Agilex™ 7 FPGA I-Series Development Kit User Guide

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ID 683288
Date 5/31/2024
Public
Document Table of Contents
Document Table of Contents x
1. Overview 2. Getting Started 3. Development Board Setup 4. Board Test System 5. Document Revision History for the Agilex™ 7 FPGA I-Series Development Kit User Guide A. Development Kits Components B. Additional Information
1. Overview x
1.1. Block Diagram 1.2. Box Contents 1.3. Operating Conditions
2. Getting Started x
2.1. About Quartus® Prime Software 2.2. Development Board Package 2.3. Installing the Intel® FPGA Download Cable II Driver
2.1. About Quartus® Prime Software x
2.1.1. Activating Your License
3. Development Board Setup x
3.1. Applying Power to the Development Board 3.2. Default Switch Settings 3.3. How to Generate a POF Image to Program the Flash 3.4. How to Program the Generated POF Image 3.5. The Required SmartVID QSF Assignments to Compile a Design
3.2. Default Switch Settings x
3.2.1. Default Settings 3.2.2. Perform Board Restore through Quartus® Prime Programmer
4. Board Test System x
4.1. Set Up BTS GUI Running Environment 4.2. Test the Functionality of the Development Kit 4.3. Control On-board Clock through Clock Controller GUI 4.4. Monitor On-board Power through Power Monitor GUI 4.5. BTS Test Areas 4.6. Identify Test Pass or Fail-based on BTS GUI Test Status
4.1. Set Up BTS GUI Running Environment x
4.1.1. Download OpenJDK 4.1.2. Download OpenJFX 4.1.3. Install OpenJDK and OpenJFX 4.1.4. Run BTS GUI
4.2. Test the Functionality of the Development Kit x
4.2.1. The Bottom Info Bar 4.2.2. The Configure Menu 4.2.3. The Sys Info Tab 4.2.4. The GPIO Tab 4.2.5. The XCVR Tab 4.2.6. The RAM Tab
4.2.5. The XCVR Tab x
4.2.5.1. The QSFPDD NRZ Tab 4.2.5.2. The QSFPDD PAM4 Tab
A. Development Kits Components x
A.1. Board Overview A.2. Agilex™ 7 FPGA I-Series A.3. PCIe* and CXL Interfaces A.4. MCIO Connector A.5. MCIO Cable Assembly Information A.6. Network Interfaces A.7. Port Controller A.8. FPGA Configuration A.9. Supported Configuration Modes A.10. Memory Interfaces A.11. I2C A.12. Clock Circuits A.13. System Power A.14. Temperature Monitoring A.15. Mechanical Requirements A.16. Board Thermal Requirements A.17. Board Operating Conditions A.18. Over Temperature Warning LED
A.13. System Power x
A.13.1. Power Guidelines A.13.2. Power Distribution System A.13.3. Power Sequence A.13.4. Power Measurement
B. Additional Information x
B.1. Safety and Regulatory Information B.2. Compliance Information
B.1. Safety and Regulatory Information x
B.1.1. Safety Warnings B.1.2. Safety Cautions
1. Overview
2. Getting Started
3. Development Board Setup
4. Board Test System
5. Document Revision History for the Agilex™ 7 FPGA I-Series Development Kit User Guide
A. Development Kits Components
B. Additional Information

A.16. Board Thermal Requirements

A thermal solution is designed to cool up to 250W total power of the board. An active cooling design is used. The heatsink is designed to meet the height constraints of a 2-slot PCIe* card form-factor as defined by the PCIe* CEM specification revision 3.0.

Figure 50. Board Thermal Requirements

The heatsink is securely mounted to the board using screws for easy assembly and removal. A thermal material is also used between the FPGA and heatsink to ensure good thermal contact.

Figure 51. Air-Cooled Heatsink Assembly
Level Two Title