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2.1. Built-in Temperature Sensors
- Digital thermal sensors (dts) have no physical connection to device pins, and you must read their output values using temperature sensing software.
- Thermal diode sensors (tds) have physical connections to the pins on the FPGA. To these pins you must connect an external temperature-reading device, such as the Maxim Integrated™ Max6581, Max 31730, or Texas Instrument™ TMP468 to read the temperatures.
Both digital thermal sensors and thermal diode sensors report the temperature of their physical location on the die, which may or may not be the hottest location on the die. For this reason, the temperature of these sensors is usually less than the maximum junction temperature settings in the PTC.
For more information on temperature sensors, refer to the Sensors section in chapter 4 of: Device Design Guidelines: Agilex™ 5 FPGAs and SoCs .
Thermal diode sensors cannot be calibrated at the factory, and should be calibrated by you for each circuit board design. The choice of the external reader and the board circuitry impacts the accuracy of the results. For further details on calibration of these sensors refer to:
AN 769: Intel FPGA Remote Temperature Sensing Diode Implementation Guide.
The following table shows the number, type, and accuracy for the sensors for Agilex™ 5 devices. Note the accuracy changes at various temperature ranges, indicated in the table.
Die | Number of Pinned-out Thermal Diode* Sensors | Number of Digital thermal Sensors | Digital Thermal Sensor Accuracy | |
---|---|---|---|---|
90-–100⁰ C | -40-–90⁰ C | |||
Agilex™ 5 FPGA fabric core die | 2 | 4–12 | +/- 3⁰ C | +/- 5⁰ C |
* You should calibrate the thermal diode sensor for your design. |