases 5.1.3. EMAC Features 5.1.4. EMAC System Integration 5.1.5. EMAC Signal Description and Interfaces 5.1.6. EMAC Functional Description 5.1.7. EMAC Programming Model 5.1.8. EMAC Address Map and Register Definitions 5.1.9. EMAC Design Guidelines and Examples
5.1.3. EMAC Features x
5.1.3.1. XGMAC Core 5.1.3.2. Time Sensitive Networking 5.1.3.3. MAC Transaction Layer 5.1.3.4. DMA 5.1.3.5. Management Interface 5.1.3.6. Synchronized Multidrop Timestamp Gathering Hub 5.1.3.7. External Memory 5.1.3.8. PHY Interface
5.1.4. EMAC System Integration x
5.1.4.1. EMAC Block Diagram and Overview 5.1.4.2. EMAC System Integration
5.1.5. EMAC Signal Description and Interfaces x
5.1.5.1. HPS EMAC I/O Signals 5.1.5.2. FPGA EMAC I/O Signals 5.1.5.3. PHY Management Interface 5.1.5.4. SMTG Hub Signals and Interface 5.1.5.5. Timestamp Interface Signals 5.1.5.6. DMA Host Interface 5.1.5.7. System Manager Configuration Interface
5.1.5.3. PHY Management Interface x
5.1.5.3.1. MDIO Interface 5.1.5.3.2. I2C External PHY Management Interface
5.1.6. EMAC Functional Description x
5.1.6.1. External Memory 5.1.6.2. DMA Controller 5.1.6.3. Descriptor 5.1.6.4. Checksum Offload Engine (COE) 5.1.6.5. TCP Segmentation Offload 5.1.6.6. Packet Filtering 5.1.6.7. Management Counter 5.1.6.8. Flow Control 5.1.6.9. IEEE 1588-2008 Advanced Timestamp 5.1.6.10. TSN Features 5.1.6.11. SMTG Hub Time of Day Synchronization 5.1.6.12. Clocks 5.1.6.13. Resets 5.1.6.14. Interrupts
5.1.6.1. External Memory x
5.1.6.1.1. Transmit and Receive Data FIFO Buffers 5.1.6.1.2. TCP/IP Segmentation Offload Memory 5.1.6.1.3. Descriptor Cache Memory 5.1.6.1.4. Gate Control List Memory
5.1.6.2. DMA Controller x
5.1.6.2.1. Application Bus Burst Access 5.1.6.2.2. Application Data Buffer Alignment 5.1.6.2.3. Buffer Size Calculations 5.1.6.2.4. DMA Descriptor Fetch Operation 5.1.6.2.5. DMA TX Data Transfer Operation 5.1.6.2.6. DMA RX Data Transfer Operation 5.1.6.2.7. DMA Descriptor Write-Back Operation 5.1.6.2.8. DMA Start/Stop Operation 5.1.6.2.9. Memory Cache Size Requirements 5.1.6.2.10. Memory Cache Access Arbitration 5.1.6.2.11. DMA Error Handling
5.1.6.2.11. DMA Error Handling x
5.1.6.2.11.1. TX DMA Bus Error Handling Flow 5.1.6.2.11.2. RX DMA Bus Error Handling Flow
5.1.6.3. Descriptor x
5.1.6.3.1. Descriptor Structure 5.1.6.3.2. Descriptor Endianness 5.1.6.3.3. Transmit Descriptor 5.1.6.3.4. Receive Descriptor 5.1.6.3.5. Enhanced Descriptor for Time-Based Scheduling 5.1.6.3.6. Header Payload Split Support
5.1.6.5. TCP Segmentation Offload x
5.1.6.5.1. Description of the TSO Feature 5.1.6.5.2. DMA Operation with TSO Feature 5.1.6.5.3. TCP/IP Header Fields 5.1.6.5.4. Header and Payload Fields of Segmented Packets 5.1.6.5.5. Context Descriptor Sequence
5.1.6.6. Packet Filtering x
5.1.6.6.1. Source Address or Destination Address Filtering 5.1.6.6.2. VLAN Filtering 5.1.6.6.3. Extended VLAN Filtering 5.1.6.6.4. Layer 3 and Layer 4 Match Filtering
5.1.6.8. Flow Control x
5.1.6.8.1. Transmit Flow Control 5.1.6.8.2. Receive Flow Control
5.1.6.9. IEEE 1588-2008 Advanced Timestamp x
5.1.6.9.1. Delay Request-Response Mechanism 5.1.6.9.2. Peer-to-Peer PTP Transparent Clock Message Support 5.1.6.9.3. Clock Types 5.1.6.9.4. Reference Timing Source 5.1.6.9.5. System Time Register Module 5.1.6.9.6. Transmit Path Functions 5.1.6.9.7. Receive Path Functions
5.1.6.10. TSN Features x
5.1.6.10.1. Enhancements to Scheduled Traffic 5.1.6.10.2. Frame Preemption 5.1.6.10.3. Time-Based Scheduling 5.1.6.10.4. Credit Based Shaper
5.1.6.11. SMTG Hub Time of Day Synchronization x
5.1.6.11.1. SMTG Hub Overview 5.1.6.11.2. SMTG Hub Logic 5.1.6.11.3. SMTG Hub Integration with the HPS and FPGA
5.1.6.12. Clocks x
5.1.6.12.1. Clock Domain
5.1.6.13. Resets x
5.1.6.13.1. EMAC ECC RAM Reset 5.1.6.13.2. EMAC Software Reset
5.1.7. EMAC Programming Model x
5.1.7.1. System Level EMAC configurable Registers 5.1.7.2. EMAC HPS Interface Initialization 5.1.7.3. EMAC FPGA Interface Initialization 5.1.7.4. DMA Initialization 5.1.7.5. EMAC Initialization and Configuration 5.1.7.6. Performing Normal Receive and Transmit Operation 5.1.7.7. Stopping and Starting Transmission 5.1.7.8. Reconfiguring the DMA Registers 5.1.7.9. Switching to a New Descriptor List in the Receive DMA 5.1.7.10. Handling Bus Errors and Recovery 5.1.7.11. Setting up TCP Segmentation Offload 5.1.7.12. Setting up VLAN Filtering on Receive 5.1.7.13. Setting up Extended VLAN Filtering 5.1.7.14. Setting up the L3-L4 Filtering 5.1.7.15. Programming the SMTG Hub 5.1.7.16. Setting up the IEEE 1588 PTP Timestamping 5.1.7.17. Programming Guidelines for Flexible Pulse-Per-Second (PPS) Output 5.1.7.18. Programming the GCL and GCL Linked Registers 5.1.7.19. Programming Guidelines for EST 5.1.7.20. Enabling the Frame Preemption Function 5.1.7.21. Setting up the Time-Based Scheduling Function
5.1.7.1. System Level EMAC configurable Registers x
5.1.7.1.1. System Manager Configurable Registers 5.1.7.1.2. Clock Manager Configurable Registers 5.1.7.1.3. Reset Manager Configurable Registers
5.1.7.10. Handling Bus Errors and Recovery x
5.1.7.10.1. Transmit DMA Channel 5.1.7.10.2. Receive DMA Channel
5.1.7.14. Setting up the L3-L4 Filtering x
5.1.7.14.1. Writing to the Indirect Addressed Registers 5.1.7.14.2. Reading the Indirect Addressed Registers
5.1.7.16. Setting up the IEEE 1588 PTP Timestamping x
5.1.7.16.1. Initialization Guidelines for System Time Generation 5.1.7.16.2. Coarse Correction Method 5.1.7.16.3. Fine-Correction Method
5.1.7.17. Programming Guidelines for Flexible Pulse-Per-Second (PPS) Output x
5.1.7.17.1. Generating a Single Pulse on PPS 5.1.7.17.2. Generating a Pulse Train on PPS 5.1.7.17.3. Generating an Interrupt without Affecting the PPS
5.1.7.20. Enabling the Frame Preemption Function x
5.1.7.20.1. Receive Side Programming 5.1.7.20.2. Transmit Side Programming
5.1.9. EMAC Design Guidelines and Examples x
5.1.9.1. HPS RGMII System Integration 5.1.9.2. Interface to HPS IO Pins 5.1.9.3. RGMII Clock Skew Guidelines
5.1.9.3. RGMII Clock Skew Guidelines x
5.1.9.3.1. Use Case 1 – Utilize Programmable HPS I/O Delay Feature 5.1.9.3.2. Use Case 2 – Configure External PHY RGMII-Internal Delay (RGMII-ID) 5.1.9.3.3. Use Case 3 – Introduce Board Trace Delay
5.2. DMA Controller x
5.2.1. DMA Controller Differences Among Intel SoC Device Families 5.2.2. DMA Controller Use Cases 5.2.3. DMA Controller Features 5.2.4. DMA Controller System Integration 5.2.5. DMA Controller Functional Description 5.2.6. DMA Controller Address Map and Register Definitions
5.2.5. DMA Controller Functional Description x
5.2.5.1. Flow Control 5.2.5.2. Handshaking Interface 5.2.5.3. Interrupt Outputs 5.2.5.4. DMA Controller Peripheral Request Interface
5.2.5.4. DMA Controller Peripheral Request Interface x
5.2.5.4.1. Peripheral Request Interface Mapping
5.3. NAND Flash Controller x
5.3.1. NAND Flash Controller Differences Among Intel SoC Device Families 5.3.2. NAND Flash Controller Use Cases 5.3.3. NAND Flash Controller Features 5.3.4. NAND Flash Controller System Integration 5.3.5. NAND Flash Controller Signal Description 5.3.6. NAND Flash Controller Functional Description 5.3.7. NAND Flash Controller Programming Model 5.3.8. NAND Flash Controller Address Map and Register Definitions
5.3.5. NAND Flash Controller Signal Description x
5.3.5.1. Device Discovery Interface 5.3.5.2. Write Protection Interface 5.3.5.3. Interrupt Interface 5.3.5.4. DFI Interface
5.3.6. NAND Flash Controller Functional Description x
5.3.6.1. Block Diagram 5.3.6.2. Initialization Protocol (Device Discovery) 5.3.6.3. NAND Flash Addressing and Data Layout 5.3.6.4. Command Engine Functionality 5.3.6.5. ECC Engine Functionality 5.3.6.6. Control Data Mechanism 5.3.6.7. Remapping Mechanism 5.3.6.8. Write Protection Mechanism 5.3.6.9. Error and Special Scenarios Handling 5.3.6.10. Controller Fixed Parameters and Clock Frequencies Supported
5.3.6.3. NAND Flash Addressing and Data Layout x
5.3.6.3.1. NAND Flash Addressing 5.3.6.3.2. Data Layout 5.3.6.3.3. Layout Between Pages
5.3.6.4. Command Engine Functionality x
5.3.6.4.1. Command Engine Architecture 5.3.6.4.2. CDMA Work Mode 5.3.6.4.3. PIO Work Mode 5.3.6.4.4. Generic Work Mode 5.3.6.4.5. Extended Functionality in Command Engine
5.3.6.4.2. CDMA Work Mode x
5.3.6.4.2.1. Operation in CDMA Mode 5.3.6.4.2.2. Thread Synchronization Mechanism 5.3.6.4.2.3. NOP Descriptor
5.3.6.4.3. PIO Work Mode x
5.3.6.4.3.1. Operation in PIO Work Mode 5.3.6.4.3.2. Last Operation Status
5.3.6.4.4. Generic Work Mode x
5.3.6.4.4.1. Operation in Generic Work Mode 5.3.6.4.4.2. Last Operation Status 5.3.6.4.4.3. Switching To/From Generic Work Mode
5.3.6.4.5. Extended Functionality in Command Engine x
5.3.6.4.5.1. LUN Interleaving 5.3.6.4.5.2. Multipage Commands 5.3.6.4.5.3. Cache Commands 5.3.6.4.5.4. Multi-plane Commands 5.3.6.4.5.5. Thread Reset Commands 5.3.6.4.5.6. Timeout Functionality 5.3.6.4.5.7. Support of TLC (pSLC Mode) Devices
5.3.6.5. ECC Engine Functionality x
5.3.6.5.1. Error Correction 5.3.6.5.2. Sector Sizes 5.3.6.5.3. Bad Block Marker 5.3.6.5.4. Scrambling Support 5.3.6.5.5. Erased Page Detection Support
5.3.6.9. Error and Special Scenarios Handling x
5.3.6.9.1. Access to Protected Areas 5.3.6.9.2. Bus Error 5.3.6.9.3. NAND Device Error 5.3.6.9.4. Data Integrity Errors 5.3.6.9.5. ECC Errors 5.3.6.9.6. Descriptor/Command Error 5.3.6.9.7. DQS Error 5.3.6.9.8. Error Interrupt Generation 5.3.6.9.9. Recommended Error Handling Checking Software Flow
5.3.7. NAND Flash Controller Programming Model x
5.3.7.1. NAND Controller Registers Programming Model 5.3.7.2. Status Polling Configuration 5.3.7.3. Device Layout Configuration 5.3.7.4. Configure Multiplane and Cache Operations 5.3.7.5. ECC Enabling 5.3.7.6. Interrupts Configuration 5.3.7.7. Configuring Timing Registers 5.3.7.8. Switch from SDR to DDR Operation Mode 5.3.7.9. Switch from DDR to SDR Operation Mode 5.3.7.10. Slave DMA Programming 5.3.7.11. Data Pre-Fetching Mechanism 5.3.7.12. Data Integrity Mechanism 5.3.7.13. Enabling pSLC Mode for the TLC Devices
5.3.7.1. NAND Controller Registers Programming Model x
5.3.7.1.1. Programming SFR Registers 5.3.7.1.2. Programming Command Registers
5.4. SD/eMMC Host Controller x
5.4.1. SD/eMMC Differences Among Intel SoC Device Families 5.4.2. SD/eMMC Use Cases 5.4.3. SD/eMMC Features 5.4.4. SD/eMMC System Integration 5.4.5. SD/eMMC Signal Description 5.4.6. SD/eMMC Functional Description 5.4.7. SD/eMMC Programming Model 5.4.8. SD/eMMC Address Map and Register Definitions 5.4.9. SD/eMMC Design Guidelines and Examples
5.4.3. SD/eMMC Features x
5.4.3.1. Supported Standards 5.4.3.2. SD Support 5.4.3.3. eMMC Support 5.4.3.4. DMA Support
5.4.6. SD/eMMC Functional Description x
5.4.6.1. Block Diagram 5.4.6.2. Configuration 5.4.6.3. DMA Operation 5.4.6.4. Clocks 5.4.6.5. Resets 5.4.6.6. SD Voltage Switching 5.4.6.7. Timings on the SD/eMMC Interface 5.4.6.8. Command Queuing
5.4.6.1. Block Diagram x
5.4.6.1.1. Bus Interface Unit 5.4.6.1.2. Reset Control Module 5.4.6.1.3. Synchronization Module 5.4.6.1.4. Response Module 5.4.6.1.5. FIFO Interface Unit 5.4.6.1.6. Card Interface Unit 5.4.6.1.7. System Requester Interface 5.4.6.1.8. System Manager Interface 5.4.6.1.9. Host Settings Interface 5.4.6.1.10. Command Queue Settings
5.4.6.2. Configuration x
5.4.6.2.1. Host Capabilities
5.4.6.3. DMA Operation x
5.4.6.3.1. SDMA Operation 5.4.6.3.2. ADMA2 Operation 5.4.6.3.3. ADMA3 Operation 5.4.6.3.4. DMA Errors
5.4.6.5. Resets x
5.4.6.5.1. Controller Software Reset
5.4.6.7. Timings on the SD/eMMC Interface x
5.4.6.7.1. Tuning
5.4.6.7.1. Tuning x
5.4.6.7.1.1. Tuning Sequence for SD 5.4.6.7.1.2. Tuning Sequence for eMMC
5.4.6.8. Command Queuing x
5.4.6.8.1. Optional Modes of Operation 5.4.6.8.2. Task Execution Order
5.4.7. SD/eMMC Programming Model x
5.4.7.1. Combo PHY Register Interface 5.4.7.2. Pre-Initialization Sequence 5.4.7.3. Error Handling
5.4.7.1. Combo PHY Register Interface x
5.4.7.1.1. Read Access 5.4.7.1.2. Write Access
5.4.7.3. Error Handling x
5.4.7.3.1. Generic Operation Error Recovery 5.4.7.3.2. Command Queueing Error Recovery 5.4.7.3.3. Combo PHY Underrun/Overflow Error Recovery
5.4.9. SD/eMMC Design Guidelines and Examples x
5.4.9.1. SD Card Level Shifting
5.5. Combo DLL PHY x
5.5.1. Combo DLL PHY Differences Among Intel SoC Device Families 5.5.2. Combo DLL PHY Use Cases 5.5.3. Combo DLL PHY Features 5.5.4. Combo DLL PHY System Integration 5.5.5. Combo DLL PHY Signal Description 5.5.6. Combo DLL PHY Functional Description 5.5.7. Combo DLL PHY Programming Model 5.5.8. Combo DLL PHY Address Map and Register Definitions
5.5.6. Combo DLL PHY Functional Description x
5.5.6.1. Block Diagram 5.5.6.2. Operation Modes 5.5.6.3. Clocking 5.5.6.4. DLL Functionality 5.5.6.5. Write Data Path 5.5.6.6. Read Data Path 5.5.6.7. Generation of CE#, CLE, ALE, WP#, and RE# signals 5.5.6.8. Resets
5.5.6.4. DLL Functionality x
5.5.6.4.1. DLL Locking
5.5.6.5. Write Data Path x
5.5.6.5.1. DQS Write Signal Generation 5.5.6.5.2. Output Enable Signal Generation
5.5.6.6. Read Data Path x
5.5.6.6.1. Generation of Dynamic Termination Signal 5.5.6.6.2. Input Enable Signal Generation
5.5.7. Combo DLL PHY Programming Model x
5.5.7.1. Initialization Procedure 5.5.7.2. DLL Lock Debugging 5.5.7.3. DLL Secondary Delay Configuration 5.5.7.4. Handling FIFO DQS Overflow and Underrun 5.5.7.5. Tuning for SD/eMMC Interface
5.6. USB 3.1 Gen1 Controller x
5.6.1. USB 3.1 Gen1 Controller Differences Among Intel SoC Device Families 5.6.2. USB 3.1 Gen1 Controller Use Cases 5.6.3. USB 3.1 Gen1 Controller Features 5.6.4. USB 3.1 Gen1 Controller System Integration 5.6.5. USB 3.1 Gen1 Controller Functional Description 5.6.6. USB 3.1 Gen1 Controller Programming Model 5.6.7. USB 3.1 Gen1 Controller Address Map and Register Definitions 5.6.8. USB 3.1 Gen1 Controller Design Guidelines and Examples
5.6.3. USB 3.1 Gen1 Controller Features x
5.6.3.1. Unsupported Features
5.6.5. USB 3.1 Gen1 Controller Functional Description x
5.6.5.1. Manager Interface 5.6.5.2. AHB Subordinate Interface 5.6.5.3. Application interface Unit 5.6.5.4. Bus Management Unit 5.6.5.5. Packet FIFO Controller 5.6.5.6. RAM 5.6.5.7. MAC 5.6.5.8. DMA 5.6.5.9. Loopback 5.6.5.10. PHY Interfaces 5.6.5.11. USB 3.1 Gen1 Controller Clocks 5.6.5.12. USB 3.1 Gen1 Controller Resets
5.6.5.1. Manager Interface x
5.6.5.1.1. AXI Manager Interface
5.6.5.8. DMA x
5.6.5.8.1. Reception Flow Details 5.6.5.8.2. Transmission Flow Details
5.6.5.9. Loopback x
5.6.5.9.1. Software Loopback Mode 5.6.5.9.2. BIST Loopback Mode
5.6.5.10. PHY Interfaces x
5.6.5.10.1. USB 2.0 ULPI PHY 5.6.5.10.2. PIPE Interface 5.6.5.10.3. USB 3.1 Mode-switch Controller 5.6.5.10.4. USB Type-C Receptacle 5.6.5.10.5. Performance 5.6.5.10.6. Maximum USB Bandwidth
5.6.5.10.1. USB 2.0 ULPI PHY x
5.6.5.10.1.1. Signals
5.6.5.10.2. PIPE Interface x
5.6.5.10.2.1. IO Connection
5.6.5.10.3. USB 3.1 Mode-switch Controller x
5.6.5.10.3.1. USB3.1 Mode-switch Controller Signals
5.6.5.11. USB 3.1 Gen1 Controller Clocks x
5.6.5.11.1. Clock Enable 5.6.5.11.2. Clock Gating
5.6.5.12. USB 3.1 Gen1 Controller Resets x
5.6.5.12.1. Reset Requirements 5.6.5.12.2. Software Resets 5.6.5.12.3. Warm Reset
5.6.6. USB 3.1 Gen1 Controller Programming Model x
5.6.6.1. Programming Controller in Host Mode 5.6.6.2. Programming Controller in Device Mode
5.6.6.1. Programming Controller in Host Mode x
5.6.6.1.1. Initialization Phase 5.6.6.1.2. Host Controller Capability Registers 5.6.6.1.3. Programming Model 5.6.6.1.4. Device Initialization
5.6.6.2. Programming Controller in Device Mode x
5.6.6.2.1. Device Power-on or Soft Reset 5.6.6.2.2. Initialization on USB Reset 5.6.6.2.3. Initialization on Connect Done 5.6.6.2.4. Initialization on SetAddress Request 5.6.6.2.5. Initialization on SetConfiguration or SetInterface Request 5.6.6.2.6. Agilex 5 Programming Model 5.6.6.2.7. Controller as Host
5.6.8. USB 3.1 Gen1 Controller Design Guidelines and Examples x
5.6.8.1. USB 3.1 Gen1 Controller Wakeup and Power Control
5.7. USB 2.0 OTG Controller x
5.7.1. USB 2.0 OTG Controller Differences Among Intel SoC Device Families 5.7.2. USB 2.0 OTG Controller Use Cases 5.7.3. USB 2.0 OTG Controller Features 5.7.4. USB 2.0 OTG Controller System Integration 5.7.5. USB 2.0 OTG Controller Functional Description 5.7.6. USB 2.0 OTG Controller Programming Model 5.7.7. USB 2.0 OTG Controller Address Map and Register Definitions
5.7.4. USB 2.0 OTG Controller System Integration x
5.7.4.1. USB 2.0 ULPI PHY Signal Description
5.7.5. USB 2.0 OTG Controller Functional Description x
5.7.5.1. Distributed Virtual Memory Support 5.7.5.2. Initiator Interface 5.7.5.3. Target Interface 5.7.5.4. USB OTG Controller Components 5.7.5.5. DMA 5.7.5.6. Local Memory Buffer 5.7.5.7. Clocks 5.7.5.8. Resets 5.7.5.9. Interrupts
5.7.5.4. USB OTG Controller Components x
5.7.5.4.1. Application Interface Unit 5.7.5.4.2. Packet FIFO Controller 5.7.5.4.3. SPRAM 5.7.5.4.4. MAC 5.7.5.4.5. Wakeup and Power Control 5.7.5.4.6. PHY Interface Unit
5.7.5.4.4. MAC x
5.7.5.4.4.1. USB Transactions 5.7.5.4.4.2. Host Protocol 5.7.5.4.4.3. Device Protocol 5.7.5.4.4.4. OTG Protocol
5.7.5.7. Clocks x
5.7.5.7.1. Clock Gating
5.7.5.8. Resets x
5.7.5.8.1. Reset Requirements 5.7.5.8.2. Hardware Reset 5.7.5.8.3. Software Reset 5.7.5.8.4. Taking the USB 2.0 OTG Controller Out of Reset
5.7.6. USB 2.0 OTG Controller Programming Model x
5.7.6.1. Enabling SPRAM ECCs 5.7.6.2. Host Initialization 5.7.6.3. Host Transaction 5.7.6.4. Device Initialization 5.7.6.5. Device Transaction
5.7.6.5. Device Transaction x
5.7.6.5.1. IN Transactions 5.7.6.5.2. OUT Transactions 5.7.6.5.3. Control Transfers
5.8. I3C Controller x
5.8.1. I3C Controller Differences Among Intel SoC Device Families 5.8.2. I3C Controller Use Cases 5.8.3. I3C Controller Features 5.8.4. I3C Controller System Integration 5.8.5. I3C Controller Signal Description 5.8.6. I3C Controller Functional Description 5.8.7. I3C Controller Programming Model 5.8.8. I3C Controller Address Map and Register Definitions 5.8.9. I3C Controller Design Guidelines and Examples
5.8.5. I3C Controller Signal Description x
5.8.5.1. Interface to HPS I/O 5.8.5.2. FPGA Routing
5.8.6. I3C Controller Functional Description x
5.8.6.1. Device Address 5.8.6.2. In-Band Interrupt (IBI) 5.8.6.3. Simple-Transfer DMA (SDMA) Handshake 5.8.6.4. Interrupts in I3C Controller 5.8.6.5. Overview of Master Role in I3C 5.8.6.6. Overview of Slave Role in I3C
5.8.6.5. Overview of Master Role in I3C x
5.8.6.5.1. Dynamic Address Assignment (DAA) 5.8.6.5.2. In-Band Interrupt (IBI) Detection and Handling 5.8.6.5.3. I3C Slave Interrupt Request (SIR) 5.8.6.5.4. Disabling I3C Master 5.8.6.5.5. Aborting Transfers of I3C Master 5.8.6.5.6. I3C Master Request (MR) 5.8.6.5.7. Master Command Data Structures 5.8.6.5.8. Response Data Structure 5.8.6.5.9. Operation Modes of I3C Controller 5.8.6.5.10. SCL Generation and Timings Based on Bus Configuration 5.8.6.5.11. Derivation of I3C/I2C Timing Parameters from Timing Registers 5.8.6.5.12. Error Detection 5.8.6.5.13. Defining Byte Support 5.8.6.5.14. Broadcast CCCs in I2C Speed 5.8.6.5.15. BUS RESET Generation DMA Controller Interface
5.8.6.5.1. Dynamic Address Assignment (DAA) x
5.8.6.5.1.1. SETDASA (Format 1: Primary) 5.8.6.5.1.2. SETDASA (Format 2: Point-to-Point) 5.8.6.5.1.3. ENTDAA 5.8.6.5.1.4. SETAASA
5.8.6.5.3. I3C Slave Interrupt Request (SIR) x
5.8.6.5.3.1. SIR Response Control
5.8.6.5.6. I3C Master Request (MR) x
5.8.6.5.6.1. MR Response Control
5.8.6.5.7. Master Command Data Structures x
5.8.6.5.7.1. Transfer Command Data Structure 5.8.6.5.7.2. Transfer Argument Data Structure 5.8.6.5.7.3. Short Data Argument Data Structure 5.8.6.5.7.4. Address Assignment Command Data Structure
5.8.6.5.9. Operation Modes of I3C Controller x
5.8.6.5.9.1. Single Data Rate (SDR) Transfers in Master Mode 5.8.6.5.9.2. Broadcast CCC Write Transfers 5.8.6.5.9.3. Directed Write and Read Transfers 5.8.6.5.9.4. Directed CCC Transfer Targeted to Multiple Slaves 5.8.6.5.9.5. I3C Private Write or Read Transfers 5.8.6.5.9.6. I2C Private Write or Read Transfers 5.8.6.5.9.7. Implication of TX-FIFO Empty and RX-FIFO Full Conditions 5.8.6.5.9.8. Implication of TOC and ROC Bit Settings for SDR Transfers
5.8.6.5.12. Error Detection x
5.8.6.5.12.1. Detecting Error Type in the Processed Commands 5.8.6.5.12.2. SDR Error Detection and Recovery Methods
5.8.6.6. Overview of Slave Role in I3C x
5.8.6.6.1. Description of the Slave Role in I3C 5.8.6.6.2. I3C versus I2C Role Selection 5.8.6.6.3. Slave Role Related Registers 5.8.6.6.4. Handling Address Assignment 5.8.6.6.5. CCC Transfers with I3C Slave 5.8.6.6.6. Private Data Transfers 5.8.6.6.7. Handling Private Transmit (Master Read) Transfers 5.8.6.6.8. Slave Interrupt Request Generation 5.8.6.6.9. Master Request Generation 5.8.6.6.10. Disabling I3C Slave 5.8.6.6.11. Data Structure in I3C Slave
5.8.6.6.6. Private Data Transfers x
5.8.6.6.6.1. Overview of Private Data Transfers
5.8.6.6.11. Data Structure in I3C Slave x
5.8.6.6.11.1. Transmit Command Data Structure 5.8.6.6.11.2. Response Data Structure
5.8.7. I3C Controller Programming Model x
5.8.7.1. Initializing Common Registers 5.8.7.2. Initializing Master Registers 5.8.7.3. Enabling the Controller 5.8.7.4. Master Mode Operation 5.8.7.5. Initializing Slave Registers 5.8.7.6. Slave Mode Operation 5.8.7.7. DMA Controller Operation
5.8.7.1. Initializing Common Registers x
5.8.7.1.1. Programming Threshold Control Registers 5.8.7.1.2. Programming Interrupt Related Registers
5.8.7.2. Initializing Master Registers x
5.8.7.2.1. Programming DEVICE_ADDR Register 5.8.7.2.2. Programming Timing Registers
5.8.7.4. Master Mode Operation x
5.8.7.4.1. Slave Address Assignment 5.8.7.4.2. Receiving IBI (All types) 5.8.7.4.3. CCC Read/Write Transfers 5.8.7.4.4. Private Read/Write Transfers 5.8.7.4.5. Programming Flow to Prepare the Controller to Switch to Master Mode
5.8.7.4.1. Slave Address Assignment x
5.8.7.4.1.1. ENTDAA Transfer 5.8.7.4.1.2. Issue SETDASA CCC Command
5.8.7.4.3. CCC Read/Write Transfers x
5.8.7.4.3.1. Broadcast CCC Transfer in Master Mode 5.8.7.4.3.2. Directed CCC Transfer in Master Mode
5.8.7.5. Initializing Slave Registers x
5.8.7.5.1. Programming Interrupt Related Registers
5.8.7.6. Slave Mode Operation x
5.8.7.6.1. Private Receive (Master Write) Transfers in Slave Mode 5.8.7.6.2. Private Transmit (Master Read) Transfers in Slave Mode 5.8.7.6.3. Programming Flow for Generating Slave Interrupt Request 5.8.7.6.4. Programming Flow for Generating Master Request 5.8.7.6.5. Programming Flow to Prepare the Controller to Switch to Master Mode 5.8.7.6.6. Command Pipeline and Aggregation of Response Queue Threshold Interrupt 5.8.7.6.7. Error Recovery Flow 5.8.7.6.8. CCC Updated Interrupt Flow 5.8.7.6.9. Flow for Disable and TX/RX/CMD/Response Queue Reset
5.8.7.6.7. Error Recovery Flow x
5.8.7.6.7.1. S0-S5 Error Handling
5.8.9. I3C Controller Design Guidelines and Examples x
5.8.9.1. Guidelines for External SDA and SCL Signals via HPS I/O in the Board Design
5.9. I2C Controller x
5.9.1. I2C Controller Differences Among Intel SoC Device Families 5.9.2. I2C Controller Use Cases 5.9.3. I2C Controller Features 5.9.4. I2C Controller System Integration 5.9.5. I2C Controller Signal Description 5.9.6. I2C Controller Functional Description 5.9.7. I2C Controller Programming Model 5.9.8. I2C Controller Address Map and Register Definitions 5.9.9. I2C Controller Design Guidelines and Examples
5.9.6. I2C Controller Functional Description x
5.9.6.1. Feature Usage 5.9.6.2. Behavior 5.9.6.3. Protocol Details 5.9.6.4. Multiple Master Arbitration 5.9.6.5. Clock Frequency Configuration 5.9.6.6. SDA Hold Time 5.9.6.7. DMA Controller Interface 5.9.6.8. Clocks 5.9.6.9. Resets
5.9.6.2. Behavior x
5.9.6.2.1. START and STOP Generation 5.9.6.2.2. Combined Formats
5.9.6.3. Protocol Details x
5.9.6.3.1. START and STOP Conditions 5.9.6.3.2. Addressing Slave Protocol 5.9.6.3.3. Transmitting and Receiving Protocol 5.9.6.3.4. START BYTE Transfer Protocol
5.9.6.4. Multiple Master Arbitration x
5.9.6.4.1. Clock Synchronization
5.9.6.5. Clock Frequency Configuration x
5.9.6.5.1. Minimum High and Low Counts
5.9.6.5.1. Minimum High and Low Counts x
5.9.6.5.1.1. Calculating High and Low Counts
5.9.6.9. Resets x
5.9.6.9.1. Taking the I2C Controller Out of Reset
5.9.7. I2C Controller Programming Model x
5.9.7.1. Slave Mode Operation 5.9.7.2. Master Mode Operation 5.9.7.3. Disabling the I2C Controller 5.9.7.4. Abort Transfer 5.9.7.5. DMA Controller Operation
5.9.7.1. Slave Mode Operation x
5.9.7.1.1. Initial Configuration 5.9.7.1.2. Slave-Transmitter Operation for a Single Byte 5.9.7.1.3. Slave-Receiver Operation for a Single Byte 5.9.7.1.4. Slave-Transfer Operation for Bulk Transfers 5.9.7.1.5. Slave Programming Model
5.9.7.2. Master Mode Operation x
5.9.7.2.1. Initial Configuration 5.9.7.2.2. Dynamic IC_TAR or IC_10BITADDR_MASTER Update 5.9.7.2.3. Master Transmit and Master Receive 5.9.7.2.4. Master Programming Model
5.9.7.5. DMA Controller Operation x
5.9.7.5.1. Transmit FIFO Underflow 5.9.7.5.2. Transmit Watermark Level 5.9.7.5.3. Transmit FIFO Overflow 5.9.7.5.4. Receive FIFO Overflow 5.9.7.5.5. Receive Watermark Level 5.9.7.5.6. Receive FIFO Underflow
5.9.9. I2C Controller Design Guidelines and Examples x
5.9.9.1. I2C Interface Design Guidelines
5.10. SPI Controller x
5.10.1. SPI Controller Differences Among Intel SoC Device Families 5.10.2. SPI Controller Use Cases 5.10.3. SPI Controller Features 5.10.4. SPI Controller System Integration 5.10.5. SPI Controller Signal Description 5.10.6. SPI Controller Functional Description 5.10.7. SPI Controller Programming Model 5.10.8. SPI Controller Address Map and Register Definitions
5.10.5. SPI Controller Signal Description x
5.10.5.1. Interface to HPS I/O 5.10.5.2. FPGA Routing
5.10.6. SPI Controller Functional Description x
5.10.6.1. Protocol Details and Standards Compliance 5.10.6.2. Overview 5.10.6.3. Serial Bit-Rate Clocks 5.10.6.4. Transmit and Receive FIFO Buffers 5.10.6.5. SPI Interrupts 5.10.6.6. Transfer Modes 5.10.6.7. SPI Master 5.10.6.8. SPI Slave 5.10.6.9. Partner Connection Interfaces 5.10.6.10. DMA Controller Interface 5.10.6.11. Slave Interface 5.10.6.12. Clocks and Resets
5.10.6.3. Serial Bit-Rate Clocks x
5.10.6.3.1. SPI Master Bit-Rate Clock 5.10.6.3.2. SPI Slave Bit-Rate Clock
5.10.6.6. Transfer Modes x
5.10.6.6.1. Transmit and Receive 5.10.6.6.2. Transmit Only 5.10.6.6.3. Receive Only 5.10.6.6.4. EEPROM Read
5.10.6.7. SPI Master x
5.10.6.7.1. Glue Logic for Master Port ss_in_n 5.10.6.7.2. Multi-Master System 5.10.6.7.3. RXD Sample Delay 5.10.6.7.4. Data Transfers 5.10.6.7.5. Master SPI and SSP Serial Transfers 5.10.6.7.6. Master Microwire Serial Transfers
5.10.6.8. SPI Slave x
5.10.6.8.1. Slave SPI and SSP Serial Transfers 5.10.6.8.2. Serial Transfers
5.10.6.9. Partner Connection Interfaces x
5.10.6.9.1. Motorola SPI Protocol 5.10.6.9.2. Texas Instruments Synchronous Serial Protocol (SSP) 5.10.6.9.3. National Semiconductor Microwire Protocol
5.10.6.11. Slave Interface x
5.10.6.11.1. Control and Status Register Access 5.10.6.11.2. Data Register Access
5.10.6.12. Clocks and Resets x
5.10.6.12.1. Clock Gating 5.10.6.12.2. Taking the SPI Controller Out of Reset
5.10.7. SPI Controller Programming Model x
5.10.7.1. Master SPI and SSP Serial Transfers 5.10.7.2. Master Microwire Serial Transfers 5.10.7.3. Slave SPI and SSP Serial Transfers 5.10.7.4. Slave Microwire Serial Transfers 5.10.7.5. Software Control for Slave Selection 5.10.7.6. DMA Controller Operation
5.10.7.5. Software Control for Slave Selection x
5.10.7.5.1. Example: Slave Selection Software Flow for SPI Master 5.10.7.5.2. Example: Slave Selection Software Flow for SPI Slave
5.10.7.6. DMA Controller Operation x
5.10.7.6.1. Transmit FIFO Buffer Underflow 5.10.7.6.2. Transmit FIFO Watermark 5.10.7.6.3. Transmit FIFO Buffer Overflow 5.10.7.6.4. Receive FIFO Buffer Overflow 5.10.7.6.5. Choosing Receive Watermark Level 5.10.7.6.6. Receive FIFO Buffer Underflow
5.10.7.6.2. Transmit FIFO Watermark x
5.10.7.6.2.1. Example 1: Transmit FIFO Watermark Level = 64 5.10.7.6.2.2. Example 2: Transmit FIFO Watermark Level = 192
5.11. Timers x
5.11.1. Timers Differences Among Intel SoC Device Families 5.11.2. Timers Use Cases 5.11.3. Timers Features 5.11.4. Timers System Integration 5.11.5. Timers Functional Description 5.11.6. Timers Programming Model 5.11.7. Timers Address Map and Register Definitions
5.11.5. Timers Functional Description x
5.11.5.1. Clocks 5.11.5.2. Resets 5.11.5.3. Interrupts
5.11.6. Timers Programming Model x
5.11.6.1. Initialization 5.11.6.2. Enabling the Timers 5.11.6.3. Disabling the Timers 5.11.6.4. Loading the Timers Countdown Value 5.11.6.5. Timers Servicing Interrupts
5.11.6.5. Timers Servicing Interrupts x
5.11.6.5.1. Clearing the Interrupt 5.11.6.5.2. Checking the Interrupt Status 5.11.6.5.3. Masking the Interrupt
5.12. Watchdog Timers x
5.12.1. Watchdog Timers Differences Among Intel SoC Device Families 5.12.2. Watchdog Timers Use Cases 5.12.3. Watchdog Timers Features 5.12.4. Watchdog Timers System Integration 5.12.5. Watchdog Timers Functional Description 5.12.6. Watchdog Timers Programming Model 5.12.7. Watchdog Timers Address Map and Register Definitions
5.12.5. Watchdog Timers Functional Description x
5.12.5.1. Watchdog Timers Counter 5.12.5.2. Watchdog Timers Pause Mode 5.12.5.3. Watchdog Timers Clocks 5.12.5.4. Watchdog Timers Resets
5.12.6. Watchdog Timers Programming Model x
5.12.6.1. Setting the Timeout Period Values 5.12.6.2. Selecting the Output Response Mode 5.12.6.3. Enabling and Initially Starting a Watchdog Timers 5.12.6.4. Reloading a Watchdog Counter 5.12.6.5. Pausing a Watchdog Timers 5.12.6.6. Disabling and Stopping a Watchdog Timers 5.12.6.7. Watchdog Timers State Machine
5.13. UART Controller x
5.13.1. UART Controller Differences Among Intel SoC Device Families 5.13.2. UART Controller Use Cases 5.13.3. UART Controller Features 5.13.4. UART Controller System Integration 5.13.5. UART Controller Signal Description 5.13.6. UART Controller Functional Description 5.13.7. UART Controller Address Map and Register Definitions 5.13.8. UART Controller Design Guidelines and Example
5.13.5. UART Controller Signal Description x
5.13.5.1. HPS I/O Pins 5.13.5.2. FPGA Routing
5.13.6. UART Controller Functional Description x
5.13.6.1. FIFO Buffer Support 5.13.6.2. UART Serial Protocol 5.13.6.3. Automatic Flow Control 5.13.6.4. Clocks 5.13.6.5. Resets 5.13.6.6. UART Controller Interrupts 5.13.6.7. UART Controller DMA Controller Operation
5.13.6.7. UART Controller DMA Controller Operation x
5.13.6.7.1. Transmit FIFO Underflow 5.13.6.7.2. Transmit Watermark Level 5.13.6.7.3. Transmit FIFO Overflow 5.13.6.7.4. Receive FIFO Overflow 5.13.6.7.5. Receive Watermark Level 5.13.6.7.6. Receive FIFO Underflow
5.14. General-Purpose I/O Interface (GPIO) x
5.14.1. GPIO Differences Among Intel SoC Device Families 5.14.2. GPIO Use Cases 5.14.3. GPIO Features 5.14.4. GPIO System Integration 5.14.5. GPIO Functional Description 5.14.6. GPIO Programming Model 5.14.7. GPIO Address Map and Register Definitions
5.14.5. GPIO Functional Description x
5.14.5.1. Interrupts 5.14.5.2. Debounce Operation 5.14.5.3. Pin Directions 5.14.5.4. Taking the GPIO Interface Out of Reset
5.15. Hard Processor System I/O Pin Multiplexing x
5.15.1. I/O Pin Multiplexing Differences Among Intel SoC Device Families 5.15.2. I/O Pin Multiplexing Use Cases 5.15.3. I/O Pin Multiplexing Features 5.15.4. I/O Pin Multiplexing System Integration 5.15.5. I/O Pin Multiplexing Functional Description 5.15.6. I/O Pin Multiplexing Address Map and Register Definitions 5.15.7. I/O Pin Multiplexing Design Guidelines and Examples
5.15.5. I/O Pin Multiplexing Functional Description x
5.15.5.1. I/O Pins 5.15.5.2. FPGA Access 5.15.5.3. I/O Control Registers
5.15.5.3. I/O Control Registers x
5.15.5.3.1. Dedicated Pin MUX Registers 5.15.5.3.2. Dedicated Configuration Registers 5.15.5.3.3. FPGA Access MUX Registers 5.15.5.3.4. HPS JTAG Pin MUX Register
5.15.7. I/O Pin Multiplexing Design Guidelines and Examples x
5.15.7.1. Boundary Scan for HPS 5.15.7.2. HPS I/O Design Considerations
6. System Manager x
6.1. System Manager Differences Among Intel SoC Device Families 6.2. System Manager Use Cases 6.3. System Manager Features 6.4. System Manager System Integration 6.5. System Manager Address Map and Register Definitions 6.6. System Manager Revision History
6.4. System Manager System Integration x
6.4.1. Additional Module Control 6.4.2. FPGA Interface Enables 6.4.3. ECC and Parity Control 6.4.4. Preloader Handoff Information 6.4.5. Clocks 6.4.6. Resets
6.4.1. Additional Module Control x
6.4.1.1. DMA Controller 6.4.1.2. NAND Flash Controller 6.4.1.3. EMAC 6.4.1.4. USB 2.0 OTG Controller 6.4.1.5. USB 3.1 Controller 6.4.1.6. NOC Registers 6.4.1.7. Boot Scratch Space 6.4.1.8. I3C Controller 6.4.1.9. SD/eMMC Controller 6.4.1.10. GPIO Interconnect Between the HPS and FPGA 6.4.1.11. Watchdog Timer
7. Clock Manager x
7.1. Clock Manager Differences Among Intel SoC Device Families 7.2. Clock Manager Use Cases 7.3. Clock Manager Features 7.4. Clock Manager System Integration 7.5. Clock Manager Signal Description 7.6. Clock Manager Functional Description 7.7. Clock Manager Programming Model 7.8. Clock Manager Address Map and Register Definitions 7.9. Clock Manager Design Guidelines and Examples
7.2. Clock Manager Use Cases x
7.2.1. A76 Core Power and Performance Trade-off 7.2.2. A55 Core Power and Performance Trade-off 7.2.3. DSU Power and Performance Trade-off 7.2.4. Peripheral Clock Generation 7.2.5. Peripheral Power Optimization 7.2.6. Clock Tree Clock Sources 7.2.7. Boot Clock 7.2.8. Power-on-reset 7.2.9. Boot Mode 7.2.10. Disable Clocks Before Reset Assertion 7.2.11. PLL Configuration using JTAG
7.4. Clock Manager System Integration x
7.4.1. Top Level of the Clock Groups 7.4.2. Clock Manager Block Diagram
7.5. Clock Manager Signal Description x
7.5.1. Hardware-Managed Clocks 7.5.2. Software-Managed Clocks
7.6. Clock Manager Functional Description x
7.6.1. PLL Wrapper 7.6.2. MPU/DSU and APS/CCU Clock Groups 7.6.3. PSS Clock Group 7.6.4. MPFE Clock Group 7.6.5. EMAC and XGMAC Clock Group 7.6.6. USB31 Clock Group 7.6.7. SD/eMMC, NAND, and SoftPHY/ComboPHY 7.6.8. H2F User Clock Group 7.6.9. F2H User Clock Group 7.6.10. GPIO Debounce Clock Group 7.6.11. CoreSight Clocks 7.6.12. PSI Clock Group (to the SDM)
7.6.3. PSS Clock Group x
7.6.3.1. USB2OTG Clock Group
7.6.5. EMAC and XGMAC Clock Group x
7.6.5.1. EMAC Clocks 7.6.5.2. XGMAC Clocks
7.7. Clock Manager Programming Model x
7.7.1. Example Configuration of Registers for Default Operation (640 MHz CPU) 7.7.2. Example Configuration of Registers for Power Optimized (1000 MHz CPU) 7.7.3. Example Configuration of Registers for Performance Optimized (1800 MHz CPU) 7.7.4. Example Configuration of Registers for Power Optimized (1200 MHz CPU) 7.7.5. Summary Table of Registers Used to Program Clocks
8. Reset Manager x
8.1. Reset Manager Differences Among Intel SoC Device Families 8.2. Reset Manager Use Cases 8.3. Reset Manager Features 8.4. Reset Manager System Integration 8.5. Reset Manager Signal Description 8.6. Reset Manager Functional Description 8.7. Reset Manager Programming Model 8.8. Reset Manager Address Map and Register Definitions
8.5. Reset Manager Signal Description x
8.5.1. HPS Reset Domains 8.5.2. HPS Reset Domain to Signal Mapping 8.5.3. HPS Reset Priority
8.6. Reset Manager Functional Description x
8.6.1. System Reset High Level Flow 8.6.2. Hardware Reset Sequences 8.6.3. Software Reset Sequences
8.6.2. Hardware Reset Sequences x
8.6.2.1. POR De-assertion Sequence 8.6.2.2. Reset De-assertion Sequence 8.6.2.3. HPS Idle Sequence 8.6.2.4. Reset Assertion Sequence 8.6.2.5. Wait for Reset Requests to De-assert Sequence
8.6.3. Software Reset Sequences x
8.6.3.1. Normal Operation 8.6.3.2. Cold and Warm Reset Sequence 8.6.3.3. Debug Reset Sequence
8.7. Reset Manager Programming Model x
8.7.1. H2F Bridge Reset Sequence 8.7.2. LWH2F Bridge Reset Sequence 8.7.3. F2H Bridge Reset Sequence 8.7.4. F2SDRAM Bridge Reset Sequence 8.7.5. HPS_COLD_nRESET Pin Function
8.7.5. HPS_COLD_nRESET Pin Function x
8.7.5.1. FPGA Boot First 8.7.5.2. HPS Boot First 8.7.5.3. HPS Pin-triggered Cold Reset 8.7.5.4. HPS Mailbox-triggered Cold Reset
9. Power Management x
9.1. Power Management Differences Among Intel SoC Device Families 9.2. Power Management System Integration 9.3. Power Management Functional Description 9.4. Power Management Design Guidelines and Examples
9.3. Power Management Functional Description x
9.3.1. DSU L3 Cache Power Gating 9.3.2. CPU Core Power Gating 9.3.3. PSS Partition Power Management
10. Address Map x
10.1. Address Space Introduction 10.2. Total Address Spaces 10.3. MPU Address Space 10.4. NOC: Level 3 and Level 4 Address Space 10.5. FPGA Slaves Address Space 10.6. Lightweight FPGA Slaves Address Space 10.7. FPGA-to-HPS Address Space 10.8. FPGA-to-SDRAM Address Space
10.2. Total Address Spaces x
10.2.1. Total Address Map Graphical 10.2.2. Total Address Map Tabular 10.2.3. Total Address Map for F2H and F2SDRAM
11. Bridges x
11.1. Bridges Differences Among Intel SoC Device Families 11.2. Bridges Use Cases 11.3. Bridges Features 11.4. Bridges System Integration 11.5. Bridges Functional Description 11.6. Bridges Clocks and Resets 11.7. Bridges Address Map and Register Definitions 11.8. Bridges Design Guidelines and Examples
11.2. Bridges Use Cases x
11.2.1. FPGA-to-HPS Bridge 11.2.2. HPS-to-FPGA 11.2.3. Lightweight HPS-to-FPGA 11.2.4. FPGA-to-SDRAM
11.2.1. FPGA-to-HPS Bridge x
11.2.1.1. FPGA-to-HPS Initialization and Shutdown Procedure
11.5. Bridges Functional Description x
11.5.1. FPGA-to-HPS Bridge 11.5.2. HPS-to-FPGA Bridge 11.5.3. Lightweight HPS-to-FPGA Bridge 11.5.4. FPGA-to-SDRAM Bridge
11.5.4. FPGA-to-SDRAM Bridge x
11.5.4.1. Transaction Buffer Unit Interface
11.6. Bridges Clocks and Resets x
11.6.1. FPGA-to-HPS Bridge Clocks and Resets 11.6.2. HPS-to-FPGA Bridge Clocks and Resets 11.6.3. Lightweight HPS-to-FPGA Bridge Clocks and Resets 11.6.4. FPGA-to-SDRAM Clocks and Resets
11.8. Bridges Design Guidelines and Examples x
11.8.1. Recommended Starting Point for Interface Designs 11.8.2. Information on How to Configure and Use the Bridges 11.8.3. Bridges Example Transactions
11.8.3. Bridges Example Transactions x
11.8.3.1. FPGA-to-SDRAM Direct (Cache Non-Allocate) 11.8.3.2. FPGA-to-HPS CCU to Memory (Cache Non-Allocate) 11.8.3.3. FPGA-to-HPS CCU to Memory (Cache-Allocate) 11.8.3.4. FPGA-to-HPS CCU to Peripherals (Device Non-Bufferable) 11.8.3.5. FPGA-to-HPS Example Transactions Summary
12. Interfaces x
12.1. HPS Mailbox 12.2. MPFE and MPFE-lite 12.3. EMAC GMII through FPGA Fabric
12.1. HPS Mailbox x
12.1.1. HPS Mailbox Differences Among Intel SoC Device Families 12.1.2. HPS Mailbox Features 12.1.3. Accessing HPS Mailbox Services 12.1.4. HPS Mailbox System Integration 12.1.5. HPS Mailbox Address Map and Register Definitions
12.2. MPFE and MPFE-lite x
12.2.1. MPFE and MPFE-lite Terminology 12.2.2. MPFE and MPFE-lite Differences Among Intel SoC Families 12.2.3. MPFE and MPFE-lite Use Cases 12.2.4. MPFE and MPFE-lite Features 12.2.5. MPFE and MPFE-lite System Integration 12.2.6. MPFE and MPFE-lite Functional Description 12.2.7. MPFE and MPFE-lite Address Map and Register Definitions
12.2.3. MPFE and MPFE-lite Use Cases x
12.2.3.1. Fabric Bypass 12.2.3.2. One 16-bit SDRAM channel 12.2.3.3. One 32-bit SDRAM channel 12.2.3.4. Two 16-bit SDRAM channels utilizing a single IOBank 12.2.3.5. Two 16-bit or two 32-bit SDRAM channels utilizing two IOBank 12.2.3.6. Four 16-bit SDRAM channels utilizing two IOBank 12.2.3.7. Supports up to 512GB of memory 12.2.3.8. Supports sideband ECC on DDR4/5 12.2.3.9. Supports inband ECC on LPDDR4/5
12.2.5. MPFE and MPFE-lite System Integration x
12.2.5.1. Block Diagram (High Level) 12.2.5.2. IOBank Introduction
12.2.6. MPFE and MPFE-lite Functional Description x
12.2.6.1. Block Diagram 12.2.6.2. Interfaces 12.2.6.3. AxUSER Bit Connectivity 12.2.6.4. Fabric Bypass 12.2.6.5. FPGA-to-SDRAM bridge 12.2.6.6. FPGA-to-HPS bridge 12.2.6.7. MPFE NoC 12.2.6.8. MPFE-lite / MPFE-lite NoC 12.2.6.9. Address Gap Glue Logic 12.2.6.10. Resets Circuitry 12.2.6.11. Clocks Circuitry 12.2.6.12. Preserving SDRAM contents
12.3. EMAC GMII through FPGA Fabric x
12.3.1. GMII to RGMII through RGMII adapter via FPGA HVIOs 12.3.2. GMII to SGMII+ through Multi-Rate Ethernet PHY Adapter via FPGA IOs
12.3.1. GMII to RGMII through RGMII adapter via FPGA HVIOs x
12.3.1.1. Use Cases 12.3.1.2. System Integration 12.3.1.3. Architecture 12.3.1.4. Programming Model 12.3.1.5. RGMII Design Guidelines
12.3.1.3. Architecture x
12.3.1.3.1. HPS GMII to RGMII Adapter Intel FPGA IP 12.3.1.3.2. MDIO Management Interface 12.3.1.3.3. Timestamp Interface 12.3.1.3.4. RGMII HVIO Pin Assignment
12.3.1.5. RGMII Design Guidelines x
12.3.1.5.1. Utilize FPGA Programmable IOE Delay Feature 12.3.1.5.2. Configure External PHY RGMII-Internal Delay (RGMII-ID) 12.3.1.5.3. Introduce Board Trace Delay
13. System Interconnect and Firewalls x
13.1. System Interconnect and Firewalls Differences Among Intel SoC Device Families 13.2. System Interconnect and Firewalls Features 13.3. System Interconnect and Firewalls System Integration 13.4. System Interconnect and Firewalls Functional Description 13.5. System Interconnect and Firewalls Address Map and Register Definitions
13.4. System Interconnect and Firewalls Functional Description x
13.4.1. Initiator and Target Connectivity 13.4.2. Firewall and Security 13.4.3. Transaction Privilege 13.4.4. Arbitration and Quality-of-Service 13.4.5. Observation Network 13.4.6. System Interconnect Clocks 13.4.7. System Interconnect Resets
13.4.2. Firewall and Security x
13.4.2.1. Initiator Firewall and Security 13.4.2.2. Target Firewall and Security 13.4.2.3. F2H Bridge Firewall 13.4.2.4. MPFE Firewalls 13.4.2.5. Other Firewalls
13.4.2.4. MPFE Firewalls x
13.4.2.4.1. CCU-to-DDR Firewalls (MPU Firewall and F2H Firewall) 13.4.2.4.2. Initiator-to-CSR Firewall 13.4.2.4.3. F2SDRAM Firewall 13.4.2.4.4. MPFE Firewall Example
13.4.4. Arbitration and Quality-of-Service x
13.4.4.1. Priority Levels 13.4.4.2. Urgency and Pressure Signals 13.4.4.3. Passing QOS across NoCs 13.4.4.4. QoS Generators 13.4.4.5. Configuring the Quality of Service Logic 13.4.4.6. Programming QoS Limiter Mode 13.4.4.7. Programming QoS Regulator Mode 13.4.4.8. Programming QoS Fixed Mode 13.4.4.9. Bandwidth and Saturation 13.4.4.10. QoS Programming Examples
13.4.4.10. QoS Programming Examples x
13.4.4.10.1. Example: One Initiator Always Takes Precedence 13.4.4.10.2. Example: Tuning for Specific Throughput Requirements
13.4.5. Observation Network x
13.4.5.1. Interconnect Probes Generators 13.4.5.2. Packet Tracing, Profiling, Statistics, Alarms, and Error Logs
14. Error Checking and Correction Controller x
14.1. ECC Differences Among Intel SoC Device Families 14.2. ECC Controller Use Cases 14.3. ECC Controller Features 14.4. ECC Supported Memories 14.5. ECC Controller System Integration 14.6. ECC Controller Functional Description 14.7. ECC Controller Address Map and Register Definitions
14.6. ECC Controller Functional Description x
14.6.1. ECC Structure 14.6.2. Memory Data Initialization 14.6.3. Indirect Memory Access 14.6.4. Error Checking and Correction Algorithm 14.6.5. Error Logging 14.6.6. ECC Controller Interrupts 14.6.7. ECC Controller Initialization and Configuration 14.6.8. ECC Controller Clocks 14.6.9. ECC Controller Reset
14.6.1. ECC Structure x
14.6.1.1. RAM and ECC Memory Organization Example
14.6.3. Indirect Memory Access x
14.6.3.1. Watchdog Timer 14.6.3.2. Data Correction 14.6.3.3. Error Injection 14.6.3.4. Memory Testing
14.6.3.4. Memory Testing x
14.6.3.4.1. Register Interface Tests
14.6.3.4.1. Register Interface Tests x
14.6.3.4.1.1. Single-Bit Error Test for Word-Writeable Memories 14.6.3.4.1.2. Double-Bit Error Test
14.6.5. Error Logging x
14.6.5.1. Recent Error Address Registers 14.6.5.2. Single-Bit Error Occurrence 14.6.5.3. Single-Bit Error Look-Up Table
14.6.6. ECC Controller Interrupts x
14.6.6.1. Single-Bit Error Interrupts 14.6.6.2. Double-Bit Error Interrupt 14.6.6.3. Interrupt Testing 14.6.6.4. Interrupt Testing
14.6.6.1. Single-Bit Error Interrupts x
14.6.6.1.1. All Single-Bit Error Interrupt 14.6.6.1.2. LUT Overflow Interrupt 14.6.6.1.3. Counter Match Interrupt
15. CoreSight Debug and Trace x
15.1. CoreSight* Debug and Trace Differences Among Intel SoC Device Families 15.2. CoreSight Debug and Trace Use Cases 15.3. CoreSight Debug and Trace Features 15.4. CoreSight* Debug and Trace System Integration 15.5. CoreSight Debug and Trace Functional Description 15.6. CoreSight Debug and Trace Programming Model 15.7. CoreSight* Debug and Trace Address Map and Register Definitions
15.2. CoreSight Debug and Trace Use Cases x
15.2.1. CPU Static Debug 15.2.2. CPU Trace using Embedded Trace Macrocell
15.3. CoreSight Debug and Trace Features x
15.3.1. Debug 15.3.2. Trace
15.3.1. Debug x
15.3.1.1. CPU Performance Events 15.3.1.2. Cross Triggers 15.3.1.3. Fabric Coresight APB
15.3.2. Trace x
15.3.2.1. System Trace Macrocell 15.3.2.2. NoC Trace 15.3.2.3. Fabric Coresight Trace
15.3.2.3. Fabric Coresight Trace x
15.3.2.3.1. Fabric Trace using CoreSight Trace Network 15.3.2.3.2. Timestamp Correlation using ATB SYNCREQ 15.3.2.3.3. Timestamp Correlation using STM HWEVENT
15.5. CoreSight Debug and Trace Functional Description x
15.5.1. Debug APB 15.5.2. Trace Subsystem 15.5.3. Cross Triggers 15.5.4. Timestamp 15.5.5. Embedded Cross Trigger System 15.5.6. HPS Debug APB Interface 15.5.7. FPGA Interface 15.5.8. Interrupts
15.5.1. Debug APB x
15.5.1.1. ROM Tables & Topology Detection 15.5.1.2. DAP SWJ-DP JTAG I/O Connectivity 15.5.1.3. DAP SWJ-DP Debug Clock Enable Request 15.5.1.4. Debug Reset 15.5.1.5. DAP SWJ-DP TargetID 15.5.1.6. DAP TDO Output to SDM in Daisy Chain Mode
15.5.1.4. Debug Reset x
15.5.1.4.1. Debug Reset Request via Reset Manager CSR 15.5.1.4.2. Debug Reset Request via DAP SWJ-DP 15.5.1.4.3. Debug Reset Limitation
15.5.2. Trace Subsystem x
15.5.2.1. Embedded Trace Macrocell (ETM) 15.5.2.2. System Trace Macrocell (STM) 15.5.2.3. PSS NOC and MPFE NOC 15.5.2.4. AMBA* Trace Bus (ATB) 15.5.2.5. Trace Port Interface Unit (TPIU) 15.5.2.6. Embedded Trace FIFO (ETF) 15.5.2.7. Embedded Trace Router (ETR) 15.5.2.8. ATB IDs 15.5.2.9. NOC Trace Observability 15.5.2.10. STM HWEVENT Connectivity
15.5.2.9. NOC Trace Observability x
15.5.2.9.1. Error Probes 15.5.2.9.2. Packet Probes 15.5.2.9.3. Transaction Probes
15.5.3. Cross Triggers x
15.5.3.1. CTI-GT 15.5.3.2. CTI-NOC 15.5.3.3. CTI-5 15.5.3.4. CTI-FPGA 15.5.3.5. CTI-MPU
15.5.4. Timestamp x
15.5.4.1. Timestamp Interpolater
15.5.5. Embedded Cross Trigger System x
15.5.5.1. Cross Trigger Interface 15.5.5.2. Cross Trigger Matrix
15.5.7. FPGA Interface x
15.5.7.1. DAP 15.5.7.2. System Trace Macrocell (STM) 15.5.7.3. CTI-FPGA 15.5.7.4. Trace Port Interface Unit (TPIU) 15.5.7.5. CoreSight* Debug and Trace Clocks 15.5.7.6. CoreSight* Debug and Trace Resets
15.6. CoreSight Debug and Trace Programming Model x
15.6.1. CoreSight Component Address 15.6.2. CTI Trigger Connections to Outside the Debug System 15.6.3. Configuring Embedded Cross-Trigger Connections
15.6.2. CTI Trigger Connections to Outside the Debug System x
15.6.2.1. CTI 15.6.2.2. FPGA-CTI 15.6.2.3. L3-CTI
15.6.3. Configuring Embedded Cross-Trigger Connections x
15.6.3.1. Configuring Trigger Input 0 15.6.3.2. Triggering a Flush of Trace Data to the TPIU 15.6.3.3. Triggering an STM Message 15.6.3.4. Triggering a Breakpoint on CPU 1
A. Appendix x
A.1. Booting and Configuration A.2. HPS Use of SDM QSPI Controller A.3. Security A.4. Operational Status of the HPS to the FPGA Logic
A.1. Booting and Configuration x
A.1.1. Booting and Configuration Features A.1.2. Booting and Configuration FPGA Configuration First Mode Overview A.1.3. Booting and Configuration HPS Boot First Mode Overview A.1.4. Booting and Configuration Device Response to External Configuration and Reset Events
A.2. HPS Use of SDM QSPI Controller x
A.2.1. HPS Use of SDM QSPI Controller Differences Among Intel SoC Device Families A.2.2. HPS Use of SDM QSPI Controller Use Cases A.2.3. HPS Use of SDM QSPI Controller Features A.2.4. HPS Use of SDM QSPI Controller System Integration A.2.5. HPS Use of SDM QSPI Controller Signal Description A.2.6. HPS Use of SDM QSPI Controller Functional Description A.2.7. HPS Use of SDM QSPI Controller Programming Model A.2.8. HPS Use of SDM QSPI Controller Address Map and Register Definitions A.2.9. HPS Use of SDM QSPI Controller Design Guidelines and Examples
A.2.6. HPS Use of SDM QSPI Controller Functional Description x
A.2.6.1. Data Target Interface A.2.6.2. Register Target Interface A.2.6.3. Local Memory Buffer A.2.6.4. Arbitration between Direct/Indirect Access Controller and STIG A.2.6.5. Configuring the Flash Device A.2.6.6. Write Protection A.2.6.7. Data Target Sequential Access Detection A.2.6.8. Clocks A.2.6.9. Resets A.2.6.10. Interrupts
A.2.6.1. Data Target Interface x
A.2.6.1.1. Direct Access Mode A.2.6.1.2. Indirect Access Mode
A.2.6.1.1. Direct Access Mode x
A.2.6.1.1.1. Data Target Remapping Example A.2.6.1.1.2. AHB
A.2.6.1.2. Indirect Access Mode x
A.2.6.1.2.1. Indirect Read Operation A.2.6.1.2.2. Indirect Write Operation A.2.6.1.2.3. Consecutive Reads and Writes
A.2.6.2. Register Target Interface x
A.2.6.2.1. STIG Operation
A.2.7. HPS Use of SDM QSPI Controller Programming Model x
A.2.7.1. Setting Up the QSPI Flash Controller A.2.7.2. Indirect Read Operation A.2.7.3. Indirect Write Operation
A.2.9. HPS Use of SDM QSPI Controller Design Guidelines and Examples x
A.2.9.1. Ownership and Control of Quad SPI Controller A.2.9.2. Using a Single Flash for both FPGA Configuration and HPS Mass Storage A.2.9.3. Pin Features and Connections for SDM QSPI
A.3. Security x
A.3.1. Security Differences Among Intel SoC Device Families A.3.2. ARM Security ISA A.3.3. Secure Device Manager A.3.4. Configuration Bitstream A.3.5. HPS Secure Boot A.3.6. HPS Debug A.3.7. Available Security Documentation
A.4. Operational Status of the HPS to the FPGA Logic x
A.4.1. Overview A.4.2. Software Requirements A.4.3. Signal Behavior Event Diagrams A.4.4. SDM Gated Signals
A.4.1. Overview x
A.4.1.1. SDM Gated Signals A.4.1.2. HPS Events A.4.1.3. FPGA Events
A.4.2. Software Requirements x
A.4.2.1. FPGA Boot First Mode A.4.2.2. HPS Boot First Mode
A.4.3. Signal Behavior Event Diagrams x
A.4.3.1. FPGA User Mode Entry A.4.3.2. HPS Warm Reset Event A.4.3.3. HPS Cold Reset Event A.4.3.4. Watchdog Causes HPS Warm Reset Event A.4.3.5. Watchdog Causes HPS Cold Reset Event
1. Agilex™ 5 Hard Processor System Technical Reference Manual Revision History
2. Introduction to the Hard Processor System
3. Micro Processor Unit (MPU)
4. Application Processor Subsystem
5. Peripheral Subsystem
6. System Manager
7. Clock Manager
8. Reset Manager
9. Power Management
10. Address Map
11. Bridges
12. Interfaces
13. System Interconnect and Firewalls
14. Error Checking and Correction Controller
15. CoreSight Debug and Trace
16. HPS Register Map
A. Appendix

5.3.6.4.4.1. Operation in Generic Work Mode

In generic work mode, the command engine module is bypassed allowing to send low level commands directly to the mini controller unit. The mini controller then creates the commands that can be processed by the NAND Flash device. In this operation mode, the host software is responsible of performing the low level process that is normally done by the command engine. This operation mode is expected to be used only when CDMA and PIO modes are not sufficient.

In generic work mode, only command 0, command 2, and command 3 registers are used. Similarly to the other work modes, the operation is triggered when command 0 register gets written. In this operation mode, only the slave DMA interface is used for data transfer.

The following tables describe the command layout that applies for this work mode. The unused fields labeled as Reserved should be set to 0.

Command 0 (offset 0x0000) Description

Table 201.   Structure of Command 0 Register in Generic Work Mode
Bit Name Description
31:30 CT The 2'b11 value indicates the generic work mode.
29:27 Reserved Reserved
26:24 TRD_NUM This field selects destination thread number for command. Software can select any available thread. Commands can be issued in parallel to all threads.
23:21 Reserved Reserved
20 INT If this bit is set, then an interrupt should be issued after this operation is finished. The status of the triggered interrupt is reported in trdX_comp field in the trd_comp_intr_status (0x0138) register, where interrupt bit is selected by the thread number selected by the TRD_NUM field (one bit per thread).
19:0 Reserved Reserved

Command 2 (offset 0x0008) Description

Table 202.   Structure of Command 2 Register in Generic Work Mode
Bit Name Description
31:0 CMD_VAL_L This field store lower part of the mini controller command

Command 3 (offset 0x000c) Description

Table 203.   Structure of Command 3 Register in Generic Work Mode
Bit Name Description
31:0 CMD_VAL_H This field store higher part of the mini ontroller command

The CMD_VAL_H and CMD_VAL_L fields are concatenated into one 64-bit word. These registers define the command requested to the mini controller to send to the NAND Flash device. The following table describes the structure of the command.

Table 204.   Field Definitions of a Command in Generic Work Mode
Bit Name Description
63:11 Input

Additional input values required in command sequence. The possible values could be command values, address values or number of data bytes to transfer. The required input to each sequence is defined in the following table Description of Sequences Available in Generic Work Mode. Bits that are not defined in the sequence should be set to zero.

Bit 15 is common for all sequences. It is used as a chip enable hold indicator (ce_hold). When set to 1, the controller does not turn off the active chip enable signal at the end of the sequence. The active chip enable is turned off at the end of the sequence when ce_hold is set to 0 or when incoming sequence is targeted to different device (different CE).

ce_hold should only be used for volume assignment process. Some devices may require keeping the CE# low through the whole set feature sequence and ce_hold can also be used for this purpose. During normal operation, this bit should be turned off.

Some instructions with address phase define the field No_of_BYTES. This field indicates how many address bytes to send to the NAND Flash device.

Devices with lower number of row address cycles are supported:

No_of_BYTES = 0 - one address byte sent to the device

No_of_BYTES = 1 - two address byte sent to the device

No_of_BYTES = 2 - three address byte sent to the device

No_of_BYTES = 3 - four address byte sent to the device

No_of_BYTES = 4 - five address byte sent to the device

No_of_BYTES = 5 - six address byte sent to the device

10:8

Bank num

This field informs the mini controller on which memory device the sequence needs to be executed (NAND device chip select). Only one chip is supported by HPS.
7

jedec_supp

The bit informs the mini controller about which set of commands will be used in the sequence. Primary commands complaint with ONFI spec (‘0’ value) or secondary commands compliant with Jedec spec (‘1’). This bit is valid only for a few commands as shown in the following table Description of Sequences Available in Generic Work Mode. For commands that do not use this bit, this bit should be set to 0.
6

tWB active

This bit tells the mini controller if it must wait for tWB time after sending the last CMD/ADDR/DATA in the sequence. This is relevant for the sequences 0, 1, 2. For other sequences, set this bit to 0
5:0

Instruction Type

This field defines the type of instruction. The assigned corresponding values are described in the following table Description of Sequences Available in Generic Work Mode.

Commands like read status, read status enhanced, and read ID must be directly followed by the data transfer. The list of sequences available in the generic work mode is shown in the following table. The information required to create the command is provided for each one of the sequences supported.

Table 205.  Description of Sequences Available in Generic Work Mode
Instruction Name Instruction Type Input [63:11]
CMD Sequence 0 [23:16] CMD

Execute command sequence on the NAND Flash interface.

Figure 101. CMD Sequence

ADDR Sequence

1

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute address sequence on the NF interface. Up to six bytes of address can be sent in one sequence, maximum value of No_of_BYTES is five (six address cycles).

Figure 102. ADDR Sequence
Data Sequence 2

[62] di_strip

[58:56] corr_cap

[55:40] last_sector_size

[39:32] sector_cnt

[31:16] sector_size

[14] erased_page_detect_enable

[13] scrambler_enable

[12] ecc_enable

[11] direction

Transfer the data over the NF interface. The controller transfers the number of sectors defined in sector_cnt field. First it transfers n-1 sector of size defined by sector_size field. Then the controller transfers a sector of a size defined by the last_sector_size. If the sector_cnt is one, then 1 sector of size defined with last_sector_size is transferred. If sector_cnt is 0 or last_sector_size is 0, then the data sequence is not triggered. If sector_cnt is greater than one and sector_size is 0, the data sequence is not triggered. Every sector starts with a new data word transferred from/to data FIFO.

The controller automatically aligns the number of data written to/read from the NAND Flash device depending on the work mode. In 8-bit SDR work mode, if param_extended_X_mode is set high, the number of data is aligned to the 8-bit. In 8-bit SDR work mode, if param_extended_X_mode is set low, the number of data is aligned to the 16-bit. In 16-bit SDR work mode, if param_extended_X_mode is set high the number of data is aligned to the 16-bit. In 16-bit SDR work mode, if param_extended_X_mode is set low, the number of data is aligned to the 32-bit. In DDR work mode the number of data is aligned to the 16-bit.

The controller can skip sending certain number of bytes during the transfer. This is, the controller starts sending dummy bytes to the NAND Flash device (bytes defined by marker field in the skip_bytes_conf register). The number of bytes is defined by the skip_bytes field in the skip_bytes_conf register. The controller sends dummy bytes starting from offset defined by the skip_bytes_offset field. The offset is counted from the beginning of the transferred data package. The controller does not take into account the column address when calculating offset. This feature is enabled when skip_byte field is not 0 and skip_bytes_offset is not 0.

  • di_strip: data integrity strip bytes. This is valid when data integrity is enabled. If di_strip is low the data integrity data is sent to the NAND Flash device. This bit should not be set if erased pages detection feature is enabled, because in read direction the controller adds the CRC data to the data stream and it masks the erased pages presence.
  • corr_cap: correction capability.
  • last_sector_size: number of data to transfer in the last sector. This value cannot be zero. last_ sector_size value cannot be lower than 4B when sector_cnt is higher than 1.
  • sector_cnt: defines the number of sectors to transfer within a single sequence. The overall number of data to transfer equals (sector_size *(sector_cnt-1) + last_sector_size).This value cannot be zero.
  • sector_size: number of data to transfer per each sector except the last one. If the sector_cnt is greater than one, then this value cannot be zero. When ECC engine is enable, the sector size values do not include the ECC bits added in the sector, but they need to be considered to determine if all data and ECC information fits in a page in the NAND Flash device. sector_size value cannot be lower than 4B.
  • erased_page_detect_enable: 1'b0 indicates erased page detection is disabled, 1'b1 indicates that erased page detection is enabled.
  • scrambler_enable: 1'b0 indicates that Scrambler is disabled,1'b1indicates Scrambler is enabled.
  • ecc_enable: 1'b0 indicates that ECC is disabled (only data transfer occurs), 1'b1 indicates that ECC is enabled (data and ECC data transfer occurs).
  • direction: 1'b0 indicates read from NAND Flash device, 1'b1 indicates write to NAND Flash device.
Figure 103. Data Sequence
Read Sequence 3

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <00><ADDR><30> command sequence +tWB. The allowed No_of_BYTES values are three to five (four to six address cycles).

Figure 104. Read Sequence

Write Sequence

4

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <80><ADDR> command sequence +tADL for jedec_supp = 1'b0 or <81><ADDR> +tADL for jedec_supp = 1'b1. The allowed No_of_BYTES values are three to five (four to six address cycles).

Figure 105. Write Sequence

Reset Sequence

5 N/A

Execute <FF> command sequence +tFEAT.

Figure 106. Reset Sequence

Erase Sequence

6

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <60><ADDR><d0> command sequence +tWB. The allowed No_of_BYTES values are one to three (two to four address cycles).

Figure 107. Erase Sequence

Read Status Sequence

7

[11] F2_enable

Execute <70> or <F1/F2> sequence +tWHR.

If jedec_supp = 1’b0, the mini controller sends 70h. If jedec_supp = 1'b1, the mini controller sends the secondary command code F1h or F2h. The field F2_enable distinguish the type of command. If F2_enable is 1'b0 then F1h command is sent to the device. If F2_enable is 1'b1 then F2h command is sent to the device. This command must be directly followed by the data transfer.

Figure 108. Read Status Sequence

Read Status Enhanced Sequence

8

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <78><ADDR> sequence +tWHR. The allowed No_of_BYTES values are one to three (two to four address cycles). This command must be directly followed by the data transfer.

Figure 109. Read Status Enhanced Sequence

Read Cache Random Sequence

9

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <00><ADDR><31> command sequence +tWB for jedec_supp = 1'b0 or <60><ADDR><3C> +tWB for jedec_supp = 1'b1. The allowed No_of_BYTES values are three to five (four to six address cycles).

Figure 110. Read Cache Random Sequence

Copyback Read Sequence

10

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <00><ADDR><35> command sequence +tWB for jedec_supp = 1'b0 or <60><ADDR><35> +tWB for jedec_supp = 1'b1. The allowed No_of_BYTES values are one, two, three, four and five (two, three, four, five and six address cycles) depending on the jedec_supp setting. If jedec_supp = 1'b0 the allowed No_of_BYTES values are three and four and if jedec_supp = 1'b1 the allowed No_of_BYTES values are one and two.

Figure 111. Copyback Read Sequence

Copyback Program Sequence

11

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <85><ADDR> command sequence + tADL. The allowed No_of_BYTES values are three to five (four to six address cycles).

Figure 112. Copyback Program Sequence

Change Read Column Sequence

12

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <05><2xADDR><E0> command sequence +tCCS for jedec_supp = 1'b0 or <05><ADDR><E0> command sequence +tCCS for jedec_supp = 1'b1. If the jedec_supp is zero the number of address cycles is fixed to two, otherwise the number of address cycles depends on the No_of_BYTES. In this last case the allowed No_of_BYTES values are three, four or five (four, five or six address cycles).

Figure 113. Change Read Column Sequence

Change Read ColumnEnhanced Sequence

13

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <06><ADDR><E0> command sequence +tCCS. The allowed No_of_BYTES values are three to five (four to six address cycles).

Figure 114. Change Read Column Enhanced Sequence

Change Read Column Jedec Sequence

14

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <00><ADDR><05><2xADDR><E0> command sequence +tCCS. The allowed No_of_BYTES values are three to five (four to six address cycles).

Figure 115. Change Read Column Jedec Sequence

Multi-plane Read Sequence

15

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <00><ADDR><32> command sequence +tWB for jedec_supp = 1'b0 or <60><ADDR> for jedec_supp = 1'b1. The allowed No_of_BYTES values are one, two, three and four (two, three, four and five address cycles). If jedec_supp = 1'b0 the allowed No_of_BYTES values are three and four and if jedec_supp = 1'b1 the allowed No_of_BYTES values are one and two.

Figure 116. Multi-plane Read Sequence (jedec_supp=0)
Figure 117. Multi-plane Read Sequence (jedec_supp=1)

Multi-plane Block Erase Sequence

16

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <60><ADDR><D1> command sequence +tWB. The allowed No_of_BYTES values are one to three (two to four address cycles).

Figure 118. Multi-plane Block Erase Sequence

Multi-plane Block Erase Sequence ONFI®-Jedec

17

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <60><ADDR><60><ADDR><D0> command sequence +tWB. The allowed No_of_BYTES values are one and two (two and three address cycles). The controller sends consecutive address bytes in both address sequences. If two address bytes need to be sent in each address sequence controller sends ADDR0, ADDR1 in first sequence and ADDR2, ADDR3 in second sequence. For three address bytes case, the controller sends ADDR0, ADDR1, ADDR2 in the first address sequence and ADDR3, ADDR4, ADDR5 in the second address sequence.

Figure 119. Multi-plane Block Erase Sequence ONFI®-Jedec

Change Write Column Sequence

18

[31:24] ADDR1

[23:16] ADDR0

Execute <85> + tCWAW + <2xADDR> command sequence +tCCS.

Figure 120. Change Write Column Sequence

Change Row Address / Small Data Move Sequence

19

[63:56] ADDR5

[55:48] ADDR4

[47:40] ADDR3

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <85><ADDR> command sequence +tCCS. The allowed No_of_BYTES values are three to five (four to six address cycles).

Figure 121. Change Row Address / Small Data Move Sequence

Synchronous Reset Sequence

20 N/A

Execute <FC> command sequence +tWB.

Figure 122. Synchronous Reset Sequence

Volume Select Sequence

21 [23:16] ADDR0

Execute <E1><1xADDR> command sequence +tVDLY.

Figure 123. Volume Select Sequence

ODT Configure Sequence

22

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <E2><ADDR> command sequence +tADL. The allowed No_of_BYTES values are zero and one (one and two address cycles).

Figure 124. ODT Configure Sequence

Set Features Sequence

23

[23:16] ADDR0

Execute <EF><1xADDR> command sequence +tADL. Some devices may have to keep the CE# low through the whole Set Feature sequence. ce_hold can be used for this purpose.

Figure 125. Set Features Sequence

Get Features Sequence

24

[23:16] ADDR0

Execute <EE><1xADDR> command sequence +tWB.

Figure 126. Get Features Sequence

LUN Get Features Sequence

25

[31:24] ADDR1

[23:16] ADDR0

Execute <D4><2xADDR> command sequence +tWB.

Figure 127. LUN Get Features Sequence

LUN Set Features Sequence

26

[31:24] ADDR1

[23:16] ADDR0

Execute <D5><2xADDR> command sequence +tADL.

Figure 128. LUN Set Features Sequence

Read ID Sequence

27

[23:16] ADDR0

Execute <90><1xADDR> command sequence +tWHR. This command must be directly followed by the data transfer.

Figure 129. Read ID Sequence

Read Parameter Page Sequence

28

[23:16] ADDR0

Execute <EC><1xADDR> command sequence +tWB.

Figure 130. Read Parameter Page Sequence

LUN Reset Sequence

31

[39:32] ADDR2

[31:24] ADDR1

[23:16] ADDR0

[13:11] No_of_BYTES

Execute <FA><ADDR> sequence +tWB. The allowed No_of_BYTES values are one and two (two and three address cycles).

Figure 131. LUN Reset Sequence
Level Two Title