Visible to Intel only — GUID: xmu1707688986060
Ixiasoft
1. About the External Memory Interfaces Agilex™ 5 FPGA IP
2. Design Example Quick Start Guide for External Memory Interfaces Agilex™ 5 FPGA IP
3. Design Example Description for External Memory Interfaces Agilex™ 5 FPGA IP
4. Document Revision History for External Memory Interfaces (EMIF) IP Design Example User Guide
2.1. Creating an EMIF Project
2.2. Generating and Configuring the EMIF IP
2.3. Configuring DQ Pin Swizzling
2.4. Generating the Synthesizable EMIF Design Example
2.5. Generating the EMIF Design Example for Simulation
2.6. Pin Placement for Agilex™ 5 EMIF IP
2.7. Compiling the Agilex™ 5 EMIF Design Example
2.8. Using the Design Example with the Test Engine IP
2.9. Generating the EMIF Design Example with the Performance Monitor
2.3.1. Example: DQ Pin Swizzling Within DQS Group for x32+ECC DDR4 Interface
2.3.2. Example: Byte Swizzling for x32 DDR4 Interface, Using a Memory Device of x8 Width
2.3.3. Combining Pin and Byte Swizzling
2.3.4. Example: Swizzling for x32 + ECC DDR4 Interface
2.3.5. Example: Byte Swizzling for Lockstep Configuration
Visible to Intel only — GUID: xmu1707688986060
Ixiasoft
2.1.1.3.3.1. Guidelines for Selecting the LPDDR4 Component
For LPDDR4 discrete components, the Agilex™ 5 LPDDR4 IP supports the following:
- 1 die per component with 1 rank.
- 2 dies per component with 1 rank.
- 2 dies per component with 2 ranks.
- 4 dies per component with 2 ranks.