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1. Getting Started
2. Development Kit Overview
3. Power Up the Development Kit
4. Board Test System (BTS)
5. Development Kit Hardware and Configuration
6. Document Revision History for Intel® Stratix® 10 DX FPGA Development Kit User Guide
A. Development Kit Components
B. Safety and Regulatory Information
C. Compliance and Conformity Information
A.1. Components Overview
A.2. Power, Thermal, and Mechanical Considerations
A.3. Clock Circuits
A.4. Memory Interface
A.5. PCIe Interface
A.6. UPI Interface
A.7. Transceiver Signals: PCIe and UPI Interface
A.8. SlimSAS Connector
A.9. QSFP Network Interface
A.10. I2C Interface
A.11. QSPI Flash Memory
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A.4. Memory Interface
The Intel® Stratix® 10 DX FPGA device supports four independent memory interfaces:
- Two independent on-board DDR4
- Two DIMM sockets for DDR4 or Intel Optane® DC Persistent memory modules
Figure 41. Memory Interface
The on-board DDR4 uses five 16Gb DDR4 single rank devices connecting to bank 2K, 2L, 2M for memory component channel 1 and bank 3I, 3J, 3K for memory component channel 0. The total memory size of each channel is 8 GB running at 1200 MHz.
The 288-pin DIMM socket interfaces to bank 3I, 3J, 3K, 3L for DIMM channel 0 and to bank 2K, 2L, 2M, 2N for DIMM channel 1. This socket accepts DDR4 or Intel Optane® DC Persistent memory module (requires Intel memory controller IP core). It supports dual rank at frequency 1067 MHz, 16 GB per channel. It also supports single rank at frequency 1200 MHz, 8 GB per channel.