Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

ID 814008
Date 4/01/2024
Public
Document Table of Contents

5.1.1. FPGA Maximum Allowed Power Dissipation

FPGAs are not generally rated for any thermal design power (TDP). The maximum power dissipation generally depends on the number of power pins and the maximum rated current for each pin.

Maximum current values are based on reliability values for operation at 100⁰ C junction temperature. At lower temperatures, it is possible to run at higher powers than the maximum, or if the lifetime of the application can be reduced. You should refer such requests to your Intel Field Application Engineer for further analysis.