Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

ID 814008
Date 4/01/2024
Public
Document Table of Contents

2. Agilex™ 5 FPGA Mechanical Construction

Intel Agilex 5 FPGAs are lidless square BGA devices and are offered in various sizes. The leadless pins can be placed anywhere with various pitch, where the minimum pitch is 0.65 mm. The following figure shows the mechanical drawing for the Agilex™ 5 FPGA, part number A5ED0655B32A.

Figure 1.  Agilex™ 5 FPGA, A5ED0655B32A

Be aware that there are capacitors on top of the substrate and therefore there are keep-out zones that you should observe to avoid any physical interference for general system packaging and cooling solutions. (Refer to Appendix A for Agilex™ 5 product keys and mapping to available package drawings.