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1. Logic Elements and Logic Array Blocks in Intel® Cyclone® 10 LP Devices
2. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices
3. Embedded Multipliers in Intel® Cyclone® 10 LP Devices
4. Clock Networks and PLLs in Intel® Cyclone® 10 LP Devices
5. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices
6. Configuration and Remote System Upgrades
7. SEU Mitigation in Intel® Cyclone® 10 LP Devices
8. JTAG Boundary-Scan Testing for Intel® Cyclone® 10 LP Devices
9. Power Management in Intel® Cyclone® 10 LP Devices
2.1. Embedded Memory Capacity
2.2. Intel® Cyclone® 10 LP Embedded Memory General Features
2.3. Intel® Cyclone® 10 LP Embedded Memory Operation Modes
2.4. Intel® Cyclone® 10 LP Embedded Memory Clock Modes
2.5. Intel® Cyclone® 10 LP Embedded Memory Configurations
2.6. Intel® Cyclone® 10 LP Embedded Memory Design Consideration
2.7. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices Revision History
4.2.1. PLL Features
4.2.2. PLL Architecture
4.2.3. External Clock Outputs
4.2.4. Clock Feedback Modes
4.2.5. Clock Multiplication and Division
4.2.6. Post-Scale Counter Cascading
4.2.7. Programmable Duty Cycle
4.2.8. PLL Control Signals
4.2.9. Clock Switchover
4.2.10. Programmable Bandwidth
4.2.11. Programmable Phase Shift
4.2.12. PLL Cascading
4.2.13. PLL Reconfiguration
4.2.14. Spread-Spectrum Clocking
5.1. Intel® Cyclone® 10 LP I/O Standards Support
5.2. I/O Resources in Intel® Cyclone® 10 LP Devices
5.3. Intel FPGA I/O IP Cores for Intel® Cyclone® 10 LP Devices
5.4. Intel® Cyclone® 10 LP I/O Elements
5.5. Intel® Cyclone® 10 LP Clock Pins Input Support
5.6. Programmable IOE Features in Intel® Cyclone® 10 LP Devices
5.7. I/O Standards Termination
5.8. Intel® Cyclone® 10 LP High-Speed Differential I/Os and SERDES
5.9. Using the I/Os and High Speed I/Os in Intel® Cyclone® 10 LP Devices
5.10. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices Revision History
5.8.2.1. LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.2. Bus LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.3. RSDS, Mini-LVDS, and PPDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.4. LVPECL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.5. Differential SSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.6. Differential HSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.9.1. Guideline: Validate Your Pin Placement
5.9.2. Guideline: Check for Illegal Pad Placements
5.9.3. Guideline: Voltage-Referenced I/O Standards Restriction
5.9.4. Guideline: Simultaneous Usage of Multiple I/O Standards
5.9.5. Guideline: LVTTL or LVCMOS Inputs in Intel® Cyclone® 10 LP Devices
5.9.6. Guideline: Differential Pad Placement
5.9.7. Guideline: Board Design for Signal Quality
6.1.4.1. Configuring Intel® Cyclone® 10 LP Devices with the JRunner Software Driver
6.1.4.2. Configuring Intel® Cyclone® 10 LP Devices with Jam STAPL
6.1.4.3. JTAG Single-Device Configuration
6.1.4.4. JTAG Multi-Device Configuration
6.1.4.5. Combining JTAG and AS Configuration Schemes
6.1.4.6. Programming Serial Configuration Devices In-System with the JTAG Interface
6.1.4.7. JTAG Instructions
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5.8.3. High-Speed I/O Timing Budget
The LVDS I/O standard enables high-speed transmission of data. To take advantage of the fast performance, analyze the timing of high-speed signals. The basis of the source synchronous timing analysis is the skew between the data and the clock signals instead of the clock-to-output setup times. Use the timing parameters provided by IC vendors. High-speed differential data transmission is strongly influenced by board skew, cable skew, and clock jitter.
Intel® Cyclone® 10 LP devices implement the SERDES in LEs. You must set proper timing constraints to indicate whether the SERDES captures the data as expected or otherwise. You can set the timing constraints using the Timing Analyzer tool in the Intel® Quartus® Prime software or manually in the Synopsys* Design Constraints (.sdc) file.