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Ixiasoft
1. Overview
2. Getting Started
3. Development Kit Setup
4. Board Test System
5. Development Kit Hardware and Configuration
6. Custom Projects for the Development Kit
7. Document Revision History for the Agilex™ 7 FPGA F-Series (2 × F-Tiles) Development Kit User Guide
A. Development Kit Components
B. Developer Resources
C. Safety and Regulatory Compliance Information
A.1. Board Overview and Components
A.2. FPGA Configuration
A.3. Default Switch and Jumper Settings
A.4. Input and Output Components
A.5. Components and Interfaces
A.6. I2C
A.7. MAX® 10 SPI Bus
A.8. Clock Circuits
A.9. HPS Daughter Card
A.10. System Power
A.11. Power Guidelines
A.12. Power Distribution System
A.13. Power Measurement
A.14. Thermal Limitations and Protection
Visible to Intel only — GUID: wtc1659981578057
Ixiasoft
1.2. Feature Summary
- Agilex™ 7 F-Series (DK-DEV-AGF027F1ES or DK-DEV-AGF023FA) device in 2340A BGA package
- Quad-core 64-bit Arm* Cortex* -A53 hard processor (HPS)
- 0.8 V VID-adjustable VCC core
- Dual F-Tile transceivers supporting 56 Gbps (PAM4) and 32 Gbps (NRZ) data rates
- 2.69M (DK-DEV-AGF027F1ES) or 2.30M (DK-DEV-AGF023FA) logic elements (LE)
- 3.65M (DK-DEV-AGF027F1ES) or 3.12M (DK-DEV-AGF023FA) adaptive logic modules (ALM)
- 8.5K (DK-DEV-AGF027F1ES) or 1.6K (DK-DEV-AGF023FA) digital signal processing (DSP) blocks
- FPGA configuration
- Avalon® streaming interface x16 and Active Serial (AS) x4 configuration modes support
- 2 Gb flash for AS x4
- Dual 2 Gb flash for Avalon® streaming interface x16
- JTAG header for device programming
- Built-in Intel® FPGA Download Cable II for device programming
- Programmable clock sources
- Transceiver interfaces
- PCI Express* ( PCIe* ) x16 interface supporting Gen 4 end-point connected to a PCIe* x16 edge connector (gold edge fingers)
- 1x QSFP optical module interface connected to F-Tile transceiver
- 1x QSFPDD optical module interface connected to F-Tile transceiver
- 1x PCIe* /CXL interface supporting x4 interface connected to MCIO connector
- Memory interfaces
- DK-DEV-AGF027F1ES: Two x72 DIMM sockets supporting DDR4-2666 or DDR-T Intel® Optane™ persistent memory module
- DK-DEV-AGF023FA: One x72 DIMM socket supporting DDR4-2666 or DDR-T Intel® Optane™ persistent memory module
- Single x40 DDR4 component interface for HPS processor memory
- Communication ports
- JTAG header
- Micro USB on-board Intel® FPGA Download Cable II
- System I2C header
- Buttons, switches, and LEDs
- CPU reset push button
- PCIe* reset push button
- CXL reset push button
- HPS reset push button
- Four dedicated user LEDs
- Board power good LED
- FPGA configuration done LED
- Heatsink and fan
- Air-cooled heatsink assembly
- Red over-temperature warning LED
- Power
- PCIe* input power including required 2x4 auxiliary power connector
- Blue power-good status LED
- On/off slide power switch for benchtop operation
- On-board power and temperature measurement circuitry
- Mechanical
- PCIe* standard height form-factor (full height, ¾ length, dual-width)
- 4.375" x 10.0" board size
- Two slots height with heatsink/fan assembly
- Operating environment
- Maximum ambient temperature of 0–35°C