Power Management User Guide: Agilex™ 5 FPGAs and SoCs

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ID 813161
Date 7/08/2024
Public
Document Table of Contents
Document Table of Contents x
1. Agilex™ 5 Power Management Overview 2. Agilex™ 5 Power Basics 3. Agilex™ 5 Power and I/O State Sequencing 4. Agilex™ 5 Sensor Monitoring System 5. Agilex™ 5 Power Optimization Techniques and Features 6. Document Revision History for the Power Management User Guide: Agilex™ 5 FPGAs and SoCs
1. Agilex™ 5 Power Management Overview x
1.1. Power System Design Phases 1.2. Power Supplies
1.1. Power System Design Phases x
1.1.1. Choosing a Power Tree 1.1.2. Power Estimation 1.1.3. Power Optimization 1.1.4. Power Generation
2. Agilex™ 5 Power Basics x
2.1. Power Consumption 2.2. Power Estimation Basics 2.3. Intel® FPGA Power and Thermal Calculator 2.4. Power Analyzer
3. Agilex™ 5 Power and I/O State Sequencing x
3.1. Overview 3.2. Power-Up Sequence Requirements 3.3. Floating Voltage 3.4. Power-On Reset
3.2. Power-Up Sequence Requirements x
3.2.1. Guidelines for I/O Pins in HSIO, HVIO, HPS IO, and SDM IO Banks During Power Sequencing
3.4. Power-On Reset x
3.4.1. Power Supplies Monitored by the POR Circuitry
4. Agilex™ 5 Sensor Monitoring System x
4.1. Voltage Monitoring System 4.2. Temperature Monitoring System 4.3. Sensors Design Considerations
4.1. Voltage Monitoring System x
4.1.1. Voltage Sensor Transfer Function 4.1.2. Voltage Sensor Voltage Reference Pins
4.2. Temperature Monitoring System x
4.2.1. Local Temperature Sensor 4.2.2. Remote Temperature Sensing Diode 4.2.3. Temperature Sensor Locations 4.2.4. Retrieving Local Temperature Sensor Reading 4.2.5. Temperature Sensor Error Codes
4.3. Sensors Design Considerations x
4.3.1. Voltage Monitor Design Guidelines 4.3.2. Guidelines: Connecting External Reference to the Agilex™ 5 Voltage Reference Pins 4.3.3. Temperature Monitor Design Guidelines 4.3.4. Guidelines: Calibrate Temperature Sensing Chip Interfacing the Agilex™ 5 Remote TSD
5. Agilex™ 5 Power Optimization Techniques and Features x
5.1. SmartVID Standard Power Devices 5.2. DSP and M20K Power Gating 5.3. Clock Gating 5.4. Power Sense Line 5.5. Power Optimization Techniques in the Quartus® Prime Software
5.1. SmartVID Standard Power Devices x
5.1.1. SmartVID Feature Implementation in Agilex™ 5 Devices 5.1.2. SDM Power Manager 5.1.3. Temperature Compensation 5.1.4. Agilex™ 5 Power Management and VID Implementation Guide
5.1.2. SDM Power Manager x
5.1.2.1. PMBus Master Mode 5.1.2.2. PMBus Slave Mode 5.1.2.3. Fail Safe Mechanism 5.1.2.4. Fault Management and Error Reporting
5.1.4. Agilex™ 5 Power Management and VID Implementation Guide x
5.1.4.1. Specifying Power Management and VID Parameters and Options
5.1.4.1. Specifying Power Management and VID Parameters and Options x
5.1.4.1.1. Configuration Pin Parameters 5.1.4.1.2. Power Management and VID Parameters 5.1.4.1.3. Power Management and VID Interface QSF Constraint Guide
1. Agilex™ 5 Power Management Overview
2. Agilex™ 5 Power Basics
3. Agilex™ 5 Power and I/O State Sequencing
4. Agilex™ 5 Sensor Monitoring System
5. Agilex™ 5 Power Optimization Techniques and Features
6. Document Revision History for the Power Management User Guide: Agilex™ 5 FPGAs and SoCs

4.3.3. Temperature Monitor Design Guidelines

You can measure the on-chip temperature of the core fabric through the remote TSDs while the device is powered on or powered off. However, the local temperature sensors are available only after the device is powered up and configured.
  • Connect the remote TSD pins to external temperature sensing devices to monitor the on-chip temperature.
  • To interface with the remote TSD, use temperature sensing chips with features that allow you to perform calibration and measurement compensation to improve accuracy, such as:
    • Configurable ideality factor
    • Offset adjustment with or without Beta compensation
  • Keep the resistance of both board traces to the remote TSD p and n pins to less than 0.2 Ω.
  • Route both traces in equal lengths and shield them.
  • Altera recommends a 10-mils width and space for both traces.
  • Route both traces through the most minimum number of vias and crossunders possible to minimize the thermocouple effects.
  • Ensure that the number of vias for both traces are the same.
  • To avoid coupling, insert a GND plane between the remote TSD pins traces and high-frequency toggling signals, such as clocks and I/O signals.
  • To filter high-frequency noise, place an external capacitor between the traces close to the external sensors.
  • If you use only the local temperature sensors, you can leave the remote TSD p and n pins unconnected.

For details about device specifications and connection guidelines, refer to the external temperature sensor manufacturer's documentation.

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