External Memory Interface Handbook Volume 2: Design Guidelines: For UniPHY-based Device Families

ID 683385
Date 3/06/2023
Public
Document Table of Contents

7.2.3.8. Memory Parameters for RLDRAM 3 UniPHY Intel FPGA IP

The following tables list the memory parameters for RLDRAM 3 for UniPHY IP.

Use the Memory Timing tab to apply the memory timings from your memory manufacturer’s data sheet.

Table 72.  Memory Parameters for RLDRAM 3 for UniPHY

Parameter

Description

Enable data-mask pins

Specifies whether the DM pins of the memory device are driven by the FPGA.

Data-mask width

The width of the data-mask on the memory device.

Data width

The width of the data bus on the memory device.

QK width

The width of the QK (read strobe) bus on the memory device.

Select 2 when data width is set to 18. Select 4 when data width is set to 36.

DK width

The width of the DK (write strobe) bus on the memory device. For x36 device, DQ[8:0] and DQ[26:18] are referenced to DK0/DK0#, and DQ[17:9] and DQ[35:27] are referenced to DK1/DK1#.

Address width

The width of the address bus on the memory device.

Bank-address width

The width of the bank-address bus on the memory device.

Burst length

The burst length supported by the memory device. Refer to memory vendor data sheet.

tRC

Mode register bits that set the tRC. Set the tRC according to the memory speed grade and data latency. Refer to the tRC table in the memory vendor data sheet.

Data Letency

Mode register bits that set the latency. Set latency according to the interface frequency and memory speed grade. Refer to speed bin table in the memory data sheet.

Output Drive

Mode register bits that set the output drive impedance setting. Set the value according to the board simulation.

ODT

Mode register bits that set the ODT setting. Set the value according to the board simulation.

AREF Protocol

Mode register setting for refreshing memory content of a bank. Select Multibank to allow refresh 4 bank simultaneously. Select Bank Address Control to refresh a particular bank by setting the bank address.

Write Protocol

Mode register setting for write protocol. When multiple bank (dual bank or quad bank) is selected, identical data is written to multiple banks.

Topology

Device width

Specifies the number of memory devices used for width

expansion.

Table 73.  Memory Timing Parameters for RLDRAM 3 for UniPHY

Parameter

Description

Memory Device Timing

Maximum memory clock frequency

The maximum frequency at which the memory device can run.

tDS (base)

Base specification for data setup to DK/DK#. Set according to memory speed grade. Refer to memory data sheet.

tDH (base)

Base specification for data hold from DK/DK#. Set according to memory speed grade. Refer to memory data sheet.

tQKQ_max

QK/QK# clock edge to DQ data edge (in same group). Set according to memory speed grade. Refer to memory data sheet.

tQH (% of CK)

DQ output hold time from QK/QK#. Set according to memory speed grade. Refer to memory data sheet.

tCKDK_max(% of CK)

Clock to input data clock (max). Set according to memory speed grade. Refer to memory data sheet.

tCKDK_min (% of CK)

Clock to input data clock (min). Set according to memory speed grade. Refer to memory data sheet.

tCKQK_max

QK edge to clock edge skew (max). Set according to memory speed grade. Refer to memory data sheet.

tIS (base)

Base specification for address and control setup to CK.Set according to memory speed grade. Refer to memory data sheet.

tIH (base)

Base specification for address and control hold from CK. Set according to memory speed grade. Refer to memory data sheet.

Controller Timing

Read-to-Write NOP commands (min)

Minimum number of no operation commands following a read command and before a write command. The value must be at least ((Burst Length/2) + RL - WL + 2). The value, along with other delay/skew parameters, are used by the "Bus Turnaround" timing analysis to determine if bus contention is an issue.

Set according to the controller specification.

Write-to-Read NOP commands (min)

Minimum number of no operation commands following a write command and before a read command. The value must be at least ((Burst Length/2) + WL - RL + 1). The value, along with other delay/skew parameters, are used by the "Bus Turnaround" timing analysis to determine if bus contention is an issue.

Set according to the controller specification.

RLDRAM 3 Board Derate

CK/CK# slew rate (differential)

CK/CK# slew rate (differential).

Address/Command slew rate

Address and command slew rate.

DK/DK# slew rate (Differential)

DK/DK# slew rate (differential).

DQ slew rate

DQ slew rate.

tIS

Address/command setup time to CK.