Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

ID 814008
Date 4/01/2024
Public
Document Table of Contents

1.1. Definitions of Thermal and Power Terms Used in this Document

The following table defines terminology used in this document.
Table 1.  Thermal and Power Terminology Used in this Document
Term Description
CFD Computational fluid dynamic. A numerical analysis method for solving conjugated heat transfer problems.
CTM Compact thermal model. A geometric model used as an input to a CFD tool.
DTS Digital thermal sensor.
FAE Field application engineer.
IHS Integrated heat spreader. The top case of an FPGA.
PTC The Intel FPGA Power and Thermal Calculator.
TCASE Temperature at the center of the integrated heat spreader (IHS) or at the FPGA exposed die.
TTP The total power dissipation of the device. This includes static power, with static power savings subtracted. The PTC reports this value in the Power Summary window.
TDP Thermal design power. The power dissipated in a die used for thermal analysis purposes.
TA Ambient temperature, measured locally in teh area surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink.
TCORE Core fabric die temperature.
TJ Junction temperature.
TJ-MAX Maximum junction temperature. A maximum allowable absolute temperature rating of the device or a targeted value.
TIM Thermal interface material.
TSD Temperature sensor diode.
VID Voltage identification code.