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1. About the External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP
2. Intel Agilex® 7 M-Series FPGA EMIF IP – Introduction
3. Intel Agilex® 7 M-Series FPGA EMIF IP – Product Architecture
4. Intel Agilex 7 M-Series FPGA EMIF IP – End-User Signals
5. Intel Agilex® 7 M-Series FPGA EMIF IP – Simulating Memory IP
6. Intel Agilex 7 M-Series FPGA EMIF IP – DDR4 Support
7. Intel Agilex® 7 M-Series FPGA EMIF IP – DDR5 Support
8. Intel Agilex 7 M-Series FPGA EMIF IP – LPDDR5 Support
9. Intel Agilex® 7 M-Series FPGA EMIF IP – Timing Closure
10. Intel Agilex® 7 M-Series FPGA EMIF IP – Controller Optimization
11. Intel Agilex® 7 M-Series FPGA EMIF IP – Debugging
12. Document Revision History for External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide
3.1.1. Intel Agilex® 7 M-Series EMIF Architecture: I/O Subsystem
3.1.2. Intel Agilex® 7 M-Series EMIF Architecture: I/O SSM
3.1.3. Intel Agilex® 7 M-Series EMIF Architecture: I/O Bank
3.1.4. Intel Agilex® 7 M-Series EMIF Architecture: I/O Lane
3.1.5. Intel Agilex® 7 M-Series EMIF Architecture: Input DQS Clock Tree
3.1.6. Intel Agilex® 7 M-Series EMIF Architecture: PHY Clock Tree
3.1.7. Intel Agilex® 7 M-Series EMIF Architecture: PLL Reference Clock Networks
3.1.8. Intel Agilex® 7 M-Series EMIF Architecture: Clock Phase Alignment
3.1.9. User Clock in Different Core Access Modes
6.2.4.1. Address and Command Pin Placement for DDR4
6.2.4.2. DDR4 Data Width Mapping
6.2.4.3. General Guidelines - DDR4
6.2.4.4. x4 DIMM Implementation
6.2.4.5. Specific Pin Connection Requirements
6.2.4.6. Command and Address Signals
6.2.4.7. Clock Signals
6.2.4.8. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.3.5.1. Single Rank x 8 Discrete (Component) Topology
6.3.5.2. Single Rank x 16 Discrete (Component) Topology
6.3.5.3. ADDR/CMD Reference Voltage/RESET Signal Routing Guidelines for Single Rank x 8 and Single Rank x 16 Discrete (Component) Topologies
6.3.5.4. Skew Matching Guidelines for DDR4 Discrete Configurations
6.3.5.5. Power Delivery Recommendations for DDR4 Discrete Configurations
6.3.5.6. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines
7.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins
7.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources
7.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP
7.2.4. Pin Placements for Intel Agilex 7 M-Series FPGA DDR5 EMIF IP
7.2.5. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines
7.3.1. PCB Stack-up and Design Considerations
7.3.2. General Design Considerations
7.3.3. DDR Differential Signals Routing
7.3.4. Ground Plane and Return Path
7.3.5. RDIMM, UDIMM, and SODIMM Break-in Layout Guidelines
7.3.6. DRAM Break-in Layout Guidelines
7.3.7. DDR5 PCB Layout Guidelines
7.3.8. DDR5 Simulation Strategy
7.3.7.1. DDR5 Discrete Component/Memory Down Topology: up to 40-Bit Interface (1 Rank x8 or x16, 2 Rank x8 or x16)
7.3.7.2. Routing Guidelines for DDR5 Memory Down: 1 Rank or 2 Rank (x8 bit or x16 bit) Configurations
7.3.7.3. Routing Guidelines for DDR5 RDIMM, UDIMM, and SODIMM Configurations
7.3.7.4. Example of a DDR5 layout on Intel FPGA Platform Board
11.1. Interface Configuration Performance Issues
11.2. Functional Issue Evaluation
11.3. Timing Issue Characteristics
11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer
11.5. Generating Traffic with the Test Engine IP
11.6. Guidelines for Developing HDL for Traffic Generator
11.7. Debugging with the External Memory Interface Debug Toolkit
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6.3.5.6.3. DDR4 Interface x8 Data Lane
A byte lane in an external memory interface consists of 12 signal pins, denoted 0-11.
For DDR4 interfaces composed of ×8 devices, two pins are reserved for DQS-T and DQS-C signals, one pin is reserved for the optional DM/DBI signal, one pin must be reserved, and the remaining eight pins are for DQ signals. One-byte data lane must be assigned for each byte lane, where the byte lane covers DQ [0:7], DQS_T/DQS_C and DBI_N. The following are EMIF I/O pin swapping restrictions applicable to a DDR4 interface with a ×8 data lane:
- DQS_T must go to pin 4 in IO12 pins.
- DQS_C must go to pin 5 in IO12 pins.
- DBI_N must go to pin 6 in IO12 pins. If the interface does not use the DBI_N pin, this pin 6 in IO12 lane must remain unconnected.
- Pin 7 in IO12 lane remains unconnected. Intel® recommends that you connect this pin 7 to the TDQS dummy load of the memory component and route it as a differential trace along with DBI_N (pin 6). This facilitates ×4 or ×8 data interoperability in DIMMs configuration.
- You can connect data byte (DQ [0:7]) to any pins [0,1,2,3,8,9,10,11] in the byte lane. Any permutation within selected pins is permitted.
Pin Index Within Byte Lane | DDR4 x8 Data Lane Function | Swap Consideration |
---|---|---|
0 | DQ Pin | Swap group A |
1 | DQ Pin | Swap group A |
2 | DQ Pin | Swap group A |
3 | DQ Pin | Swap group A |
4 | DQS-T Pin | Fixed location (not swappable) |
5 | DQS-C Pin | Fixed location (not swappable) |
6 | DM/DBI Pin | Fixed location (not swappable) |
7 | Unused | Fixed location (not swappable) |
8 | DQ Pin | Swap group A |
9 | DQ Pin | Swap group A |
10 | DQ Pin | Swap group A |
11 | DQ Pin | Swap group A |