Power Management User Guide: Agilex™ 5 FPGAs and SoCs

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ID 813161
Date 7/08/2024
Public
Document Table of Contents
Document Table of Contents x
1. Agilex™ 5 Power Management Overview 2. Agilex™ 5 Power Basics 3. Agilex™ 5 Power and I/O State Sequencing 4. Agilex™ 5 Sensor Monitoring System 5. Agilex™ 5 Power Optimization Techniques and Features 6. Document Revision History for the Power Management User Guide: Agilex™ 5 FPGAs and SoCs
1. Agilex™ 5 Power Management Overview x
1.1. Power System Design Phases 1.2. Power Supplies
1.1. Power System Design Phases x
1.1.1. Choosing a Power Tree 1.1.2. Power Estimation 1.1.3. Power Optimization 1.1.4. Power Generation
2. Agilex™ 5 Power Basics x
2.1. Power Consumption 2.2. Power Estimation Basics 2.3. Intel® FPGA Power and Thermal Calculator 2.4. Power Analyzer
3. Agilex™ 5 Power and I/O State Sequencing x
3.1. Overview 3.2. Power-Up Sequence Requirements 3.3. Floating Voltage 3.4. Power-On Reset
3.2. Power-Up Sequence Requirements x
3.2.1. Guidelines for I/O Pins in HSIO, HVIO, HPS IO, and SDM IO Banks During Power Sequencing
3.4. Power-On Reset x
3.4.1. Power Supplies Monitored by the POR Circuitry
4. Agilex™ 5 Sensor Monitoring System x
4.1. Voltage Monitoring System 4.2. Temperature Monitoring System 4.3. Sensors Design Considerations
4.1. Voltage Monitoring System x
4.1.1. Voltage Sensor Transfer Function 4.1.2. Voltage Sensor Voltage Reference Pins
4.2. Temperature Monitoring System x
4.2.1. Local Temperature Sensor 4.2.2. Remote Temperature Sensing Diode 4.2.3. Temperature Sensor Locations 4.2.4. Retrieving Local Temperature Sensor Reading 4.2.5. Temperature Sensor Error Codes
4.3. Sensors Design Considerations x
4.3.1. Voltage Monitor Design Guidelines 4.3.2. Guidelines: Connecting External Reference to the Agilex™ 5 Voltage Reference Pins 4.3.3. Temperature Monitor Design Guidelines 4.3.4. Guidelines: Calibrate Temperature Sensing Chip Interfacing the Agilex™ 5 Remote TSD
5. Agilex™ 5 Power Optimization Techniques and Features x
5.1. SmartVID Standard Power Devices 5.2. DSP and M20K Power Gating 5.3. Clock Gating 5.4. Power Sense Line 5.5. Power Optimization Techniques in the Quartus® Prime Software
5.1. SmartVID Standard Power Devices x
5.1.1. SmartVID Feature Implementation in Agilex™ 5 Devices 5.1.2. SDM Power Manager 5.1.3. Temperature Compensation 5.1.4. Agilex™ 5 Power Management and VID Implementation Guide
5.1.2. SDM Power Manager x
5.1.2.1. PMBus Master Mode 5.1.2.2. PMBus Slave Mode 5.1.2.3. Fail Safe Mechanism 5.1.2.4. Fault Management and Error Reporting
5.1.4. Agilex™ 5 Power Management and VID Implementation Guide x
5.1.4.1. Specifying Power Management and VID Parameters and Options
5.1.4.1. Specifying Power Management and VID Parameters and Options x
5.1.4.1.1. Configuration Pin Parameters 5.1.4.1.2. Power Management and VID Parameters 5.1.4.1.3. Power Management and VID Interface QSF Constraint Guide
1. Agilex™ 5 Power Management Overview
2. Agilex™ 5 Power Basics
3. Agilex™ 5 Power and I/O State Sequencing
4. Agilex™ 5 Sensor Monitoring System
5. Agilex™ 5 Power Optimization Techniques and Features
6. Document Revision History for the Power Management User Guide: Agilex™ 5 FPGAs and SoCs

4.3.2. Guidelines: Connecting External Reference to the Agilex™ 5 Voltage Reference Pins

The Agilex™ 5 voltage sensor has two dedicated voltage reference pins, VREFP_ADC and VREFN_ADC. Follow these guidelines when you connect an external voltage reference to the VREFP_ADC and VREFN_ADC pins.
  • To minimize noise coupling to the power rail, Altera recommends that you keep the external VREF source as close as possible to the VREFP_ADC and VREFN_ADC pins.
  • Route the reference traces as a tightly-coupled differential pair to the package ball with ground shielding.
  • You must place a 10 µF and a 1 µF board capacitors to decouple the VREFP_ADC and VREFN_ADC pins.
  • Place the 1 µF board capacitor as close as possible to the package balls.
Figure 10. Board Capacitors to Decouple VREFP_ADC and VREFN_ADC Pins


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