Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

ID 814008
Date 4/01/2024
Public
Document Table of Contents

7.2. Thermal Interface Material (TIM)

Intel does not recommend a specific thermal interface material (TIM). The choice of TIM depends on multiple factors, including the TIM's performance, performance over lifetime, cost, ease of application, and reworkability.

Depending on the type of TIM used, the manufacturer may specify different application criteria. As a general rule, TIMs with high conductivity and low bond-line thickness perform the best.