Intel® Stratix® 10 DX FPGA Development Kit User Guide

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ID 683561
Date 9/25/2023
Public
Document Table of Contents
Document Table of Contents x
1. Getting Started 2. Development Kit Overview 3. Power Up the Development Kit 4. Board Test System (BTS) 5. Development Kit Hardware and Configuration 6. Document Revision History for Intel® Stratix® 10 DX FPGA Development Kit User Guide A. Development Kit Components B. Safety and Regulatory Information C. Compliance and Conformity Information
1. Getting Started x
1.1. About this Document 1.2. Installing the Intel® Quartus® Prime Pro Edition Software 1.3. Downloading the Board Package 1.4. Installing the Driver for Intel FPGA Download Cable II
1.2. Installing the Intel® Quartus® Prime Pro Edition Software x
1.2.1. Activating Your License
2. Development Kit Overview x
2.1. Supported Features 2.2. Recommended Operating Conditions 2.3. Handling the Board
3. Power Up the Development Kit x
3.1. Default Switch Settings 3.2. Connectors and LEDs 3.3. Performing Board Restore through Board Test System (BTS) 3.4. Controlling On-board Clock
4. Board Test System (BTS) x
4.1. Preparing the Development Kit 4.2. Running the Board Test System 4.3. Using the Board Test System 4.4. Smart VID Setting
4.3. Using the Board Test System x
4.3.1. Configure Menu 4.3.2. Sys Info Tab 4.3.3. GPIO Tab 4.3.4. QSFP Tab 4.3.5. Component DDR4 CH0 Tab 4.3.6. Component DDR4 CH1 Tab 4.3.7. DDR4 DIMM CH0 Tab 4.3.8. DDR4 DIMM CH1 Tab 4.3.9. Power Monitor 4.3.10. Clock Controller
5. Development Kit Hardware and Configuration x
5.1. FPGA Configuration 5.2. Programming the FPGA Over Intel® FPGA Download Cable 5.3. Configuration Modes
5.3. Configuration Modes x
5.3.1. Avalon® Streaming Interface x8 Mode 5.3.2. JTAG Mode
5.3.1. Avalon® Streaming Interface x8 Mode x
Avalon® Streaming Interface x8 Configuration Guideline
A. Development Kit Components x
A.1. Components Overview A.2. Power, Thermal, and Mechanical Considerations A.3. Clock Circuits A.4. Memory Interface A.5. PCIe Interface A.6. UPI Interface A.7. Transceiver Signals: PCIe and UPI Interface A.8. SlimSAS Connector A.9. QSFP Network Interface A.10. I2C Interface A.11. QSPI Flash Memory
A.2. Power, Thermal, and Mechanical Considerations x
A.2.1. Power Guidelines A.2.2. Thermal Requirements A.2.3. Mechanical Requirements
A.2.1. Power Guidelines x
A.2.1.1. Power Distribution A.2.1.2. Power Sequence A.2.1.3. Power Measurement
A.2.2. Thermal Requirements x
A.2.2.1. Operating Conditions A.2.2.2. Temperature Monitoring
A.9. QSFP Network Interface x
A.9.1. Dual Port Controller
A.11. QSPI Flash Memory x
A.11.1. Configuration QSPI Flash Memory A.11.2. NIOS QSPI Flash Memory
B. Safety and Regulatory Information x
B.1. Safety Warnings B.2. Safety Cautions
1. Getting Started
2. Development Kit Overview
3. Power Up the Development Kit
4. Board Test System (BTS)
5. Development Kit Hardware and Configuration
6. Document Revision History for Intel® Stratix® 10 DX FPGA Development Kit User Guide
A. Development Kit Components
B. Safety and Regulatory Information
C. Compliance and Conformity Information

A.2.2. Thermal Requirements

The thermal solution is an active cooling system designed to cool up to 250W total power of the board. The heatsink is designed to meet the height constraints of a 2-slot PCIe card form-factor as defined by the PCIe CEM specification revision 3.0.

The heatsink is securely mounted to the board using screws for easy assembly and removal. The thermal material used between FPGA and heatsink also ensures good thermal contact.
Figure 36. Air-cooled Heatsink Setup

Section Content
Operating Conditions
Temperature Monitoring

Level Two Title