Intel Cyclone 10 LP Device Design Guidelines

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ID 683861
Date 3/28/2019
Public
Document Table of Contents
Document Table of Contents x
Intel® Cyclone® 10 LP Device Design Guidelines
Intel® Cyclone® 10 LP Device Design Guidelines x
Design Flow System Specification Device Selection Early System and Board Planning Pin Connection Considerations for Board Design I/O and Clock Planning Design Entry Design Implementation, Analysis, Optimization, and Verification Document Revision History for Intel® Cyclone® 10 LP Device Design Guidelines
System Specification x
Design Specifications IP Selection Platform Designer
Device Selection x
Device Variant PLLs and Clock Routing Logic, Memory, and Multiplier Density I/O Pin Count, LVDS Channels, and Package Offering Speed Grade Vertical Device Migration
Early System and Board Planning x
Early Power Estimation Planning for Device Configuration Planning for On-chip Debugging
Planning for Device Configuration x
Configuration Scheme Selection Configuration Features Intel® Quartus® Prime Configuration Settings
Configuration Scheme Selection x
Serial Configuration Devices Download Cables
Intel® Quartus® Prime Configuration Settings x
Optional Configuration Pins
Planning for On-chip Debugging x
On-chip Debugging Tools Planning Guidelines for Debugging Tools
Pin Connection Considerations for Board Design x
Device Power-Up Power Pin Connections and Power Supplies Configuration Pin Connections Board-related Intel® Quartus® Prime Settings Signal Integrity Considerations Board-level Simulation and Advanced I/O Timing Analysis
Power Pin Connections and Power Supplies x
Decoupling Capacitors PLL Board Design Guidelines
Configuration Pin Connections x
Clock Trace Signal Integrity JTAG Pins MSEL Configuration Mode Pins Other Configuration Pins
JTAG Pins x
JTAG Pin Connections Download Cable Operating Voltage JTAG Signal Buffering
Board-related Intel® Quartus® Prime Settings x
Device-wide Output Enable Pin Unused Pins
Signal Integrity Considerations x
Voltage Reference Pins Simultaneous Switching Noise I/O Termination
I/O and Clock Planning x
Making FPGA Pin Assignments Early Pin Planning and I/O Assignment Analysis I/O Features and Pin Connections Clock and PLL Selection PLL Feature Guidelines Clock Control Features I/O Simultaneous Switching Noise
I/O Features and Pin Connections x
I/O Signaling Type Selectable Standards and Flexible I/O Banks Dual-Purpose and Special Pin Connections Intel® Cyclone® 10 LP I/O Features
PLL Feature Guidelines x
Clock Feedback Mode Clock Outputs
Design Entry x
Design Recommendations Using IP Cores Recommended HDL Coding Styles Register Power-up Levels and Control Signals
Design Implementation, Analysis, Optimization, and Verification x
Selecting a Synthesis Tool Device Resource Utilization Reports Intel® Quartus® Prime Messages Timing Constraints and Analysis Area and Timing Optimization Preserving Performance and Reducing Compilation Time Simulation Power Analysis Power Optimization
Timing Constraints and Analysis x
Recommended Timing Optimization and Analysis Assignments
Power Optimization x
Device and Design Power Optimization Techniques Intel® Quartus® Prime Power Optimization Techniques
Device and Design Power Optimization Techniques x
Clock Power Management Memory Power Reduction I/O Power Guidelines
Intel® Cyclone® 10 LP Device Design Guidelines

I/O Power Guidelines

Table 68.  I/O Power Guidelines Checklist
Number Done? Checklist Item
1   Review the I/O power guidelines.

The dynamic power consumed in the I/O buffer is proportional to the total load capacitance; therefore, lower capacitance reduces power consumption.

Non-terminated I/O standards such as LVTTL and LVCMOS have a rail to-rail output swing equal to the VCCIO supply voltage. Because dynamic power is proportional to the square of the voltage, use lower voltage I/O standards to reduce dynamic power. These I/O standards consume little static power.

Because dynamic power is also proportional to the output transition frequency, use resistively-terminated I/O standards such as SSTL for high-frequency applications. The output load voltage swings by an amount smaller than the VCCIO around a bias point; therefore, dynamic power is lower than for non-terminated I/O under similar conditions.

Resistively-terminated I/O standards dissipate significant static power because current is constantly driven into the termination network. Use the lowest drive strength that meets your speed and waveform requirements to minimize static power when using resistively terminated I/O standards.

The power used by external devices is not included in the EPE calculations, so be sure to include it separately in your system power calculations.

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