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1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings
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5.1.1. FPGA Maximum Allowed Power Dissipation
FPGAs are not generally rated for any thermal design power (TDP). The maximum power dissipation generally depends on the number of power pins and the maximum rated current for each pin.
Maximum current values are based on reliability values for operation at 100⁰ C junction temperature. At lower temperatures, it is possible to run at higher powers than the maximum, or if the lifetime of the application can be reduced. You should refer such requests to your Intel Field Application Engineer for further analysis.