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1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings
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7.2. Thermal Interface Material (TIM)
Intel does not recommend a specific thermal interface material (TIM). The choice of TIM depends on multiple factors, including the TIM's performance, performance over lifetime, cost, ease of application, and reworkability.
Depending on the type of TIM used, the manufacturer may specify different application criteria. As a general rule, TIMs with high conductivity and low bond-line thickness perform the best.