Cyclone® 10 GX Core Fabric and General Purpose I/Os Handbook

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ID 683775
Date 7/08/2024
Public
Document Table of Contents
Document Table of Contents x
1. Logic Array Blocks and Adaptive Logic Modules in Cyclone® 10 GX Devices 2. Embedded Memory Blocks in Cyclone® 10 GX Devices 3. Variable Precision DSP Blocks in Cyclone® 10 GX Devices 4. Clock Networks and PLLs in Cyclone® 10 GX Devices 5. I/O and High Speed I/O in Cyclone® 10 GX Devices 6. External Memory Interfaces in Cyclone® 10 GX Devices 7. Configuration, Design Security, and Remote System Upgrades in Cyclone® 10 GX Devices 8. SEU Mitigation for Cyclone® 10 GX Devices 9. JTAG Boundary-Scan Testing in Cyclone® 10 GX Devices 10. Power Management in Cyclone® 10 GX Devices
1. Logic Array Blocks and Adaptive Logic Modules in Cyclone® 10 GX Devices x
1.1. LAB 1.2. ALM Operating Modes 1.3. LAB Power Management Techniques 1.4. Logic Array Blocks and Adaptive Logic Modules in Cyclone® 10 GX Devices Revision History
1.1. LAB x
1.1.1. MLAB 1.1.2. Local and Direct Link Interconnects 1.1.3. Shared Arithmetic Chain and Carry Chain Interconnects 1.1.4. LAB Control Signals 1.1.5. ALM Resources 1.1.6. ALM Output
1.2. ALM Operating Modes x
1.2.1. Normal Mode 1.2.2. Extended LUT Mode 1.2.3. Arithmetic Mode 1.2.4. Shared Arithmetic Mode
2. Embedded Memory Blocks in Cyclone® 10 GX Devices x
2.1. Types of Embedded Memory 2.2. Embedded Memory Design Guidelines for Cyclone® 10 GX Devices 2.3. Embedded Memory Features 2.4. Embedded Memory Modes 2.5. Embedded Memory Clocking Modes 2.6. Parity Bit in Embedded Memory Blocks 2.7. Byte Enable in Embedded Memory Blocks 2.8. Memory Blocks Packed Mode Support 2.9. Memory Blocks Address Clock Enable Support 2.10. Memory Blocks Asynchronous Clear 2.11. Memory Blocks Error Correction Code Support 2.12. Embedded Memory Blocks in Cyclone® 10 GX Devices Revision History
2.1. Types of Embedded Memory x
2.1.1. Embedded Memory Capacity in Cyclone® 10 GX Devices
2.2. Embedded Memory Design Guidelines for Cyclone® 10 GX Devices x
2.2.1. Consider the Memory Block Selection 2.2.2. Guideline: Implement External Conflict Resolution 2.2.3. Guideline: Customize Read-During-Write Behavior 2.2.4. Guideline: Consider Power-Up State and Memory Initialization 2.2.5. Guideline: Control Clocking to Reduce Power Consumption
2.2.3. Guideline: Customize Read-During-Write Behavior x
2.2.3.1. Same-Port Read-During-Write Mode 2.2.3.2. Mixed-Port Read-During-Write Mode
2.4. Embedded Memory Modes x
2.4.1. Embedded Memory Configurations for Single-port Mode 2.4.2. Embedded Memory Configurations for Dual-port Modes
2.5. Embedded Memory Clocking Modes x
2.5.1. Clocking Modes for Each Memory Mode 2.5.2. Asynchronous Clears in Clocking Modes 2.5.3. Output Read Data in Simultaneous Read/Write 2.5.4. Independent Clock Enables in Clocking Modes
2.5.1. Clocking Modes for Each Memory Mode x
2.5.1.1. Single Clock Mode 2.5.1.2. Read/Write Clock Mode 2.5.1.3. Input/Output Clock Mode 2.5.1.4. Independent Clock Mode
2.7. Byte Enable in Embedded Memory Blocks x
2.7.1. Byte Enable Controls in Memory Blocks 2.7.2. Data Byte Output 2.7.3. RAM Blocks Operations
2.11. Memory Blocks Error Correction Code Support x
2.11.1. Error Correction Code Truth Table
3. Variable Precision DSP Blocks in Cyclone® 10 GX Devices x
3.1. Supported Operational Modes in Cyclone® 10 GX Devices 3.2. Resources 3.3. Design Considerations 3.4. Block Architecture 3.5. Operational Mode Descriptions 3.6. Variable Precision DSP Blocks in Cyclone® 10 GX Devices Revision History
3.1. Supported Operational Modes in Cyclone® 10 GX Devices x
3.1.1. Features
3.3. Design Considerations x
3.3.1. Operational Modes 3.3.2. Internal Coefficient and Pre-Adder for Fixed-Point Arithmetic 3.3.3. Accumulator for Fixed-Point Arithmetic 3.3.4. Chainout Adder 3.3.5. DSP Block Cascade Limit in Agilex™ 7 Devices
3.3.4. Chainout Adder x
3.3.4.1. Resources
3.4. Block Architecture x
3.4.1. Input Register Bank 3.4.2. Pipeline Register 3.4.3. Pre-Adder for Fixed-Point Arithmetic 3.4.4. Internal Coefficient for Fixed-Point Arithmetic 3.4.5. Multipliers 3.4.6. Adder 3.4.7. Accumulator and Chainout Adder for Fixed-Point Arithmetic 3.4.8. Systolic Registers for Fixed-Point Arithmetic 3.4.9. Double Accumulation Register for Fixed-Point Arithmetic 3.4.10. Output Register Bank
3.4.1. Input Register Bank x
3.4.1.1. Two Sets of Delay Registers for Fixed-Point Arithmetic
3.5. Operational Mode Descriptions x
3.5.1. Operational Modes for Fixed-Point Arithmetic 3.5.2. Operational Modes for Floating-Point Arithmetic
3.5.1. Operational Modes for Fixed-Point Arithmetic x
3.5.1.1. Independent Multiplier Mode 3.5.1.2. Independent Complex Multiplier 3.5.1.3. Multiplier Adder Sum Mode 3.5.1.4. 18 x 19 Multiplication Summed with 36-Bit Input Mode 3.5.1.5. Systolic FIR Mode
3.5.1.1. Independent Multiplier Mode x
3.5.1.1.1. 18 x 18 or 18 x 19 Independent Multiplier 3.5.1.1.2. 27 x 27 Independent Multiplier
3.5.1.2. Independent Complex Multiplier x
3.5.1.2.1. 18 x 19 Complex Multiplier
3.5.1.5. Systolic FIR Mode x
3.5.1.5.1. Mapping Systolic Mode User View to Variable Precision Block Architecture View 3.5.1.5.2. 18-Bit Systolic FIR Mode 3.5.1.5.3. 27-Bit Systolic FIR Mode
3.5.2. Operational Modes for Floating-Point Arithmetic x
3.5.2.1. Single Floating-Point Arithmetic Functions 3.5.2.2. Multiple Floating-Point Arithmetic Functions
3.5.2.1. Single Floating-Point Arithmetic Functions x
3.5.2.1.1. Multiplication Mode 3.5.2.1.2. Adder or Subtract Mode 3.5.2.1.3. Multiply Accumulate Mode
3.5.2.2. Multiple Floating-Point Arithmetic Functions x
3.5.2.2.1. Multiply-Add or Multiply-Subtract Mode 3.5.2.2.2. Vector One Mode 3.5.2.2.3. Vector Two Mode 3.5.2.2.4. Direct Vector Dot Product 3.5.2.2.5. Complex Multiplication
4. Clock Networks and PLLs in Cyclone® 10 GX Devices x
4.1. Clock Networks 4.2. Cyclone® 10 GX PLLs 4.3. Clock Networks and PLLs in Cyclone® 10 GX Devices Revision History
4.1. Clock Networks x
4.1.1. Clock Resources in Cyclone® 10 GX Devices 4.1.2. Hierarchical Clock Networks 4.1.3. Types of Clock Networks 4.1.4. Clock Network Sources 4.1.5. Clock Control Block 4.1.6. Clock Power Down 4.1.7. Clock Enable Signals
4.1.3. Types of Clock Networks x
4.1.3.1. Global Clock Networks 4.1.3.2. Regional Clock Networks 4.1.3.3. Periphery Clock Networks
4.1.4. Clock Network Sources x
4.1.4.1. Dedicated Clock Input Pins 4.1.4.2. Internal Logic 4.1.4.3. DPA Outputs 4.1.4.4. HSSI Clock Outputs 4.1.4.5. PLL Clock Outputs
4.1.5. Clock Control Block x
4.1.5.1. Pin Mapping in Cyclone® 10 GX Devices 4.1.5.2. GCLK Control Block 4.1.5.3. RCLK Control Block 4.1.5.4. PCLK Control Block
4.2. Cyclone® 10 GX PLLs x
4.2.1. PLL Usage 4.2.2. PLL Architecture 4.2.3. PLL Control Signals 4.2.4. Clock Feedback Modes 4.2.5. Clock Multiplication and Division 4.2.6. Programmable Phase Shift 4.2.7. Programmable Duty Cycle 4.2.8. PLL Cascading 4.2.9. Reference Clock Sources 4.2.10. Clock Switchover 4.2.11. PLL Reconfiguration and Dynamic Phase Shift
4.2.3. PLL Control Signals x
4.2.3.1. Reset 4.2.3.2. Locked
4.2.10. Clock Switchover x
4.2.10.1. Automatic Switchover 4.2.10.2. Automatic Switchover with Manual Override 4.2.10.3. Manual Clock Switchover 4.2.10.4. Guidelines
5. I/O and High Speed I/O in Cyclone® 10 GX Devices x
5.1. I/O and Differential I/O Buffers in Cyclone® 10 GX Devices 5.2. I/O Standards and Voltage Levels in Cyclone® 10 GX Devices 5.3. Altera FPGA I/O IP Cores for Cyclone® 10 GX Devices 5.4. I/O Resources in Cyclone® 10 GX Devices 5.5. Architecture and General Features of I/Os in Cyclone® 10 GX Devices 5.6. High Speed Source-Synchronous SERDES and DPA in Cyclone® 10 GX Devices 5.7. Using the I/Os and High Speed I/Os in Cyclone® 10 GX Devices 5.8. I/O and High Speed I/O in Cyclone® 10 GX Devices Revision History
5.2. I/O Standards and Voltage Levels in Cyclone® 10 GX Devices x
5.2.1. I/O Standards Support in Cyclone® 10 GX Devices 5.2.2. I/O Standards Voltage Levels in Cyclone® 10 GX Devices
5.4. I/O Resources in Cyclone® 10 GX Devices x
5.4.1. GPIO Banks, SERDES, and DPA Locations in Cyclone® 10 GX Devices 5.4.2. FPGA I/O Resources in Cyclone® 10 GX Packages 5.4.3. I/O Banks Groups in Cyclone® 10 GX Devices 5.4.4. I/O Vertical Migration for Cyclone® 10 GX Devices
5.4.4. I/O Vertical Migration for Cyclone® 10 GX Devices x
5.4.4.1. Verifying Pin Migration Compatibility
5.5. Architecture and General Features of I/Os in Cyclone® 10 GX Devices x
5.5.1. I/O Element Structure in Cyclone® 10 GX Devices 5.5.2. Features of I/O Pins in Cyclone® 10 GX Devices 5.5.3. Programmable IOE Features in Cyclone® 10 GX Devices 5.5.4. On-Chip I/O Termination in Cyclone® 10 GX Devices 5.5.5. External I/O Termination for Cyclone® 10 GX Devices
5.5.1. I/O Element Structure in Cyclone® 10 GX Devices x
5.5.1.1. I/O Bank Architecture in Cyclone® 10 GX Devices 5.5.1.2. I/O Buffer and Registers in Cyclone® 10 GX Devices
5.5.2. Features of I/O Pins in Cyclone® 10 GX Devices x
5.5.2.1. Open-Drain Output 5.5.2.2. Bus-Hold Circuitry 5.5.2.3. Weak Pull-up Resistor
5.5.3. Programmable IOE Features in Cyclone® 10 GX Devices x
5.5.3.1. Programmable Current Strength 5.5.3.2. Programmable Output Slew Rate Control 5.5.3.3. Programmable IOE Delay 5.5.3.4. Programmable Open-Drain Output 5.5.3.5. Programmable Pre-Emphasis 5.5.3.6. Programmable Differential Output Voltage
5.5.4. On-Chip I/O Termination in Cyclone® 10 GX Devices x
5.5.4.1. RS OCT without Calibration in Cyclone® 10 GX Devices 5.5.4.2. RS OCT with Calibration in Cyclone® 10 GX Devices 5.5.4.3. RT OCT with Calibration in Cyclone® 10 GX Devices 5.5.4.4. Dynamic OCT 5.5.4.5. Differential Input RD OCT 5.5.4.6. OCT Calibration Block in Cyclone® 10 GX Devices
5.5.5. External I/O Termination for Cyclone® 10 GX Devices x
5.5.5.1. Single-Ended I/O Termination 5.5.5.2. Differential I/O Termination for Cyclone® 10 GX Devices
5.5.5.2. Differential I/O Termination for Cyclone® 10 GX Devices x
5.5.5.2.1. Differential HSTL, SSTL, HSUL, and POD Termination 5.5.5.2.2. LVDS, RSDS, and Mini-LVDS Termination 5.5.5.2.3. LVPECL Termination
5.6. High Speed Source-Synchronous SERDES and DPA in Cyclone® 10 GX Devices x
5.6.1. Cyclone® 10 GX LVDS SERDES Usage Modes 5.6.2. SERDES Circuitry 5.6.3. SERDES I/O Standards Support in Cyclone® 10 GX Devices 5.6.4. Differential Transmitter in Cyclone® 10 GX Devices 5.6.5. Differential Receiver in Cyclone® 10 GX Devices 5.6.6. PLLs and Clocking for Cyclone® 10 GX Devices 5.6.7. Timing and Optimization for Cyclone® 10 GX Devices
5.6.4. Differential Transmitter in Cyclone® 10 GX Devices x
5.6.4.1. Transmitter Blocks in Cyclone® 10 GX Devices 5.6.4.2. Serializer Bypass for DDR and SDR Operations
5.6.5. Differential Receiver in Cyclone® 10 GX Devices x
5.6.5.1. Receiver Blocks in Cyclone® 10 GX Devices 5.6.5.2. Receiver Modes in Cyclone® 10 GX Devices
5.6.5.1. Receiver Blocks in Cyclone® 10 GX Devices x
5.6.5.1.1. DPA Block 5.6.5.1.2. Synchronizer 5.6.5.1.3. Data Realignment Block (Bit Slip) 5.6.5.1.4. Deserializer
5.6.5.2. Receiver Modes in Cyclone® 10 GX Devices x
5.6.5.2.1. Non-DPA Mode 5.6.5.2.2. DPA Mode 5.6.5.2.3. Soft-CDR Mode
5.6.6. PLLs and Clocking for Cyclone® 10 GX Devices x
5.6.6.1. Clocking Differential Transmitters 5.6.6.2. Clocking Differential Receivers 5.6.6.3. Guideline: LVDS Reference Clock Source 5.6.6.4. Guideline: Use PLLs in Integer PLL Mode for LVDS 5.6.6.5. Guideline: Use High-Speed Clock from PLL to Clock LVDS SERDES Only 5.6.6.6. Guideline: Pin Placement for Differential Channels 5.6.6.7. LVDS Interface with External PLL Mode
5.6.6.2. Clocking Differential Receivers x
5.6.6.2.1. Guideline: Clocking DPA Interfaces Spanning Multiple I/O Banks 5.6.6.2.2. Guideline: I/O PLL Reference Clock Source for DPA or Non-DPA Receiver
5.6.6.7. LVDS Interface with External PLL Mode x
5.6.6.7.1. IOPLL IP Signal Interface with LVDS SERDES IP 5.6.6.7.2. IOPLL Parameter Values for External PLL Mode 5.6.6.7.3. Connection between IOPLL and LVDS SERDES in External PLL Mode
5.6.7. Timing and Optimization for Cyclone® 10 GX Devices x
5.6.7.1. Source-Synchronous Timing Budget
5.6.7.1. Source-Synchronous Timing Budget x
5.6.7.1.1. Differential Data Orientation 5.6.7.1.2. Differential I/O Bit Position 5.6.7.1.3. Transmitter Channel-to-Channel Skew 5.6.7.1.4. Receiver Skew Margin for Non-DPA Mode
5.7. Using the I/Os and High Speed I/Os in Cyclone® 10 GX Devices x
5.7.1. I/O and High-Speed I/O General Guidelines for Cyclone® 10 GX Devices 5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards 5.7.3. Guideline: Maximum Current Driving I/O Pins While Turned Off and During Power Sequencing 5.7.4. Guideline: Maximum DC Current Restrictions 5.7.5. Guideline: LVDS SERDES IP Core Instantiation 5.7.6. Guideline: LVDS SERDES Pin Pairs for Soft-CDR Mode 5.7.7. Guideline: Minimizing High Jitter Impact on Cyclone® 10 GX GPIO Performance 5.7.8. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
5.7.1. I/O and High-Speed I/O General Guidelines for Cyclone® 10 GX Devices x
5.7.1.1. Guideline: VREF Sources and VREF Pins 5.7.1.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing 5.7.1.3. Guideline: I/O Standards Supported for I/O PLL Reference Clock Input Pin
5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards x
5.7.2.1. Non-Voltage-Referenced I/O Standards 5.7.2.2. Voltage-Referenced I/O Standards 5.7.2.3. Mixing Voltage-Referenced and Non-Voltage Referenced I/O Standards
6. External Memory Interfaces in Cyclone® 10 GX Devices x
6.1. Key Features of the Cyclone® 10 GX External Memory Interface Solution 6.2. Memory Standards Supported by Cyclone® 10 GX Devices 6.3. External Memory Interface Widths in Cyclone® 10 GX Devices 6.4. External Memory Interface I/O Pins in Cyclone® 10 GX Devices 6.5. Memory Interfaces Support in Cyclone® 10 GX Device Packages 6.6. External Memory Interface IP Support in Cyclone® 10 GX Devices 6.7. External Memory Interface Architecture of Cyclone® 10 GX Devices 6.8. External Memory Interfaces in Cyclone® 10 GX Devices Revision History
6.4. External Memory Interface I/O Pins in Cyclone® 10 GX Devices x
6.4.1. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
6.5. Memory Interfaces Support in Cyclone® 10 GX Device Packages x
6.5.1. Cyclone® 10 GX Package Support for DDR3/DDR3L x40 with ECC or LPDDR3 x32 without ECC 6.5.2. Cyclone® 10 GX Package Support for DDR3/DDR3L ×72 with ECC Single and Dual-Rank
6.6. External Memory Interface IP Support in Cyclone® 10 GX Devices x
6.6.1. Ping Pong PHY IP
6.7. External Memory Interface Architecture of Cyclone® 10 GX Devices x
6.7.1. I/O Bank 6.7.2. I/O AUX
6.7.1. I/O Bank x
6.7.1.1. Hard Memory Controller 6.7.1.2. Delay-Locked Loop 6.7.1.3. Sequencer 6.7.1.4. Clock Tree 6.7.1.5. I/O Lane
6.7.1.1. Hard Memory Controller x
6.7.1.1.1. Hard Memory Controller Features 6.7.1.1.2. Main Control Path 6.7.1.1.3. Data Buffer Controller
6.7.1.5. I/O Lane x
6.7.1.5.1. DQS Logic Block
7. Configuration, Design Security, and Remote System Upgrades in Cyclone® 10 GX Devices x
7.1. Enhanced Configuration and Configuration via Protocol 7.2. Configuration Schemes 7.3. Configuration Details 7.4. Remote System Upgrades Using Active Serial Scheme 7.5. Design Security 7.6. Configuration, Design Security, and Remote System Upgrades in Cyclone® 10 GX Devices Revision History
7.2. Configuration Schemes x
7.2.1. Active Serial Configuration 7.2.2. Passive Serial Configuration 7.2.3. Fast Passive Parallel Configuration 7.2.4. JTAG Configuration
7.2.1. Active Serial Configuration x
7.2.1.1. DATA Clock (DCLK) 7.2.1.2. Active Serial Single-Device Configuration 7.2.1.3. Active Serial Multi-Device Configuration 7.2.1.4. Active Serial Configuration with Multiple EPCQ-L Devices 7.2.1.5. Using EPCQ-L Devices
7.2.1.3. Active Serial Multi-Device Configuration x
7.2.1.3.1. Pin Connections and Guidelines 7.2.1.3.2. Using Multiple Configuration Data
7.2.1.5. Using EPCQ-L Devices x
7.2.1.5.1. Controlling EPCQ-L Devices 7.2.1.5.2. Trace Length Guideline 7.2.1.5.3. Programming EPCQ-L Devices
7.2.2. Passive Serial Configuration x
7.2.2.1. Passive Serial Single-Device Configuration Using an External Host 7.2.2.2. Passive Serial Single-Device Configuration Using an Intel FPGA Download Cable 7.2.2.3. Passive Serial Multi-Device Configuration
7.2.2.3. Passive Serial Multi-Device Configuration x
7.2.2.3.1. Pin Connections and Guidelines 7.2.2.3.2. Using Multiple Configuration Data 7.2.2.3.3. Using One Configuration Data 7.2.2.3.4. Using PC Host and Download Cable
7.2.3. Fast Passive Parallel Configuration x
7.2.3.1. Fast Passive Parallel Single-Device Configuration 7.2.3.2. Fast Passive Parallel Multi-Device Configuration
7.2.3.2. Fast Passive Parallel Multi-Device Configuration x
7.2.3.2.1. Pin Connections and Guidelines 7.2.3.2.2. Using Multiple Configuration Data 7.2.3.2.3. Using One Configuration Data
7.2.4. JTAG Configuration x
7.2.4.1. JTAG Single-Device Configuration 7.2.4.2. JTAG Multi-Device Configuration
7.2.4.2. JTAG Multi-Device Configuration x
7.2.4.2.1. Pin Connections and Guidelines 7.2.4.2.2. Using a Download Cable
7.3. Configuration Details x
7.3.1. MSEL Pin Settings 7.3.2. CLKUSR 7.3.3. Configuration Sequence 7.3.4. Configuration Timing Waveforms 7.3.5. Estimating Configuration Time 7.3.6. Device Configuration Pins 7.3.7. Configuration Data Compression
7.3.3. Configuration Sequence x
7.3.3.1. Power Up 7.3.3.2. Reset 7.3.3.3. Configuration 7.3.3.4. Configuration Error Handling 7.3.3.5. Initialization 7.3.3.6. User Mode
7.3.3.3. Configuration x
7.3.3.3.1. Configuration Error Detection
7.3.4. Configuration Timing Waveforms x
7.3.4.1. FPP Configuration Timing 7.3.4.2. AS Configuration Timing 7.3.4.3. PS Configuration Timing
7.3.6. Device Configuration Pins x
7.3.6.1. I/O Standards and Drive Strength for Configuration Pins 7.3.6.2. Configuration Pin Options in the Quartus® Prime Pro Edition Software
7.3.7. Configuration Data Compression x
7.3.7.1. Enabling Compression Before Design Compilation 7.3.7.2. Enabling Compression After Design Compilation 7.3.7.3. Using Compression in Multi-Device Configuration
7.4. Remote System Upgrades Using Active Serial Scheme x
7.4.1. Configuration Images 7.4.2. Configuration Sequence in the Remote Update Mode 7.4.3. Remote System Upgrade Circuitry 7.4.4. Enabling Remote System Upgrade Circuitry 7.4.5. Remote System Upgrade Registers 7.4.6. Remote System Upgrade State Machine 7.4.7. User Watchdog Timer
7.4.5. Remote System Upgrade Registers x
7.4.5.1. Control Register 7.4.5.2. Status Register
7.5. Design Security x
7.5.1. Security Key Types 7.5.2. Security Modes 7.5.3. Cyclone® 10 GX Qcrypt Security Tool 7.5.4. Design Security Implementation Steps
7.5.2. Security Modes x
7.5.2.1. JTAG Secure Mode
8. SEU Mitigation for Cyclone® 10 GX Devices x
8.1. Mitigating Single Event Upset 8.2. Cyclone® 10 GX SEU Mitigation Techniques 8.3. CRAM Error Detection Settings Reference 8.4. Specifications 8.5. SEU Mitigation for Cyclone® 10 GX Devices Revision History
8.1. Mitigating Single Event Upset x
8.1.1. Configuration RAM 8.1.2. Embedded Memory 8.1.3. Failure Rates
8.2. Cyclone® 10 GX SEU Mitigation Techniques x
8.2.1. Mitigating SEU Effects in Configuration RAM 8.2.2. Mitigating SEU Effects in Embedded User RAM 8.2.3. Triple-Module Redundancy 8.2.4. Quartus® Prime Pro Edition Software SEU FIT Reports
8.2.1. Mitigating SEU Effects in Configuration RAM x
8.2.1.1. Error Detection Cyclic Redundancy Check 8.2.1.2. SEU Sensitivity Processing 8.2.1.3. Hierarchy Tagging 8.2.1.4. Evaluating Your System’s Response to Functional Upsets 8.2.1.5. Recovering from CRC Errors
8.2.1.1. Error Detection Cyclic Redundancy Check x
8.2.1.1.1. Column-Based and Frame-Based Check-Bits 8.2.1.1.2. Error Message Register 8.2.1.1.3. CRC_ERROR Pin Behavior
8.2.1.5. Recovering from CRC Errors x
8.2.1.5.1. Enabling Error Correction (Internal Scrubbing)
8.2.2. Mitigating SEU Effects in Embedded User RAM x
8.2.2.1. Configuring RAM to Enable ECC
8.2.4. Quartus® Prime Pro Edition Software SEU FIT Reports x
8.2.4.1. SEU FIT Parameters Report 8.2.4.2. Projected SEU FIT by Component Usage Report 8.2.4.3. Enabling the Projected SEU FIT by Component Usage Report
8.2.4.2. Projected SEU FIT by Component Usage Report x
8.2.4.2.1. Component FIT Rates 8.2.4.2.2. Raw FIT 8.2.4.2.3. Utilized FIT 8.2.4.2.4. Mitigated FIT 8.2.4.2.5. Architectural Vulnerability Factor
8.4. Specifications x
8.4.1. Error Detection Frequency 8.4.2. Error Detection Time 8.4.3. EMR Update Interval 8.4.4. Error Correction Time
9. JTAG Boundary-Scan Testing in Cyclone® 10 GX Devices x
9.1. BST Operation Control 9.2. I/O Voltage for JTAG Operation 9.3. Performing BST 9.4. Enabling and Disabling IEEE Std. 1149.1 BST Circuitry 9.5. Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing 9.6. IEEE Std. 1149.1 Boundary-Scan Register 9.7. IEEE Std. 1149.6 Boundary-Scan Register 9.8. JTAG Boundary-Scan Testing in Cyclone® 10 GX Devices Revision History
9.1. BST Operation Control x
9.1.1. IDCODE 9.1.2. Supported JTAG Instruction 9.1.3. JTAG Secure Mode 9.1.4. JTAG Private Instruction
9.6. IEEE Std. 1149.1 Boundary-Scan Register x
9.6.1. Boundary-Scan Cells of a Cyclone® 10 GX Device I/O Pin
10. Power Management in Cyclone® 10 GX Devices x
10.1. Power Consumption 10.2. Programmable Power Technology 10.3. Power Sense Line 10.4. Voltage Sensor 10.5. Temperature Sensing Diode 10.6. Power-On Reset Circuitry 10.7. Power Sequencing Considerations for Cyclone® 10 GX Devices 10.8. Power Supply Design 10.9. Power Management in Cyclone® 10 GX Devices Revision History
10.1. Power Consumption x
10.1.1. Dynamic Power Equation
10.4. Voltage Sensor x
10.4.1. Input Signal Range for External Analog Signal 10.4.2. Using Voltage Sensor in Cyclone® 10 GX Devices
10.4.1. Input Signal Range for External Analog Signal x
10.4.1.1. Unipolar Input Mode
10.4.2. Using Voltage Sensor in Cyclone® 10 GX Devices x
10.4.2.1. Accessing the Voltage Sensor Using FPGA Core Access 10.4.2.2. Voltage Sensor Transfer Function
10.4.2.1. Accessing the Voltage Sensor Using FPGA Core Access x
10.4.2.1.1. Configuration Registers for the Core Access Mode 10.4.2.1.2. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is not Equal to 2'b11 10.4.2.1.3. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is Equal to 2'b11
10.5. Temperature Sensing Diode x
10.5.1. Internal Temperature Sensing Diode 10.5.2. External Temperature Sensing Diode
10.5.1. Internal Temperature Sensing Diode x
10.5.1.1. Transfer Function for Internal TSD
10.6. Power-On Reset Circuitry x
10.6.1. Power Supplies Monitored and Not Monitored by the POR Circuitry
10.7. Power Sequencing Considerations for Cyclone® 10 GX Devices x
10.7.1. Power-Up Sequence Requirements for Cyclone® 10 GX Devices 10.7.2. Power-Down Sequence Recommendations and Requirements for Cyclone® 10 GX Devices
1. Logic Array Blocks and Adaptive Logic Modules in Cyclone® 10 GX Devices
2. Embedded Memory Blocks in Cyclone® 10 GX Devices
3. Variable Precision DSP Blocks in Cyclone® 10 GX Devices
4. Clock Networks and PLLs in Cyclone® 10 GX Devices
5. I/O and High Speed I/O in Cyclone® 10 GX Devices
6. External Memory Interfaces in Cyclone® 10 GX Devices
7. Configuration, Design Security, and Remote System Upgrades in Cyclone® 10 GX Devices
8. SEU Mitigation for Cyclone® 10 GX Devices
9. JTAG Boundary-Scan Testing in Cyclone® 10 GX Devices
10. Power Management in Cyclone® 10 GX Devices

10.5.2. External Temperature Sensing Diode

The Cyclone® 10 GX external TSD requires two pins for voltage reference. The following figure shows how to connect the external TSD with an external temperature sensor device to allow external sensing of the Cyclone® 10 GX die temperature.

Figure 180. TSD External Pin Connections


The TSD is a very sensitive circuit that can be influenced by noise coupled from other traces on the board or within the device package itself, depending on your device usage. The interfacing signal from the Cyclone® 10 GX device to the external temperature sensor is based on millivolts (mV) of difference, as seen at the external TSD pins. Switching the I/O near the TSD pins can affect the temperature reading. Altera recommends taking temperature readings during periods of inactivity in the device or use the internal TSD with built-in ADC circuitry.

The following are board connection guidelines for the TSD external pin connections:

  • The maximum trace lengths for the TEMPDIODEP /TEMPDIODEN traces must be less than eight inches.
  • Route both traces in parallel and place them close to each other with grounded guard tracks on each side.
  • Altera recommends 10-mils width and space for both traces.
  • Route traces through a minimum number of vias and crossunders to minimize the thermocouple effects.
  • Ensure that the number of vias are the same on both traces.
  • Ensure both traces are approximately the same length.
  • Avoid coupling with toggling signals (for example, clocks and I/O) by having the GND plane between the diode traces and the high frequency signals.
  • For high-frequency noise filtering, place an external capacitor (close to the external chip) between the TEMPDIODEP /TEMPDIODEN trace. For Maxim devices, use an external capacitor between 2200 pF and 3300 pF.
  • Place a 0.1 uF bypass capacitor close to the external device.
  • You can use the internal TSD with built-in ADC circuitry and external TSD at the same time.
  • If you only use internal ADC circuitry, the external TSD pins (TEMPDIODEP /TEMPDIODEN ) can be connected to GND because the external TSD pins are not used.

For details about device specification and connection guidelines, refer to the external temperature sensor device datasheet from the device manufacturer.

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