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1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings
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1.1. Definitions of Thermal and Power Terms Used in this Document
The following table defines terminology used in this document.
Term | Description |
---|---|
CFD | Computational fluid dynamic. A numerical analysis method for solving conjugated heat transfer problems. |
CTM | Compact thermal model. A geometric model used as an input to a CFD tool. |
DTS | Digital thermal sensor. |
FAE | Field application engineer. |
IHS | Integrated heat spreader. The top case of an FPGA. |
PTC | The Intel FPGA Power and Thermal Calculator. |
TCASE | Temperature at the center of the integrated heat spreader (IHS) or at the FPGA exposed die. |
TTP | The total power dissipation of the device. This includes static power, with static power savings subtracted. The PTC reports this value in the Power Summary window. |
TDP | Thermal design power. The power dissipated in a die used for thermal analysis purposes. |
TA | Ambient temperature, measured locally in teh area surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink. |
TCORE | Core fabric die temperature. |
TJ | Junction temperature. |
TJ-MAX | Maximum junction temperature. A maximum allowable absolute temperature rating of the device or a targeted value. |
TIM | Thermal interface material. |
TSD | Temperature sensor diode. |
VID | Voltage identification code. |