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1. Logic Elements and Logic Array Blocks in Intel® Cyclone® 10 LP Devices
2. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices
3. Embedded Multipliers in Intel® Cyclone® 10 LP Devices
4. Clock Networks and PLLs in Intel® Cyclone® 10 LP Devices
5. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices
6. Configuration and Remote System Upgrades
7. SEU Mitigation in Intel® Cyclone® 10 LP Devices
8. JTAG Boundary-Scan Testing for Intel® Cyclone® 10 LP Devices
9. Power Management in Intel® Cyclone® 10 LP Devices
2.1. Embedded Memory Capacity
2.2. Intel® Cyclone® 10 LP Embedded Memory General Features
2.3. Intel® Cyclone® 10 LP Embedded Memory Operation Modes
2.4. Intel® Cyclone® 10 LP Embedded Memory Clock Modes
2.5. Intel® Cyclone® 10 LP Embedded Memory Configurations
2.6. Intel® Cyclone® 10 LP Embedded Memory Design Consideration
2.7. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices Revision History
4.2.1. PLL Features
4.2.2. PLL Architecture
4.2.3. External Clock Outputs
4.2.4. Clock Feedback Modes
4.2.5. Clock Multiplication and Division
4.2.6. Post-Scale Counter Cascading
4.2.7. Programmable Duty Cycle
4.2.8. PLL Control Signals
4.2.9. Clock Switchover
4.2.10. Programmable Bandwidth
4.2.11. Programmable Phase Shift
4.2.12. PLL Cascading
4.2.13. PLL Reconfiguration
4.2.14. Spread-Spectrum Clocking
5.1. Intel® Cyclone® 10 LP I/O Standards Support
5.2. I/O Resources in Intel® Cyclone® 10 LP Devices
5.3. Intel FPGA I/O IP Cores for Intel® Cyclone® 10 LP Devices
5.4. Intel® Cyclone® 10 LP I/O Elements
5.5. Intel® Cyclone® 10 LP Clock Pins Input Support
5.6. Programmable IOE Features in Intel® Cyclone® 10 LP Devices
5.7. I/O Standards Termination
5.8. Intel® Cyclone® 10 LP High-Speed Differential I/Os and SERDES
5.9. Using the I/Os and High Speed I/Os in Intel® Cyclone® 10 LP Devices
5.10. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices Revision History
5.8.2.1. LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.2. Bus LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.3. RSDS, Mini-LVDS, and PPDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.4. LVPECL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.5. Differential SSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.6. Differential HSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.9.1. Guideline: Validate Your Pin Placement
5.9.2. Guideline: Check for Illegal Pad Placements
5.9.3. Guideline: Voltage-Referenced I/O Standards Restriction
5.9.4. Guideline: Simultaneous Usage of Multiple I/O Standards
5.9.5. Guideline: LVTTL or LVCMOS Inputs in Intel® Cyclone® 10 LP Devices
5.9.6. Guideline: Differential Pad Placement
5.9.7. Guideline: Board Design for Signal Quality
6.1.4.1. Configuring Intel® Cyclone® 10 LP Devices with the JRunner Software Driver
6.1.4.2. Configuring Intel® Cyclone® 10 LP Devices with Jam STAPL
6.1.4.3. JTAG Single-Device Configuration
6.1.4.4. JTAG Multi-Device Configuration
6.1.4.5. Combining JTAG and AS Configuration Schemes
6.1.4.6. Programming Serial Configuration Devices In-System with the JTAG Interface
6.1.4.7. JTAG Instructions
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6.1.1.2. Active Serial Multi-Device Configuration
For multi-device AS configurations, connect multiple Intel® Cyclone® 10 LP devices to a single serial configuration device.
The first device in the chain is the configuration master. Subsequent devices in the chain are configuration slaves. You must set the master device in AS mode and the slave devices in PS mode.
- When the first device captures all its configuration data from the bitstream, it drives the nCEO pin low, enabling the next device in the chain.
- If the last device in the chain is an Intel® Cyclone® 10 LP device, you can leave the nCEO pin of the last device unconnected or use it as a user I/O pin after configuration.
- The nCONFIG, nSTATUS, CONF_DONE, DCLK, and DATA[0] pins of each device in the chain are connected.
Figure 84. Active Serial Multi Device Configuration
Note: For multi-devices AS configuration using Intel® Cyclone® 10 LP devices with 1.0 V core voltage, the maximum board trace-length from the serial configuration device to the junction-split on both DCLK and DATA[0] line is 3.5 inches.
The nSTATUS and CONF_DONE pins on all target devices are connected to the external pull-up resistors. These pins are open-drain bidirectional pins on the Intel® Cyclone® 10 LP devices.
- When the first device asserts nCEO (after receiving all its configuration data), it releases its CONF_DONE pin.
- The subsequent devices in the chain hold this shared CONF_DONE line low until they receive their configuration data.
- When all target devices in the chain receive their configuration data and release CONF_DONE, the pull-up resistor drives CONF_DONE line high and all devices simultaneously enter initialization mode.
Note: Although you can cascade Intel® Cyclone® 10 LP devices, you cannot cascade or chain serial configuration devices.
If the configuration bitstream size exceeds the capacity of a serial configuration device, you must select a larger configuration device, enable the compression feature, or both. When configuring multiple devices, the size of the bitstream is the sum of the individual device’s configuration bitstream.