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1. Logic Elements and Logic Array Blocks in Intel® Cyclone® 10 LP Devices
2. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices
3. Embedded Multipliers in Intel® Cyclone® 10 LP Devices
4. Clock Networks and PLLs in Intel® Cyclone® 10 LP Devices
5. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices
6. Configuration and Remote System Upgrades
7. SEU Mitigation in Intel® Cyclone® 10 LP Devices
8. JTAG Boundary-Scan Testing for Intel® Cyclone® 10 LP Devices
9. Power Management in Intel® Cyclone® 10 LP Devices
2.1. Embedded Memory Capacity
2.2. Intel® Cyclone® 10 LP Embedded Memory General Features
2.3. Intel® Cyclone® 10 LP Embedded Memory Operation Modes
2.4. Intel® Cyclone® 10 LP Embedded Memory Clock Modes
2.5. Intel® Cyclone® 10 LP Embedded Memory Configurations
2.6. Intel® Cyclone® 10 LP Embedded Memory Design Consideration
2.7. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices Revision History
4.2.1. PLL Features
4.2.2. PLL Architecture
4.2.3. External Clock Outputs
4.2.4. Clock Feedback Modes
4.2.5. Clock Multiplication and Division
4.2.6. Post-Scale Counter Cascading
4.2.7. Programmable Duty Cycle
4.2.8. PLL Control Signals
4.2.9. Clock Switchover
4.2.10. Programmable Bandwidth
4.2.11. Programmable Phase Shift
4.2.12. PLL Cascading
4.2.13. PLL Reconfiguration
4.2.14. Spread-Spectrum Clocking
5.1. Intel® Cyclone® 10 LP I/O Standards Support
5.2. I/O Resources in Intel® Cyclone® 10 LP Devices
5.3. Intel FPGA I/O IP Cores for Intel® Cyclone® 10 LP Devices
5.4. Intel® Cyclone® 10 LP I/O Elements
5.5. Intel® Cyclone® 10 LP Clock Pins Input Support
5.6. Programmable IOE Features in Intel® Cyclone® 10 LP Devices
5.7. I/O Standards Termination
5.8. Intel® Cyclone® 10 LP High-Speed Differential I/Os and SERDES
5.9. Using the I/Os and High Speed I/Os in Intel® Cyclone® 10 LP Devices
5.10. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices Revision History
5.8.2.1. LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.2. Bus LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.3. RSDS, Mini-LVDS, and PPDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.4. LVPECL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.5. Differential SSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.6. Differential HSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.9.1. Guideline: Validate Your Pin Placement
5.9.2. Guideline: Check for Illegal Pad Placements
5.9.3. Guideline: Voltage-Referenced I/O Standards Restriction
5.9.4. Guideline: Simultaneous Usage of Multiple I/O Standards
5.9.5. Guideline: LVTTL or LVCMOS Inputs in Intel® Cyclone® 10 LP Devices
5.9.6. Guideline: Differential Pad Placement
5.9.7. Guideline: Board Design for Signal Quality
PS Configuration Connection Guidelines
6.1.2.1. Passive Serial Single-Device Configuration Using an External Host
6.1.2.2. Passive Serial Multi-Device Configuration Using an External Host
6.1.2.3. Passive Serial Single-Device Configuration Using a Download Cable
6.1.2.4. Passive Serial Multi-Device Configuration Using a Download Cable
6.1.4.1. Configuring Intel® Cyclone® 10 LP Devices with the JRunner Software Driver
6.1.4.2. Configuring Intel® Cyclone® 10 LP Devices with Jam STAPL
6.1.4.3. JTAG Single-Device Configuration
6.1.4.4. JTAG Multi-Device Configuration
6.1.4.5. Combining JTAG and AS Configuration Schemes
6.1.4.6. Programming Serial Configuration Devices In-System with the JTAG Interface
6.1.4.7. JTAG Instructions
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6.1.2. Passive Serial Configuration
The PS configuration scheme uses an external host.
You can use external hosts such as a MAX® V device, microprocessor with flash memory, or a download cable.
In the PS scheme, an external host controls the configuration. Configuration data is clocked into the target Intel® Cyclone® 10 LP device through DATA[0] at each rising edge of DCLK.
Figure 87. High-Level Overview of Flash Programming for PS Configuration Scheme
PS Configuration Connection Guidelines
Consider the following guidelines when you configure the Intel® Cyclone® 10 LP devices:
- Connect the pull-up resistors of the FPGA device to the VCC supply of the bank in which the pin resides.
- You can leave the nCEO pin unconnected or use it as a user I/O pin when it does not feed the nCE pin of another device.
- The MSEL pin settings vary for different configuration voltage standards and POR time.
- The nCSO and ASDO pins are dual-purpose I/O pins. The ASDO pin also functions as the DATA[1] pin in FPP mode.
- For multi-device configurations, connect the pull-up resistor of the slave FPGA device(s) to the VCCIO supply voltage of I/O bank in which the nCE pin resides.
- Connect the repeater buffers between the master and slave devices of the FPGA device for DATA[0] and DCLK. All I/O inputs must maintain a maximum AC voltage of 4.1 V. The output resistance of the repeater buffers must fit the maximum overshoot equation.
- The 50 Ω series resistors are optional if the 3.3 V configuration voltage standard is applied. For optimal signal integrity, connect these 50 Ω series resistors if the 2.5 V or 3.0 V configuration voltage standard is applied.
Note: For PS configuration, check the I/O voltage if the I/O pins are assigned in bank 1, which contain the configuration pins. Refer to the MSEL Pin Settings for Each Configuration Scheme of Intel® Cyclone® 10 LP Devices with MSEL[3:0] Pins table in the MSEL Pin Settings section for the supported configuration standard voltage.