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1. About the PHY Lite for Parallel Interfaces IP
2. PHY Lite for Parallel Interfaces Intel Agilex FPGA IP
3. PHY Lite for Parallel Interfaces Intel Stratix 10 FPGA IP
4. PHY Lite for Parallel Interfaces Intel Arria 10 and Intel Cyclone 10 GX FPGA IPs
5. PHY Lite for Parallel Interfaces Intel® FPGA IP User Guide Document Archives
6. Document Revision History for the PHY Lite for Parallel Interfaces IP User Guide
3.5.6.4.1. Timing Closure: Dynamic Reconfiguration
3.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
3.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
3.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
3.5.6.4.5. I/O Timing Violation
3.5.6.4.6. Internal FPGA Path Timing Violation
4.5.6.4.1. Timing Closure: Dynamic Reconfiguration
4.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
4.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
4.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
4.5.6.4.5. I/O Timing Violation
4.5.6.4.6. Internal FPGA Path Timing Violation
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2.2.1. Intel® Agilex™ I/O Sub-bank Interconnects
There are interconnects between the sub-banks which chain the sub-banks into a row. The following figures show how I/O lanes in various sub-banks are chained together to form the top and bottom I/O rows in various Intel® Agilex™ device variants. These figures represent the top view of the silicon die that corresponds to a reverse view of the device package. Each sub-bank is labeled with ID number to facilitate pin placement.
Figure 2. Sub-Bank Ordering with ID in Top I/O Row in Intel® Agilex™ AGF012 and AGF014, package R24A
Figure 3. Sub-Bank Ordering with ID in Bottom I/O Row in Intel® Agilex™ AGF012 and AGF014, package R24A
Figure 4. Sub-Bank Ordering with ID in Top I/O Row in Intel® Agilex™ AGF014, package R17A
Figure 5. Sub-Bank Ordering with ID in Bottom I/O Row in Intel® Agilex™ AGF014, package R17A
Figure 6. Sub-Bank Ordering with ID in Top I/O Row in Intel® Agilex™ AGF022 and AGF027 devices, package R25A
Figure 7. Sub-Bank Ordering with ID in Bottom I/O Row in Intel® Agilex™ AGF022 and AGF027 devices, package R25A