Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

ID 814008
Date 4/01/2024
Public
Document Table of Contents

7.1. Attachment Force

The maximum attachment force depends on the number of pins in the package and the solder material.

For more information about heat sink attachment force, refer to the following article:

What is the maximum downward pressure that can be applied to the top of Intel FPGA BGA packages?

When attaching heat sinks, always use care to apply forces evenly to avoid cracking the die.