External Memory Interfaces Agilex™ 7 M-Series FPGA IP User Guide

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ID 772538
Date 7/08/2024
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Document Table of Contents
Document Table of Contents x
1. About the External Memory Interfaces Agilex™ 7 M-Series FPGA IP 2. Agilex™ 7 M-Series FPGA EMIF IP – Introduction 3. Agilex™ 7 M-Series FPGA EMIF IP – Product Architecture 4. Agilex™ 7 M-Series FPGA EMIF IP – End-User Signals 5. Agilex™ 7 M-Series FPGA EMIF IP – Simulating Memory IP 6. Agilex™ 7 M-Series FPGA EMIF IP – DDR4 Support 7. Agilex™ 7 M-Series FPGA EMIF IP – DDR5 Support 8. Agilex™ 7 M-Series FPGA EMIF IP – LPDDR5 Support 9. Agilex™ 7 M-Series FPGA EMIF IP – Timing Closure 10. Agilex™ 7 M-Series FPGA EMIF IP – Controller Optimization 11. Agilex™ 7 M-Series FPGA EMIF IP – Debugging 12. Document Revision History for External Memory Interfaces Agilex™ 7 M-Series FPGA IP User Guide
1. About the External Memory Interfaces Agilex™ 7 M-Series FPGA IP x
1.1. Release Information
2. Agilex™ 7 M-Series FPGA EMIF IP – Introduction x
2.1. Agilex™ 7 M-Series EMIF IP Protocol and Feature Support 2.2. Agilex™ 7 M-Series EMIF IP Design Flow 2.3. Agilex™ 7 M-Series EMIF IP Design Checklist
3. Agilex™ 7 M-Series FPGA EMIF IP – Product Architecture x
3.1. Agilex™ 7 M-Series EMIF Architecture: Introduction 3.2. Agilex™ 7 M-Series EMIF Sequencer 3.3. Agilex™ 7 M-Series EMIF Controller 3.4. Agilex™ 7 M-Series EMIF IP for Hard Processor Subsystem (HPS)
3.1. Agilex™ 7 M-Series EMIF Architecture: Introduction x
3.1.1. Agilex™ 7 M-Series EMIF Architecture: I/O Subsystem 3.1.2. Agilex™ 7 M-Series EMIF Architecture: I/O SSM 3.1.3. Agilex™ 7 M-Series EMIF Architecture: I/O Bank 3.1.4. Agilex™ 7 M-Series EMIF Architecture: I/O Lane 3.1.5. Agilex™ 7 M-Series EMIF Architecture: Input DQS Clock Tree 3.1.6. Agilex™ 7 M-Series EMIF Architecture: PHY Clock Tree 3.1.7. Agilex™ 7 M-Series EMIF Architecture: PLL Reference Clock Networks 3.1.8. Agilex™ 7 M-Series EMIF Architecture: Clock Phase Alignment 3.1.9. User Clock in Different Core Access Modes
3.1.3. Agilex™ 7 M-Series EMIF Architecture: I/O Bank x
3.1.3.1. Lockstep Configuration 3.1.3.2. DDR4 Pin Placement 3.1.3.3. DDR5 Pin Placement 3.1.3.4. LPDDR5 Pin Placement 3.1.3.5. I/O Sub-Bank Usage
3.2. Agilex™ 7 M-Series EMIF Sequencer x
3.2.1. Agilex™ 7 M-Series Mailbox Structure and Register Definitions
3.2.1. Agilex™ 7 M-Series Mailbox Structure and Register Definitions x
3.2.1.1. Mailbox Supported Commands 3.2.1.2. Mailbox Command Definitions
3.3. Agilex™ 7 M-Series EMIF Controller x
3.3.1. Hard Memory Controller
3.3.1. Hard Memory Controller x
3.3.1.1. Hard Memory Controller Features
4. Agilex™ 7 M-Series FPGA EMIF IP – End-User Signals x
4.1. Agilex™ 7 M-Series EMIF IP Interfaces for DDR4 4.2. Agilex™ 7 M-Series EMIF IP Interfaces for DDR5 4.3. Agilex™ 7 M-Series EMIF IP Interfaces for LPDDR5 4.4. Agilex™ 7 M-Series EMIF IP Interfaces for Calibration Component
4.1. Agilex™ 7 M-Series EMIF IP Interfaces for DDR4 x
4.1.1. ref_clk for External Memory Interfaces (EMIF) IP 4.1.2. core_init_n for External Memory Interfaces (EMIF) IP 4.1.3. usr_async_clk for External Memory Interfaces (EMIF) IP 4.1.4. usr_clk for External Memory Interfaces (EMIF) IP 4.1.5. usr_rst_n for External Memory Interfaces (EMIF) IP 4.1.6. s0_axi4 for External Memory Interfaces (EMIF) IP 4.1.7. mem for External Memory Interfaces (EMIF) IP 4.1.8. oct for External Memory Interfaces (EMIF) IP
4.2. Agilex™ 7 M-Series EMIF IP Interfaces for DDR5 x
4.2.1. ref_clk for External Memory Interfaces (EMIF) IP 4.2.2. core_init_n for External Memory Interfaces (EMIF) IP 4.2.3. usr_async_clk for External Memory Interfaces (EMIF) IP 4.2.4. usr_clk for External Memory Interfaces (EMIF) IP 4.2.5. usr_rst_n for External Memory Interfaces (EMIF) IP 4.2.6. s0_axi4 for External Memory Interfaces (EMIF) IP 4.2.7. mem for External Memory Interfaces (EMIF) IP 4.2.8. i3c for External Memory Interfaces (EMIF) IP 4.2.9. mem_lbd for External Memory Interfaces (EMIF) IP 4.2.10. mem_lbs for External Memory Interfaces (EMIF) IP 4.2.11. oct for External Memory Interfaces (EMIF) IP
4.3. Agilex™ 7 M-Series EMIF IP Interfaces for LPDDR5 x
4.3.1. ref_clk for External Memory Interfaces (EMIF) IP 4.3.2. core_init_n for External Memory Interfaces (EMIF) IP 4.3.3. usr_async_clk for External Memory Interfaces (EMIF) IP 4.3.4. usr_clk for External Memory Interfaces (EMIF) IP 4.3.5. usr_rst_n for External Memory Interfaces (EMIF) IP 4.3.6. s0_axi4 for External Memory Interfaces (EMIF) IP 4.3.7. mem for External Memory Interfaces (EMIF) IP 4.3.8. oct for External Memory Interfaces (EMIF) IP
4.4. Agilex™ 7 M-Series EMIF IP Interfaces for Calibration Component x
4.4.1. s0_axi4lite_clk for External Memory Interface Calibration Component 4.4.2. s0_axi4lite_rst_n for External Memory Interface Calibration Component 4.4.3. s0_axil for External Memory Interface Calibration Component
5. Agilex™ 7 M-Series FPGA EMIF IP – Simulating Memory IP x
5.1. Simulation Walkthrough
5.1. Simulation Walkthrough x
5.1.1. Calibration 5.1.2. Simulation Scripts 5.1.3. Functional Simulation with Verilog HDL 5.1.4. Simulating the Design Example
6. Agilex™ 7 M-Series FPGA EMIF IP – DDR4 Support x
6.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for DDR4 6.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning 6.3. DDR4 Board Design Guidelines
6.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for DDR4 x
6.1.1. Agilex™ 7 M-Series FPGA EMIF IP Parameter Descriptions for DDR4 6.1.2. Agilex™ 7 M-Series FPGA EMIF Memory Device IP Parameter Descriptions for DDR4 6.1.3. Agilex™ 7 M-Series FPGA EMIF Calibration IP Parameter Descriptions
6.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning x
6.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins 6.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources 6.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP 6.2.4. Pin Placements for Agilex™ 7 M-Series FPGA DDR4 EMIF IP
6.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins x
6.2.1.1. Estimating Pin Requirements 6.2.1.2. DIMM Options 6.2.1.3. Maximum Number of Interfaces
6.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources x
6.2.2.1. OCT 6.2.2.2. PLL
6.2.4. Pin Placements for Agilex™ 7 M-Series FPGA DDR4 EMIF IP x
6.2.4.1. Address and Command Pin Placement for DDR4 6.2.4.2. DDR4 Data Width Mapping 6.2.4.3. General Guidelines - DDR4 6.2.4.4. x4 DIMM Implementation 6.2.4.5. Specific Pin Connection Requirements 6.2.4.6. Command and Address Signals 6.2.4.7. Clock Signals 6.2.4.8. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.3. DDR4 Board Design Guidelines x
6.3.1. Terminations for DDR4 with Agilex™ 7 M-Series Devices 6.3.2. General Layout Routing Guidelines 6.3.3. Reference Stackup 6.3.4. Agilex™ 7 M-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies 6.3.5. DDR4 Routing Guidelines: Discrete (Component) Topologies
6.3.1. Terminations for DDR4 with Agilex™ 7 M-Series Devices x
6.3.1.1. Dynamic On-Chip Termination (OCT) 6.3.1.2. Dynamic On-Die Termination (ODT) in DDR4 6.3.1.3. Choosing Terminations on Agilex™ 7 M-Series FPGA Devices 6.3.1.4. On-Chip Termination Recommendations for Agilex™ 7 M-Series FPGA Devices
6.3.4. Agilex™ 7 M-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies x
6.3.4.1. One DIMM per Channel (1DPC) for UDIMM, RDIMM, and SODIMM DDR4 Topologies 6.3.4.2. Skew Matching Guidelines for DIMM Configurations 6.3.4.3. Power Delivery Recommendations for the Memory / DIMM Side
6.3.5. DDR4 Routing Guidelines: Discrete (Component) Topologies x
6.3.5.1. Single Rank x 8 Discrete (Component) Topology 6.3.5.2. Single Rank x 16 Discrete (Component) Topology 6.3.5.3. ADDR/CMD Reference Voltage/RESET Signal Routing Guidelines for Single Rank x 8 and Single Rank x 16 Discrete (Component) Topologies 6.3.5.4. Skew Matching Guidelines for DDR4 Discrete Configurations 6.3.5.5. Power Delivery Recommendations for DDR4 Discrete Configurations 6.3.5.6. Agilex™ 7 M-Series EMIF Pin Swapping Guidelines
6.3.5.6. Agilex™ 7 M-Series EMIF Pin Swapping Guidelines x
6.3.5.6.1. DDR4 Byte Lane Swapping 6.3.5.6.2. DDR4 Address and Command and CLK Lane 6.3.5.6.3. DDR4 Interface x8 Data Lane 6.3.5.6.4. DDR4 Interface x4 Data Lane 6.3.5.6.5. Pin Swizzling
7. Agilex™ 7 M-Series FPGA EMIF IP – DDR5 Support x
7.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for DDR5 7.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning 7.3. DDR5 Board Design Guidelines
7.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for DDR5 x
7.1.1. Agilex™ 7 M-Series FPGA EMIF IP Parameter Descriptions for DDR5 7.1.2. Agilex™ 7 M-Series FPGA EMIF Memory Device IP Parameter Descriptions for DDR5 7.1.3. Agilex™ 7 M-Series FPGA EMIF Calibration IP Parameter Descriptions
7.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning x
7.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins 7.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources 7.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP 7.2.4. Pin Placements for Agilex™ 7 M-Series FPGA DDR5 EMIF IP 7.2.5. Agilex™ 7 M-Series EMIF Pin Swapping Guidelines
7.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins x
7.2.1.1. Estimating Pin Requirements 7.2.1.2. DIMM Options 7.2.1.3. Maximum Number of Interfaces
7.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources x
7.2.2.1. OCT 7.2.2.2. PLL
7.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP x
7.2.3.1. General Guidelines - DDR5 7.2.3.2. x4 DIMM Implementation 7.2.3.3. Specific Pin Connection Requirements 7.2.3.4. Command and Address Signals 7.2.3.5. Clock Signals 7.2.3.6. Data, Data Strobes, DM, and Optional ECC Signals
7.2.4. Pin Placements for Agilex™ 7 M-Series FPGA DDR5 EMIF IP x
7.2.4.1. Address and Command Pin Placement for DDR5 7.2.4.2. DDR5 Data Width Mapping
7.2.5. Agilex™ 7 M-Series EMIF Pin Swapping Guidelines x
7.2.5.1. DDR5 Byte Lane Swapping 7.2.5.2. DDR5 Address and Command and CLK Lane 7.2.5.3. DDR5 Interface x8 Data Lane 7.2.5.4. DDR5 Interface x4 Data Lane 7.2.5.5. Pin Swizzling
7.3. DDR5 Board Design Guidelines x
7.3.1. PCB Stack-up and Design Considerations 7.3.2. General Design Considerations 7.3.3. DDR Differential Signals Routing 7.3.4. Ground Plane and Return Path 7.3.5. RDIMM, UDIMM, and SODIMM Break-in Layout Guidelines 7.3.6. DRAM Break-in Layout Guidelines 7.3.7. DDR5 PCB Layout Guidelines 7.3.8. DDR5 Simulation Strategy
7.3.7. DDR5 PCB Layout Guidelines x
7.3.7.1. DDR5 Discrete Component/Memory Down Topology: up to 40-Bit Interface (1 Rank x8 or x16, 2 Rank x8 or x16) 7.3.7.2. Routing Guidelines for DDR5 Memory Down: 1 Rank or 2 Rank (x8 bit or x16 bit) Configurations 7.3.7.3. Routing Guidelines for DDR5 RDIMM, UDIMM, and SODIMM Configurations 7.3.7.4. Example of a DDR5 layout on an Altera FPGA Platform Board
8. Agilex™ 7 M-Series FPGA EMIF IP – LPDDR5 Support x
8.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for LPDDR5 8.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning 8.3. LPDDR5 Board Design Guidelines
8.1. Agilex™ 7 M-Series FPGA EMIF IP Parameters for LPDDR5 x
8.1.1. Agilex™ 7 M-Series FPGA EMIF IP Parameter Descriptions for LPDDR5 8.1.2. Agilex™ 7 M-Series FPGA EMIF Memory Device IP Parameter Descriptions for LPDDR5 8.1.3. Agilex™ 7 M-Series FPGA EMIF Calibration IP Parameter Descriptions
8.2. Agilex™ 7 M-Series FPGA EMIF IP Pin and Resource Planning x
8.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins 8.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources 8.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP 8.2.4. Pin Placements for Agilex™ 7 M-Series FPGA LPDDR5 EMIF IP
8.2.1. Agilex™ 7 M-Series FPGA EMIF IP Interface Pins x
8.2.1.1. Estimating Pin Requirements 8.2.1.2. DIMM Options 8.2.1.3. Maximum Number of Interfaces
8.2.2. Agilex™ 7 M-Series FPGA EMIF IP Resources x
8.2.2.1. OCT 8.2.2.2. PLL
8.2.3. Pin Guidelines for Agilex™ 7 M-Series FPGA EMIF IP x
8.2.3.1. General Guidelines - LPDDR5 8.2.3.2. Specific Pin Connection Requirements 8.2.3.3. Command and Address Signals 8.2.3.4. Clock Signals
8.2.4. Pin Placements for Agilex™ 7 M-Series FPGA LPDDR5 EMIF IP x
8.2.4.1. Address and Command Pin Placement for LPDDR5 8.2.4.2. LPDDR5 Data Width Mapping 8.2.4.3. LPDDR5 Byte Lane Swapping
8.3. LPDDR5 Board Design Guidelines x
8.3.1. PCB Stack-up and Design Considerations 8.3.2. General Design Considerations 8.3.3. DDR Differential Signals Routing 8.3.4. Ground Plane and Return Path 8.3.5. DRAM Break-in Layout Guidelines 8.3.6. LPDDR5 PCB Layout Guidelines 8.3.7. LPDDR5 Simulation Strategy
8.3.6. LPDDR5 PCB Layout Guidelines x
8.3.6.1. LPDDR5 Discrete Component/Memory Down Topology (1 Rank or 2 Rank, up to 64 Bit Interface) 8.3.6.2. Supported LPDDR5 Topologies 8.3.6.3. Example of an LPDDR5 Layout on an Altera® FPGA Platform Board
9. Agilex™ 7 M-Series FPGA EMIF IP – Timing Closure x
9.1. Timing Closure 9.2. Optimizing Timing
9.1. Timing Closure x
9.1.1. Timing Analysis
9.1.1. Timing Analysis x
9.1.1.1. PHY or Core
10. Agilex™ 7 M-Series FPGA EMIF IP – Controller Optimization x
10.1. Interface Standard 10.2. Bank Management Efficiency 10.3. Data Transfer 10.4. Improving Controller Efficiency
10.4. Improving Controller Efficiency x
10.4.1. Frequency of Operation 10.4.2. Series of Reads or Writes 10.4.3. AXI to Memory Mapping
11. Agilex™ 7 M-Series FPGA EMIF IP – Debugging x
11.1. Interface Configuration Performance Issues 11.2. Functional Issue Evaluation 11.3. Timing Issue Characteristics 11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer 11.5. Debugging with the External Memory Interface Debug Toolkit 11.6. Generating Traffic with the Test Engine IP 11.7. Guidelines for Developing HDL for Traffic Generator 11.8. Guidelines for Traffic Generator Status Check
11.1. Interface Configuration Performance Issues x
11.1.1. Interface Configuration Bottleneck and Efficiency Issues
11.2. Functional Issue Evaluation x
11.2.1. Altera IP Memory Model 11.2.2. Vendor Memory Model 11.2.3. Transcript Window Messages
11.3. Timing Issue Characteristics x
11.3.1. Evaluating FPGA Timing Issues 11.3.2. Evaluating External Memory Interface Timing Issues
11.5. Debugging with the External Memory Interface Debug Toolkit x
11.5.1. Prerequisites for Using the EMIF Debug Toolkit 11.5.2. Configuring Your Design to Use the EMIF Debug Toolkit 11.5.3. Launching the EMIF Debug Toolkit 11.5.4. Using the EMIF Debug Toolkit
11.5.4. Using the EMIF Debug Toolkit x
11.5.4.1. Rerunning Calibration 11.5.4.2. Rerunning the Test Engine 11.5.4.3. Saving Debug Print 11.5.4.4. Calibration Reports 11.5.4.5. Driver Margining Tab 11.5.4.6. Pin Delay Settings Tab
11.8. Guidelines for Traffic Generator Status Check x
11.8.1. Status Check Using the Signal Tap Logic Analyzer 11.8.2. Exporting the Status Interface to the Top-Level Design
1. About the External Memory Interfaces Agilex™ 7 M-Series FPGA IP
2. Agilex™ 7 M-Series FPGA EMIF IP – Introduction
3. Agilex™ 7 M-Series FPGA EMIF IP – Product Architecture
4. Agilex™ 7 M-Series FPGA EMIF IP – End-User Signals
5. Agilex™ 7 M-Series FPGA EMIF IP – Simulating Memory IP
6. Agilex™ 7 M-Series FPGA EMIF IP – DDR4 Support
7. Agilex™ 7 M-Series FPGA EMIF IP – DDR5 Support
8. Agilex™ 7 M-Series FPGA EMIF IP – LPDDR5 Support
9. Agilex™ 7 M-Series FPGA EMIF IP – Timing Closure
10. Agilex™ 7 M-Series FPGA EMIF IP – Controller Optimization
11. Agilex™ 7 M-Series FPGA EMIF IP – Debugging
12. Document Revision History for External Memory Interfaces Agilex™ 7 M-Series FPGA IP User Guide

7.1.2. Agilex™ 7 M-Series FPGA EMIF Memory Device IP Parameter Descriptions for DDR5

The following topics describe the parameters available on each tab of the IP parameter editor, which you can use to configure your IP. Each parameter with an adjacent checkbox can be auto-computed. The checkbox to the left of the parameter controls whether its value is auto-computed (true) or set manually (false). If there is no checkbox to the left of a parameter, then it must be set manually.
Table 121.  Group: Configuration Save
Display Name Description
Configuration Filepath

Filepath to Save to (.qprs extension)

(Identifier: MEM_CONFIG_FILE_QPRS)
Table 122.  Group: High-Level Parameters
Display Name Description
Memory Format

Specifies the packaging format of the memory device

(Identifier: MEM_FORMAT)
Enable Data Mask

Specifies whether byte masking is to be enabled by the memory.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_DM_EN)
Density of Each Memory Logical Rank

Specifies the density of each memory logical rank in Gbits. For monolithic components, this is the density of the component. For 3D stacked components, the is the density of each die or logical rank.

(Identifier: DDR5_MEM_DEVICE_DENSITY_GBITS)
RDIMM Serial Presence Detect (SPD) Byte 248

Specifies the value of SPD Byte 248 as an integer in decimal.

(Identifier: DDR5_MEM_DEVICE_SPD248_CK_CONTROL_ENABLE)
RDIMM Serial Presence Detect (SPD) Byte 249

Specifies the value of SPD Byte 249 as an integer in decimal.

(Identifier: DDR5_MEM_DEVICE_SPD249_QCA_CS_ENABLE)
RDIMM Serial Presence Detect (SPD) Byte 250

Specifies the value of SPD Byte 250 as an integer in decimal.

(Identifier: DDR5_MEM_DEVICE_SPD250_QCK_SIGNAL_DRIVER_STRENGTH)
RDIMM Serial Presence Detect (SPD) Byte 252

Specifies the value of SPD Byte 252 as an integer in decimal.

(Identifier: DDR5_MEM_DEVICE_SPD252_QCA_QCS_SIGNAL_DRIVER_STRENGTH)
RDIMM Serial Presence Detect (SPD) Byte 254

Specifies the value of SPD Byte 254 as an integer in decimal.

(Identifier: DDR5_MEM_DEVICE_SPD254_CK_CA_CS_SLEW_RATE)
Table 123.  Group: Memory Interface Parameters / Data Bus
Display Name Description
Device DQ Width

If the device is a DIMM: Specifies the full DQ width of the DIMM.

If the interface is composed of discrete components: Specifies the DQ width of each discrete component.

(Identifier: MEM_DEVICE_DQ_WIDTH)
Memory Component Data Width

Specifies the data width of the memory component in bits.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_COMPONENT_DQ_WIDTH)
Burst Length

Specifies the burst length of the memory interface.

(Identifier: DDR5_MEM_DEVICE_BURST_LENGTH)
Table 124.  Group: Memory Interface Parameters / Device Topology
Display Name Description
Number of Ranks per DIMM

Number of ranks per DIMM

Note: This parameter can be auto-computed.

(Identifier: MEM_RANKS_PER_DIMM)
Number of Channels Per DIMM

Number of channels per DIMM

Note: This parameter can be auto-computed.

(Identifier: MEM_CHANNELS_PER_DIMM)
Memory Chip IDs Width

Specifies the width of chip IDs.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_CHIP_ID_WIDTH)
Device Bank Group Address Width

Specifies the width of the bank group address.

(Identifier: DDR5_MEM_DEVICE_BANK_GROUP_ADDR_WIDTH)
Device Bank Address Width

Specifies the width of the bank address.

(Identifier: DDR5_MEM_DEVICE_BANK_ADDR_WIDTH)
Device Row Address Width

Specifies the width of the row address.

(Identifier: DDR5_MEM_DEVICE_ROW_ADDR_WIDTH)
Device Column Address Width

Specifies the width of the column address.

(Identifier: DDR5_MEM_DEVICE_COL_ADDR_WIDTH)
Number of Differential Memory Clock Pairs

Specifies the width of clock interface according to the number of ranks.

(Identifier: DDR5_MEM_DEVICE_CK_WIDTH)
Table 125.  Group: Memory Timing Parameters / Timing Parameters
Display Name Description
Memory Clock Frequency

Specifies the operating frequency of the memory interface in MHz. If you change the memory frequency, you must select a matching Preset from the dropdown (or create a custom one), to update all the timing parameters.

Note: This parameter can be auto-computed.

(Identifier: PHY_MEMCLK_FREQ_MHZ)
Memory Speed Bin

Specifies the memory speed bin.

(Identifier: DDR5_MEM_DEVICE_SPEEDBIN)
Memory Read Latency

Specifies the read latency of the memory interface in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_CL_CYC)
Memory Write Latency

Specifies the write latency of the memory interface in cycles.

(Identifier: DDR5_MEM_DEVICE_CWL_CYC)
Memory Fine Granularity Refresh Mode

Specifies the Fine Granularity Refresh (FGR) mode of the memory interface.

(Identifier: DDR5_MEM_DEVICE_FINE_GRANULARITY_REFRESH_MODE)
Table 126.  Group: Memory Timing Parameters / Pre- and Post-Amble Options
Display Name Description
Write Preamble Mode

Specifies the write preamble mode of the memory inteface (0: not supported, 1: 2-cycle preamble, 2: 3-cycle preamble, 3: 4-cycle preamble).

(Identifier: DDR5_MEM_DEVICE_WR_PREAMBLE_MODE)
Read Preamble Mode

Specifies the read preamble mode of the memory inteface (0: 1-cycle preamble, 1: 2-cycle preamble, 2: 2-cycle DDR4-style preamble, 3: 3-cycle preamble, 4: 4-cycle preamble).

(Identifier: DDR5_MEM_DEVICE_RD_PREAMBLE_MODE)
Write Postamble Mode

Specifies the write postamble mode of the memory inteface (0: 0.5-cycle postamble, 1: 1.5-cycle postamble).

(Identifier: DDR5_MEM_DEVICE_WR_POSTAMBLE_MODE)
Read Postamble Mode

Specifies the read postamble mode of the memory inteface (0: 0.5-tCK postamble, 1: 1.5-tCK postamble).

(Identifier: DDR5_MEM_DEVICE_RD_POSTAMBLE_MODE)
Table 127.  Group: Memory Timing Parameters / Advanced Timing Parameters
Display Name Description
tREFI1

Specifies the maximum average refresh interval in normal refresh mode in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TREFI1_NS)
tREFI2

Specifies the maximum average refresh interval in fine granularity refresh mode in nanoseconds.

(Identifier: DDR5_MEM_DEVICE_TREFI2_NS)
tREFISB

Specifies the maximum average refresh interval in fine granularity and same bank refresh mode in nanoseconds.

(Identifier: DDR5_MEM_DEVICE_TREFISB_NS)
tCCD_S

Specifies the CAS_n to CAS_n command delay for different bank group in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCCD_S_CYC)
tCCD_L

Specifies the CAS_n to CAS_n command delay for same bank group in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCCD_L_CYC)
tCCD_L_WR

Specifies the write CAS_n to write CAS_n command delay for same bank group in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCCD_L_WR_CYC)
tCCD_L_WR2

Specifies the write CAS_n to write CAS_n command delay for same bank group and the second write is not RMW, in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCCD_L_WR2_CYC)
tCCD_DLR

Specifies the write CAS_n to write CAS_n command delay in different logical ranks, in cycles. Only applicable to 3D stacked devices device.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCCD_DLR_CYC)
tRRD_S

Specifies the Activate-to-Activate command delay to different bank group for 1KB page size in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRRD_S_CYC)
tRRD_L

Specifies the Activate-to-Activate command delay to same bank group for 1KB page size in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRRD_L_CYC)
tRRD_DLR

Specifies the Activate-to-Activate command delay to different logical ranks in cycles. Only applicable to 3D stacked devices.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRRD_DLR_CYC)
tFAW

Specifies the four activate window for 1KB page size in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TFAW_NS)
tFAW_DLR

Specifies the four activate window for different logical ranks in nanoseconds. Only applicable to 3D stacked devices.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TFAW_DLR_NS)
tRFC1

Specifies the refresh operation delay in normal refresh mode in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRFC1_NS)
tRFC2

Specifies the refresh operation delay in fine granularity refresh mode in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRFC2_NS)
tRFCSB

Specifies the refresh operation delay in fine granularity and same bank refresh mode in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRFCSB_NS)
tRCD

Specifies the Activate-to-internal-Read-or-Write delay in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRCD_NS)
tRP

Specifies the row precharge time in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRP_NS)
tRAS

Specifies the Activate-to-Precharge command period in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRAS_NS)
tRC (tRAS+tRP)

Specifies the Activate-to-Activate or Refresh command period in nanoseconds.

(Identifier: DDR5_MEM_DEVICE_TRC_NS)
tREFSBRD

Specifies the same bank refresh to activate delay in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TREFSBRD_NS)
tWR

Specifies the write recovery time in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TWR_NS)
tZQLAT

Specifies the ZQ calibration latch time in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TZQLAT_CYC)
tZQCAL

Specifies the ZQ calibration time in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TZQCAL_NS)
tMRR

Specifies the Mode Register Read (MRR) command period in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TMRR_CYC)
tMRR_P

Specifies the Mode Register Read (MRR) pattern to mode register read pattern command spacing in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TMRR_P_CYC)
tMRW

Specifies the Mode Register Write (MRW) command period in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TMRW_CYC)
tMRD

Specifies the Mode Register Set (MRS) command delay in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TMRD_CYC)
tDFE

Specifies the Decision Feedback Equalization (DFE) Mode Register Write update delay time in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TDFE_NS)
tDLLK

Specifies the timing of DLLK in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TDLLK_CYC)
tWTR_S

Specifies the delay from start of internal write transaction to internal read command for different bank group in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TWTR_S_NS)
tWTR_L

Specifies the delay from start of internal write transaction to internal read command for same bank group in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TWTR_L_NS)
tRTP

Specifies the internal read command to precharge command delay in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TRTP_CYC)
tPPD

Specifies the Precharge-to-Precharge delay in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TPPD_CYC)
tPD

Specifies the minimum power down time in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TPD_CYC)
tACTPDEN

Specifies the timing of Activate command to power down entry command in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TACTPDEN_CYC)
tPRPDEN

Specifies the timing of Precharge All Banks (PREab), Precharge Same Bank (PREsb), or Normal Precharge (PREpb) to power down entry command in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TPRPDEN_CYC)
tREFPDEN

Specifies the timing of Refresh All Banks (REFab) or Refresh Same Bank (REFsb) command to power down entry command in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TREFPDEN_CYC)
tXP

Specifies the exit power down to next valid command in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TXP_CYC)
tCPDED

Specifies the command pass disable delay in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCPDED_CYC)
tCSL

Specifies the Self-Refresh CS_n low pulse width in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCSL_NS)
tCKSRX

Specifies the valid clock requirement before SRX in cyclesC.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCKSRX_CYC)
tCSH_SREXIT

Specifies the self-refresh exit CS_n high pulse width in nanoseconds.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TCSH_SREXIT_NS)
tDQSCK

Specifies the DQS_t, DQS_c rising edge output timing location from rising CK_t, CK_c in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TDQSCK_CYC)
tWPRE_EN

Specifies the write preamble enable window in cycles. The window size depends on the write preamble mode.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TWPRE_EN_CYC)
tDQSS

Specifies the host and system voltage/temperature drift window of first rising DQS_t preamble edge relative to CAS Write Latency (CWL) CK_t-CK_c edge in cycles.

Note: This parameter can be auto-computed.

(Identifier: DDR5_MEM_DEVICE_TDQSS_CYC)
Level Two Title