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1. Overview
2. Getting Started
3. Development Kit Setup
4. Board Test System
5. Development Kit Hardware and Configuration
6. Custom Projects for the Development Kit
7. Document Revision History for the Agilex™ 7 FPGA F-Series (2 × F-Tiles) Development Kit User Guide
A. Development Kit Components
B. Developer Resources
C. Safety and Regulatory Compliance Information
A.1. Board Overview and Components
A.2. FPGA Configuration
A.3. Default Switch and Jumper Settings
A.4. Input and Output Components
A.5. Components and Interfaces
A.6. I2C
A.7. MAX® 10 SPI Bus
A.8. Clock Circuits
A.9. HPS Daughter Card
A.10. System Power
A.11. Power Guidelines
A.12. Power Distribution System
A.13. Power Measurement
A.14. Thermal Limitations and Protection
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1.4. Recommended Operating Conditions
Operating Condition | Range of Values |
---|---|
Ambient operating temperature range | 0°C to 35°C |
Maximum ICC load current | 150 A |
Maximum ICC load transient percentage | 30% |
FPGA maximum power supported by active heatsink/fan | 150 W |
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