Agilex™ 7 FPGA I-Series Development Kit User Guide

ID 683288
Date 5/31/2024
Public
Document Table of Contents

A.17. Board Operating Conditions

The board should be designed to operate within the below conditions while keeping the FPGA die temperature within its recommended operating TJ as defined in the Agilex™ 7 Device Data Sheet (usually 100°C).

Table 10.  Board Operating Conditions
Operating Condition Range
Maximum power dissipation 250W
Maximum ambient temperature 0°C to 35°C
FPGA junction temperature 85°C