Visible to Intel only — GUID: sll1567793537360
Ixiasoft
1. Getting Started
2. Development Kit Overview
3. Power Up the Development Kit
4. Board Test System (BTS)
5. Development Kit Hardware and Configuration
6. Document Revision History for Intel® Stratix® 10 DX FPGA Development Kit User Guide
A. Development Kit Components
B. Safety and Regulatory Information
C. Compliance and Conformity Information
A.1. Components Overview
A.2. Power, Thermal, and Mechanical Considerations
A.3. Clock Circuits
A.4. Memory Interface
A.5. PCIe Interface
A.6. UPI Interface
A.7. Transceiver Signals: PCIe and UPI Interface
A.8. SlimSAS Connector
A.9. QSFP Network Interface
A.10. I2C Interface
A.11. QSPI Flash Memory
Visible to Intel only — GUID: sll1567793537360
Ixiasoft
A.2.2.1. Operating Conditions
The Intel® Stratix® 10 DX FPGA Development Kit is designed to operate within the following conditions while keeping the FPGA die temperature within its recommended operating Tj as defined in the Intel® Stratix® 10 DX FPGA data sheet (usually 100°C):
- Maximum power dissipation — 250 W
- Maximum ambient temperature — 0°C - 35°C
- FPGA Junction Temperature — 85°C