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1.2.2.1.1. Device Selection Section
1.2.2.1.2. Power Rail Data and Configuration Section
1.2.2.1.3. Meeting Target Impedance when Entering 0 A into the PDN Tool
1.2.2.1.4. Dealing with Multiple Shared Power Supply Pin Types
1.2.2.1.5. VRM Data Section
1.2.2.1.6. Rail Group Summary Section
1.2.2.1.7. VRM Impedance Section
1.2.2.1.8. BGA Via Section
1.2.2.1.9. Plane Section
1.2.2.1.10. Spreading Section
1.2.2.1.11. Implementing Split Planes
1.2.2.1.12. FEFFECTIVE Section
1.2.2.1.13. Decoupling Section
1.2.2.1.14. Results Summary Section
1.2.2.1.15. Recommended Flow for Deriving Decoupling for an FPGA System using the System_Decap Tab
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1.2.3. Design PCB Decoupling Using the PDN Tool 2.0
PCB decoupling keeps the PDN ZEFF smaller than ZTARGET with the properly chosen PCB capacitor combination up to the frequency where the capacitance on the package and die take over the PDN decoupling. This procedure uses the PDN tool 2.0 in different power rail configurations and provides design examples using the Intel® Stratix® 10 device PDN tool.