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Ixiasoft
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Ixiasoft
A.14. Temperature Monitoring
Temperature monitoring of the Agilex™ 7 FPGA device is done by a pair of MAX31730ATC+ temperature sense devices. The Agilex™ 7 FPGA device has 6 die temperature diodes that can be monitored via external temperature sensing devices. The MAX31730ATC+ senses these diodes and convert the signals to digital form for the MAX® 10 to read via a I2C bus. Additionally, the THERMn signal from the MAX31730ATC+ are brought to the MAX® 10 to allow it to immediately sense a temperature fault condition. An over temperature warning LED D9 (Red-colored) is controlled by the MAX® 10 device to indicate an over temperature warning. Temperature fault set points can be programmed into the temperature sensing device.