Visible to Intel only — GUID: joc1463507850257
Ixiasoft
Intel® Stratix® 10 Devices and Transceiver Channels
PCB Stackup Selection Guideline
Recommendations for High Speed Signal PCB Routing
FPGA Fan-out Region Design
CFP2/CFP4 Connector Board Layout Design Guideline
QSFP+/zSFP/QSFP28 Connector Board Layout Design Guideline
SMA 2.4-mm Layout Design Guideline
Tyco/Amphenol Interlaken Connector Design Guideline
Electrical Specifications
Document Revision History for AN 766: Intel® Stratix® 10 Devices, High Speed Signal Interface Layout Design Guideline
Option 1: Via-In-Pad Topology
Option 2: Dog-bone with GND Cutout at BGA Pad Topology
Option 3: Micro-via Topology
GND Cutout Under BGA Pads in Fan-out Configuration
Comparison of Dog-bone with GND Cutout Under the BGA and Via-in-Pad Configurations
Trace Shape Routing at the BGA Void Area (Tear Drop Configuration)
Visible to Intel only — GUID: joc1463507850257
Ixiasoft
SMA 2.4 mm Molex® Connector Assembly
Figures below show the structure of SMA/Interface 2.4 mm (MOLEX_73387) for two different versions (A and B). The operating frequency from DC is up to 50 GHz, which is within the range of 28 Gbps applications.
Figure 87. Version-A Molex 2.4 mm SMA connector
Figure 88. Version-B Molex 2.4 mm SMA connector