Power Management User Guide: Agilex™ 5 FPGAs and SoCs

Download PDF
ID 813161
Date 11/04/2024
Public
Document Table of Contents
Document Table of Contents x
1. Agilex™ 5 Power Management Overview 2. Agilex™ 5 Power Basics 3. Agilex™ 5 Power and I/O State Sequencing 4. Agilex™ 5 Sensor Monitoring System 5. Agilex™ 5 Power Optimization Techniques and Features 6. Document Revision History for the Power Management User Guide: Agilex™ 5 FPGAs and SoCs
1. Agilex™ 5 Power Management Overview x
1.1. Power System Design Phases 1.2. Power Supplies
1.1. Power System Design Phases x
1.1.1. Choosing a Power Tree 1.1.2. Power Estimation 1.1.3. Power Optimization 1.1.4. Power Generation
2. Agilex™ 5 Power Basics x
2.1. Power Consumption 2.2. Power Estimation Basics 2.3. Power and Thermal Calculator 2.4. Power Analyzer
3. Agilex™ 5 Power and I/O State Sequencing x
3.1. Overview 3.2. Power-Up Sequence Requirements 3.3. Floating Voltage 3.4. Power-On Reset
3.2. Power-Up Sequence Requirements x
3.2.1. Guidelines for I/O Pins in HSIO, HVIO, HPS IO, and SDM IO Banks During Power Sequencing
3.4. Power-On Reset x
3.4.1. Power Supplies Monitored by the POR Circuitry
4. Agilex™ 5 Sensor Monitoring System x
4.1. Voltage Monitoring System 4.2. Temperature Monitoring System 4.3. Sensors Design Considerations
4.1. Voltage Monitoring System x
4.1.1. Voltage Sensor Transfer Function 4.1.2. Voltage Sensor Voltage Reference Pins
4.2. Temperature Monitoring System x
4.2.1. Local Temperature Sensor 4.2.2. Remote Temperature Sensing Diode 4.2.3. Temperature Sensor Locations 4.2.4. Retrieving Local Temperature Sensor Reading 4.2.5. Temperature Sensor Error Codes
4.3. Sensors Design Considerations x
4.3.1. Voltage Monitor Design Guidelines 4.3.2. Guidelines: Connecting External Reference to the Agilex™ 5 Voltage Reference Pins 4.3.3. Temperature Monitor Design Guidelines 4.3.4. Guidelines: Calibrate Temperature Sensing Chip Interfacing the Agilex™ 5 Remote TSD
5. Agilex™ 5 Power Optimization Techniques and Features x
5.1. SmartVID Standard Power Devices 5.2. DSP and M20K Power Gating 5.3. Clock Gating 5.4. Power Sense Line 5.5. Power Optimization Techniques in the Quartus® Prime Software
5.1. SmartVID Standard Power Devices x
5.1.1. SmartVID Feature Implementation in Agilex™ 5 Devices 5.1.2. SDM Power Manager 5.1.3. Temperature Compensation 5.1.4. Agilex™ 5 Power Management and VID Implementation Guide
5.1.2. SDM Power Manager x
5.1.2.1. PMBus Master Mode 5.1.2.2. PMBus Slave Mode 5.1.2.3. Fail Safe Mechanism 5.1.2.4. Fault Management and Error Reporting
5.1.4. Agilex™ 5 Power Management and VID Implementation Guide x
5.1.4.1. Specifying Power Management and VID Parameters and Options
5.1.4.1. Specifying Power Management and VID Parameters and Options x
5.1.4.1.1. Configuration Pin Parameters 5.1.4.1.2. Power Management and VID Parameters 5.1.4.1.3. Power Management and VID Interface QSF Constraint Guide
1. Agilex™ 5 Power Management Overview
2. Agilex™ 5 Power Basics
3. Agilex™ 5 Power and I/O State Sequencing
4. Agilex™ 5 Sensor Monitoring System
5. Agilex™ 5 Power Optimization Techniques and Features
6. Document Revision History for the Power Management User Guide: Agilex™ 5 FPGAs and SoCs

4.3.4. Guidelines: Calibrate Temperature Sensing Chip Interfacing the Agilex™ 5 Remote TSD

If you interface an external temperature sensing chip to the Agilex™ 5 remote TSD, you must calibrate the external chip to avoid temperature measurement inaccuracy.

The calibration of the external temperature sensing chip identifies optimized settings such as the temperature offset and change in ideality factor. The external chip uses these settings to accurately sample the temperature from the Agilex™ 5 remote TSD.

Related Information
Level Two Title