Intel Agilex® 7 F-Series FPGA (Two F-Tiles) Development Kit User Guide

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ID 739942
Date 8/07/2023
Public
Document Table of Contents
Document Table of Contents x
1. Overview 2. Getting Started 3. Power Up the Development Kit 4. Board Test System 5. Development Kits Hardware and Configuration 6. Custom Projects for the Development Kit 7. Revision History A. Development Kit Components B. Additional Information
1. Overview x
1.1. Block Diagram 1.2. Feature Summary 1.3. Box Contents 1.4. Recommended Operating Conditions
2. Getting Started x
2.1. Intel® Quartus® Prime Software and Driver Installation 2.2. Design Examples
3. Power Up the Development Kit x
3.1. Default Settings 3.2. Applying Power to the Development Board
4. Board Test System x
4.1. Set Up BTS GUI Running Environment 4.2. Test the Functionality of the Development Kit 4.3. Control On-Board Clock through Clock Controller GUI 4.4. Monitor On-Board Power Regulator through Power Monitor GUI 4.5. BTS Test Areas 4.6. Identify Test Pass- or Fail-based on BTS GUI Test Status
4.1. Set Up BTS GUI Running Environment x
4.1.1. Download OpenJDK 4.1.2. Download OpenJFX 4.1.3. Install OpenJDK and OpenJFX 4.1.4. Install the Intel® Quartus® Prime Software 4.1.5. Run BTS GUI
4.2. Test the Functionality of the Development Kit x
4.2.1. The Bottom Info Bar 4.2.2. The Configure Menu 4.2.3. The Sys Info Tab 4.2.4. The GPIO Tab 4.2.5. The XCVR Tab 4.2.6. The Memory Tab
4.2.5. The XCVR Tab x
4.2.5.1. The QSFP NRZ Tab 4.2.5.2. The QSFP PAM4 Tab 4.2.5.3. The QSFPDD NRZ Tab 4.2.5.4. The QSFPDD PAM4 Tab
5. Development Kits Hardware and Configuration x
5.1. JTAG Configuration Mode 5.2. Active Serial (AS) x4 Configuration Mode 5.3. Avalon® -ST x16 Configuration Mode
6. Custom Projects for the Development Kit x
6.1. Add SmartVID Settings in the Intel® Quartus® Prime QSF File 6.2. Golden Top
A. Development Kit Components x
A.1. Board Overview and Components A.2. FPGA Configuration A.3. Default Switch and Jumper Settings A.4. Input and Output Components A.5. Components and Interfaces A.6. I2C A.7. Intel® MAX® 10 SPI Bus A.8. Clock Circuits A.9. HPS Daughter Card A.10. System Power A.11. Power Guidelines A.12. Power Distribution System A.13. Power Measurement A.14. Thermal Limitations and Protection
A.1. Board Overview and Components x
A.1.1. Board Overview A.1.2. Board Components A.1.3. Intel® MAX® 10 CPLD System Controller
A.2. FPGA Configuration x
A.2.1. Programming the FPGA over On-Board Intel® FPGA Download Cable II A.2.2. Programming the FPGA over an External Intel® FPGA Download Cable II
A.3. Default Switch and Jumper Settings x
A.3.1. Switch Description A.3.2. Jumper Description
A.4. Input and Output Components x
A.4.1. Push Buttons A.4.2. Switches A.4.3. LEDs
A.5. Components and Interfaces x
A.5.1. PCI Express* ( PCIe* ) Interface A.5.2. QSFP-DD Interface A.5.3. QSFP Interface A.5.4. CXL Interface A.5.5. DDR4 DIMM1 Interface A.5.6. DDR4 DIMM2 Interface A.5.7. DDR4 Component Interface A.5.8. HPS I/O48 Interface
A.11. Power Guidelines x
A.11.1. In a Standard PCIe* -Compliant System A.11.2. As a Standalone Evaluation Board Powered by Included Power Supply
B. Additional Information x
B.1. Safety and Regulatory Information B.2. Compliance Information
B.1. Safety and Regulatory Information x
B.1.1. Safety Warnings B.1.2. Safety Cautions
1. Overview
2. Getting Started
3. Power Up the Development Kit
4. Board Test System
5. Development Kits Hardware and Configuration
6. Custom Projects for the Development Kit
7. Revision History
A. Development Kit Components
B. Additional Information

A.14. Thermal Limitations and Protection

The Intel Agilex® 7 FPGA development kit is designed to operate in a typical laboratory environment with an ambient temperature of approximately 25 °C. The cooling solution provided with the development kit allows sufficient cooling for the board to operate up to a maximum power consumption of 150 W (under this environment).

Two MAX31730 3-channel remote temperature sensor devices are connected to the Intel Agilex® 7 FPGA's internal temperature diodes. The function is to continuously monitor the FPGA's internal core and transceiver tile die temperatures as well as the board inlet and exhaust airflow temperatures when the board is installed inside a server system. Based on the data from both temperature sensors, the Intel Agilex® 7 FPGA and Intel® MAX® 10 run at its maximum speed whenever any temperature is over 60 °C or immediately power off the board whenever the temperature crosses 100 °C to protect the board from damage.

CAUTION:
Ensure you unplug the power supply when the board is powered off when the temperature crosses 100 °C. Plug the power supply back again to ensure that the board can be turned on or off again.
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