Visible to Intel only — GUID: obp1629314513784
Ixiasoft
A.1. Board Overview
A.2. Agilex™ 7 FPGA I-Series
A.3. PCIe* and CXL Interfaces
A.4. MCIO Connector
A.5. MCIO Cable Assembly Information
A.6. Network Interfaces
A.7. Port Controller
A.8. FPGA Configuration
A.9. Supported Configuration Modes
A.10. Memory Interfaces
A.11. I2C
A.12. Clock Circuits
A.13. System Power
A.14. Temperature Monitoring
A.15. Mechanical Requirements
A.16. Board Thermal Requirements
A.17. Board Operating Conditions
A.18. Over Temperature Warning LED
Visible to Intel only — GUID: obp1629314513784
Ixiasoft
A.17. Board Operating Conditions
The board should be designed to operate within the below conditions while keeping the FPGA die temperature within its recommended operating TJ as defined in the Agilex™ 7 Device Data Sheet (usually 100°C).
Operating Condition | Range |
---|---|
Maximum power dissipation | 250W |
Maximum ambient temperature | 0°C to 35°C |
FPGA junction temperature | 85°C |