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1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings
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7.1. Attachment Force
The maximum attachment force depends on the number of pins in the package and the solder material.
For more information about heat sink attachment force, refer to the following article:
What is the maximum downward pressure that can be applied to the top of Intel FPGA BGA packages?
When attaching heat sinks, always use care to apply forces evenly to avoid cracking the die.