Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

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ID 814008
Date 4/01/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines 2. Agilex™ 5 FPGA Mechanical Construction 3. Agilex™ 5 FPGA CTM Construction 4. Power and Thermal Calculator (PTC) 5. General FPGA Thermal Design Considerations 6. Design Examples 7. Heat Sinks 8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs A. Agilex™ 5 FPGA Product Keys and Package Drawings
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines x
1.1. Definitions of Thermal and Power Terms Used in this Document
2. Agilex™ 5 FPGA Mechanical Construction x
2.1. Built-in Temperature Sensors
2.1. Built-in Temperature Sensors x
2.1.1. Agilex™ 5 FPGA Temperature Rating
3. Agilex™ 5 FPGA CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. CTM Top Temperature, TCASE Virtual Sensor 3.4. Obtaining the CTM
4. Power and Thermal Calculator (PTC) x
4.1. PTC Thermal Tab Parameters 4.2. Thermal Analysis with the PTC 4.3. PTC Thermal Tab Calculation Options 4.4. Thermal Resistances and Low Power Devices 4.5. Sensor Temperatures on the PTC Thermal Tab
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations
5.1. FPGA Power Considerations x
5.1.1. FPGA Maximum Allowed Power Dissipation 5.1.2. Static, Dynamic, and Standby Power
5.1.2. Static, Dynamic, and Standby Power x
5.1.2.1. Future-Proofing an FPGA Thermal Design
6. Design Examples x
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode 6.2. Example 2: Solution with Temperature-Dependent Power 6.3. Example 3: Known Cooling Capacity 6.4. Example 4: Heat Sink Selection
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode x
6.1.1. CFD Results
7. Heat Sinks x
7.1. Attachment Force 7.2. Thermal Interface Material (TIM)
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings

A. Agilex™ 5 FPGA Product Keys and Package Drawings

Agilex™ 5 package drawings are based on the die and package codes shown in the product key, as illustrated by the figure below.

Figure 11.  Agilex™ 5 Product Key

The table below shows a mapping from the product package code to the available package drawings at the time of publishing this document.

Table 5.  List of Package Drawings
Product Die Density, KLE Package Size Package Code Drawing Number
Agilex™ 5 E 052, 065 32x32 B32A N26883
052, 065 23x23 B23A N18821
008, 013 23x23 B23A N27560
008, 013, 32x32 B32A N33286
008, 013 23x23 B23A N36049
013 16x16 M16A N32800

Figure 12. PMD for B32A

Figure 13. Package Drawing for B23A

Figure 14. Package Drawing for B32A

Figure 15. Package Drawing for B23B

Figure 16. Package Drawing for B32A

Figure 17. Package drawing for B23A

Figure 18. Package Drawing for MA16A

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